Patents by Inventor Li-Yin Chen
Li-Yin Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Patent number: 11955553Abstract: Embodiments disclosed herein relate to using an implantation process and a melting anneal process performed on a nanosecond scale to achieve a high surface concentration (surface pile up) dopant profile and a retrograde dopant profile simultaneously. In an embodiment, a method includes forming a source/drain structure in an active area on a substrate, the source/drain structure including a first region comprising germanium, implanting a first dopant into the first region of the source/drain structure to form an amorphous region in at least the first region of the source/drain structure, implanting a second dopant into the amorphous region containing the first dopant, and heating the source/drain structure to liquidize and convert at least the amorphous region into a crystalline region, the crystalline region containing the first dopant and the second dopant.Type: GrantFiled: February 24, 2023Date of Patent: April 9, 2024Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Su-Hao Liu, Kuo-Ju Chen, Wen-Yen Chen, Ying-Lang Wang, Liang-Yin Chen, Li-Ting Wang, Huicheng Chang
-
Publication number: 20240088225Abstract: A method includes forming a gate stack on a first portion of a semiconductor substrate, removing a second portion of the semiconductor substrate on a side of the gate stack to form a recess, growing a semiconductor region starting from the recess, implanting the semiconductor region with an impurity, and performing a melt anneal on the semiconductor region. At least a portion of the semiconductor region is molten during the melt anneal.Type: ApplicationFiled: November 14, 2023Publication date: March 14, 2024Inventors: Su-Hao Liu, Wen-Yen Chen, Li-Heng Chen, Li-Ting Wang, Liang-Yin Chen, Huicheng Chang, Yee-Chia Yeo, Ying-Lang Wang
-
Publication number: 20240071847Abstract: A semiconductor package including two different adhesives and a method of forming are provided. The semiconductor package may include a package component having a semiconductor die bonded to a substrate, a first adhesive over the substrate, a heat transfer layer on the package component, and a lid attached to the substrate by a second adhesive. The first adhesive may encircle the package component and the heat transfer layer. The lid may include a top portion on the heat transfer layer and the first adhesive, and a bottom portion attached to the substrate and encircling the first adhesive. A material of the second adhesive may be different from a material of the first adhesive.Type: ApplicationFiled: August 26, 2022Publication date: February 29, 2024Inventors: Yi-Huan Liao, Ping-Yin Hsieh, Chih-Hao Chen, Pu Wang, Li-Hui Cheng, Ying-Ching Shih
-
Publication number: 20240074119Abstract: An immersion cooling system includes a pressure seal tank, an electronic apparatus, a pressure balance pipe and a relief valve. The pressure seal tank is configured to store coolant. A vapor space is formed in the pressure seal tank above the liquid level of the coolant. The electronic apparatus is completely immersed in the coolant. The pressure balance pipe has a gas collection length. The first port of the pressure balance pipe is disposed on the top surface of the pressure seal tank. The relief valve is disposed on the second port of the pressure balance pipe. The second port is farther away from the top surface of the pressure seal tank than the first port. The gas collection length of the pressure equalization tube allows the concentration of vaporized coolant at the first port to be greater than the concentration of vaporized coolant at the second port.Type: ApplicationFiled: May 9, 2023Publication date: February 29, 2024Inventors: Ren-Chun CHANG, Wei-Chih LIN, Sheng-Chi WU, Wen-Yin TSAI, Li-Hsiu CHEN
-
Publication number: 20160139300Abstract: A method for producing a low temperature glass phosphor lens includes dry mixing a glass material and fluorescent powder to form a powdery or particulate mixture. The mixture is grinded to a diameter of 15-20 ?m, obtaining uniformly mixed glass fluorescent powder. The glass fluorescent powder is hot pressed into a glass phosphor at a temperature of 500-1000° C. The glass phosphor is grinded and polished into a lens. The fluorescent powder can be a fluorescent material selected from the group consisting of yttrium aluminum garnet, nitride, and silicate. The glass material can be selected from the group consisting of a silicate system, a phosphor system, a borate system, and a tellurate system. The glass phosphor includes characteristics of both of glass and fluorescence. The glass phosphor can keep efficiency under the high heat generated by the chip of an LED.Type: ApplicationFiled: November 14, 2014Publication date: May 19, 2016Inventors: Wood-Hi Cheng, Yung-Peng Chang, Li-Yin Chen, Chun-Chin Tsai, Yi-Chung Huang, Wei-Chih Cheng, Jin-Kai Chang
-
Patent number: 8884866Abstract: An electronic apparatus and a backlight brightness control method thereof are provided. The control method includes the following steps. Detection of an ambient brightness for the electronic apparatus is made to output an ambient brightness signal. Next, whether to adjust the backlight brightness for the display is determined according to a comparison between the ambient brightness signal and a current backlight brightness. If the comparison result indicates that the ambient brightness decrement is lower than a decrement threshold, then an adjustment value is selected from a plurality of step sizes according to the current backlight brightness to decrease the backlight brightness gradually, so that the backlight brightness changes towards a target backlight brightness corresponding to the ambient brightness signal. The step sizes include a first step size and a second step size. The backlight brightness for the display is adjusted according to the current backlight brightness and the adjustment value.Type: GrantFiled: October 12, 2010Date of Patent: November 11, 2014Assignee: HTC CorporationInventors: Li-Yin Chen, Wen-Yueh Su, Chun-Ta Lin, Wei-Feng Chien
-
Patent number: 8773625Abstract: A method of manufacturing a flexible substrate structure includes the following steps. A first loading substrate having a center area and a peripheral area is provided. A first adhesive layer is formed on the center area of the first loading substrate, and a second adhesive layer is formed on the peripheral area of the first loading substrate. The first flexible substrate is adhered to the first loading substrate by the first adhesive layer and the second adhesive layer to form a flexible substrate structure, wherein the adhesive force between the first flexible substrate and the second adhesive layer is stronger than that between the first flexible substrate and the first adhesive layer. The flexible substrate structure is cut, and the first flexible substrate is separated from the flexible substrate structure.Type: GrantFiled: May 23, 2012Date of Patent: July 8, 2014Assignee: AU Optronics Corp.Inventors: Wen-Yuan Li, Pin-Hsiang Chiu, Yu-Chieh Hsueh, Li-Yin Chen, Min-Chih Wei, Shiuan-Iou Lin
-
Patent number: 8525918Abstract: A portable electronic device and an autofocus control method of a camera of the portable electronic device are disclosed. The portable electronic device provides a G-sensor to detect the orientation of the portable electronic device, and provides a storage unit to store autofocus lookup tables for different orientations of the portable electronic device, respectively. According to orientation information from the G-sensor, the central processing unit of the portable electronic device selects one autofocus lookup table from the storage unit and thereby generates an actuating signal for a focus model. The focus model of the portable electronic device is actuated by the actuating signal to adjust an image distance between a lens module and an image sensor of the camera.Type: GrantFiled: April 20, 2011Date of Patent: September 3, 2013Assignee: HTC CorporationInventors: Li-Yin Chen, Chun-Ta Lin, Yi-Tsung Cheng
-
Publication number: 20130077033Abstract: A method of manufacturing a flexible substrate structure includes the following steps. A first loading substrate having a center area and a peripheral area is provided. A first adhesive layer is formed on the center area of the first loading substrate, and a second adhesive layer is formed on the peripheral area of the first loading substrate. The first flexible substrate is adhered to the first loading substrate by the first adhesive layer and the second adhesive layer to form a flexible substrate structure, wherein the adhesive force between the first flexible substrate and the second adhesive layer is stronger than that between the first flexible substrate and the first adhesive layer. The flexible substrate structure is cut, and the first flexible substrate is separated from the flexible substrate structure.Type: ApplicationFiled: May 23, 2012Publication date: March 28, 2013Inventors: Wen-Yuan Li, Pin-Hsiang Chiu, Yu-Chieh Hsueh, Li-Yin Chen, Min-Chih Wei, Shiuan-Iou Lin
-
Publication number: 20120268645Abstract: A portable electronic device and an autofocus control method of a camera of the portable electronic device are disclosed. The portable electronic device provides a G-sensor to detect the orientation of the portable electronic device, and provides a storage unit to store autofocus lookup tables for different orientations of the portable electronic device, respectively. According to orientation information from the G-sensor, the central processing unit of the portable electronic device selects one autofocus lookup table from the storage unit and thereby generates an actuating signal for a focus model. The focus model of the portable electronic device is actuated by the actuating signal to adjust an image distance between a lens module and an image sensor of the camera.Type: ApplicationFiled: April 20, 2011Publication date: October 25, 2012Inventors: Li-Yin CHEN, Chun-Ta Lin, Yi-Tsung Cheng
-
Publication number: 20110134091Abstract: An electronic apparatus and a backlight brightness control method thereof are provided. The control method includes the following steps. Detection of an ambient brightness for the electronic apparatus is made to output an ambient brightness signal. Next, whether to adjust the backlight brightness for the display is determined according to a comparison between the ambient brightness signal and a current backlight brightness. If the comparison result indicates that the ambient brightness decrement is lower than a decrement threshold, then an adjustment value is selected from a plurality of step sizes according to the current backlight brightness to decrease the backlight brightness gradually, so that the backlight brightness changes towards a target backlight brightness corresponding to the ambient brightness signal. The step sizes include a first step size and a second step size. The backlight brightness for the display is adjusted according to the current backlight brightness and the adjustment value.Type: ApplicationFiled: October 12, 2010Publication date: June 9, 2011Applicant: HTC CorporationInventors: Li-Yin Chen, Wen-Yueh Su, Chun-Ta Lin, Wei-Feng Chien