Abstract: Embodiments described herein relate to managing wireless connections within a spatially-dense setting like a passenger vehicle, thereby improving quality and reliability of individual wireless connections. An example method includes detecting a connection request from a passenger device requesting a wireless connection with a seatback device in a first in-vehicle location. The method includes defining a density zone that includes other in-vehicle locations surrounding the first in-vehicle location. The density zone localizes an area within which other wireless connections may be disruptive to the wireless connection. The method includes determining, via a token server that stores connection tokens that each describe an existing connection, a number of particular tokens that describe existing connections located within the density zone.

Abstract: The present invention relates to a compound solid preparation and the preparation method therefor and specifically relates to a valsartan-amlodipine compound solid preparation and the preparation method therefor. The valsartan-amlodipine compound solid preparation comprises valsartan particles and an amlodipine premix. The valsartan particles are prepared by preparing wet valsartan particles from a mixture obtained by mixing valsartan and a pharmaceutic adjuvant with an ethanol aqueous solution as a wetting agent and drying the wet valsartan particles. The amlodipine premix is prepared by mixing amlodipine and a pharmaceutic adjuvant. The valsartan-amlodipine compound solid preparation according to the present invention and the preparation method thereof can prevent the two main ingredients, amlodipine and valsartan, from interfering each other, and the preparation method is relatively simple and suitable for large-scale industrial production.

Abstract: A method for polishing a special-shaped face of marble where a marble blank is placed into a vibration grinding machine and subjected to rough and fine grinding by adding thereto abrasive materials to obtain stone with an optimum polished effect. The method breaks the single mirror plane effect of conventional marble, can obtain polished faces of marble having various artistic visual effects and achieves the mechanical polishing of marble stone with improved polishing efficiency and greatly reduced costs of special-shaped marble stone The method has a polishing cost of only a few tenths of a conventional method, can greatly reduce the cost of a product of special-shaped marble stone, so that the special-shaped polished stone product would possibly become a building material product which can be popularized, enriching the forms of appearance of special-shaped marble stone products and building decorating marble stone.

Abstract: A system for optimizing the number of dies that can be fabricated on a wafer uses a die number optimization (DNO) routine to determine a maximum number of dies for a target die area (TDA), and generate an initial result list of die shapes that have the maximum number of dies for the TDA. Optionally, a die size optimization (DSO) routine can be executed to determine a list of die shapes having a maximum die area corresponding to the maximum number of dies, a first list of optimized die shapes having a maximum area utilization (AU) for a decreased TDA, and/or a second list of optimized die shapes having a minimum AU for an increased TDA. A candidate list (CL) of the various die shapes can be generated, and entries from the CL automatically selected and/or displayed to indicate proposed wafer layouts.

Abstract: A system for optimizing the number of dies that can be fabricated on a wafer uses a die number optimization (DNO) routine to determine a maximum number of dies for a target die area (TDA), and generate an initial result list of die shapes that have the maximum number of dies for the TDA. Optionally, a die size optimization (DSO) routine can be executed to determine a list of die shapes having a maximum die area corresponding to the maximum number of dies, a first list of optimized die shapes having a maximum area utilization (AU) for a decreased TDA, and/or a second list of optimized die shapes having a minimum AU for an increased TDA. A candidate list (CL) of the various die shapes can be generated, and entries from the CL automatically selected and/or displayed to indicate proposed wafer layouts.

Abstract: Systems and methods for supporting a liquid against a vacuum pressure in a chamber can enable analysis of the liquid surface using vacuum-based chemical analysis instruments. No electrical or fluid connections are required to pass through the chamber walls. The systems can include a reservoir, a pump, and a liquid flow path. The reservoir contains a liquid-phase sample. The pump drives flow of the sample from the reservoir, through the liquid flow path, and back to the reservoir. The flow of the sample is not substantially driven by a differential between pressures inside and outside of the liquid flow path. An aperture in the liquid flow path exposes a stable portion of the liquid-phase sample to the vacuum pressure within the chamber. The radius, or size, of the aperture is less than or equal to a critical value required to support a meniscus of the liquid-phase sample by surface tension.