Patents by Inventor Li-Yu Chen
Li-Yu Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11973275Abstract: An antenna for multi-broadband and multi-polarization communication, may include a plurality of radiators configured to jointly function as one or more dipoles, a first feed terminal for a first signal of a first polarization, and a second feed terminal for a second signal of a second polarization different from the first polarization. Each radiator may be configured to contribute to resonances at two or more nonoverlapping bands. In an embodiment, the antenna may further include a third feed terminal for a third signal of the first polarization, and a fourth feed terminal for a fourth signal of the second polarization.Type: GrantFiled: June 13, 2022Date of Patent: April 30, 2024Assignee: MEDIATEK INC.Inventors: Chung-Hsin Chiang, Li-Yu Chen, Shih-Huang Yeh
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Patent number: 11956994Abstract: The present disclosure is generally related to 3D imaging capable OLED displays. A light field display comprises an array of 3D light field pixels, each of which comprises an array of corrugated OLED pixels, a metasurface layer disposed adjacent to the array of 3D light field pixels, and a plurality of median layers disposed between the metasurface layer and the corrugated OLED pixels. Each of the corrugated OLED pixels comprises primary or non-primary color subpixels, and produces a different view of an image through the median layers to the metasurface to form a 3D image. The corrugated OLED pixels combined with a cavity effect reduce a divergence of emitted light to enable effective beam direction manipulation by the metasurface. The metasurface having a higher refractive index and a smaller filling factor enables the deflection and direction of the emitted light from the corrugated OLED pixels to be well controlled.Type: GrantFiled: August 10, 2021Date of Patent: April 9, 2024Assignee: Applied Materials, Inc.Inventors: Chung-Chih Wu, Hoang Yan Lin, Guo-Dong Su, Zih-Rou Cyue, Li-Yu Yu, Wei-Kai Lee, Guan-Yu Chen, Chung-Chia Chen, Wan-Yu Lin, Gang Yu, Byung-Sung Kwak, Robert Jan Visser, Chi-Jui Chang
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Patent number: 11953063Abstract: A normally closed disc clamp system includes a housing with a rotating disc, a brake ring and a pressure-enhancing ring arranged therein. When only a first chamber is supplied with fluid, the fluid pushes the brake ring to release the rotating disc. When only a second chamber is fed with fluid, the fluid pushes the brake ring to keep the rotating disc in the braking state, and pushes the pressure-enhancing ring to compress an elastic unit. The energy generated by the compression of the elastic unit acts on the brake ring through the fluid, so that the brake ring achieves a double pressurization effect. If the action of the fluid fails, the brake ring can still provide a braking effect to the rotating disc through the elastic unit to improve operational safety. Further, the present invention further provides a rotating table using the normally closed disc clamp system.Type: GrantFiled: August 31, 2021Date of Patent: April 9, 2024Assignee: HIWIN TECHNOLOGIES CORP.Inventors: Peng-Wen Chen, Chien-Yu Lin, Li-Wen Huang
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Patent number: 11953839Abstract: In a method of cleaning a lithography system, during idle mode, a stream of air is directed, through a first opening, into a chamber of a wafer table of an EUV lithography system. One or more particles is extracted by the directed stream of air from surfaces of one or more wafer chucks in the chamber of the wafer table. The stream of air and the extracted one or more particle are drawn, through a second opening, out of the chamber of the wafer table.Type: GrantFiled: December 5, 2022Date of Patent: April 9, 2024Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.Inventors: Shih-Yu Tu, Shao-Hua Wang, Yen-Hao Liu, Chueh-Chi Kuo, Li-Jui Chen, Heng-Hsin Liu
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Publication number: 20240111456Abstract: A method of a storage device controller includes: using an interface circuit for receiving and storing different write address information of different write command signals sent from a host device, the different write address information being out of sequence; and, using multiple processor cores to rearrange the different write address information in sequence and then write data into at least one storage zone according to the different write address information rearranged in sequence.Type: ApplicationFiled: October 2, 2022Publication date: April 4, 2024Applicant: Silicon Motion, Inc.Inventors: Li-Chi Chen, Yen-Yu Jou
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Patent number: 11945156Abstract: A three-dimensional printing apparatus includes a liquid tank capable of accommodating a photosensitive liquid. The liquid tank includes a film, a plurality of side walls, a plate and a motor. The film has a workpiece curing area. The plurality of side walls surrounds the film. The plate is capable of supporting the film and having at least one fluid tunnel extending from a first surface of the plate contacting the film to a second surface of the plate. The motor is connected to the liquid tank to incline the liquid tank. A gap is formed between the plat and one of the plurality of side walls of the liquid tank, and the film is communicated with an outside space via the gap.Type: GrantFiled: November 25, 2019Date of Patent: April 2, 2024Assignee: YOUNG OPTICS INC.Inventors: Li-Han Wu, Chien-Hsing Tsai, Chao-Shun Chen, Tsung-Yu Liu
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Publication number: 20240103378Abstract: The present disclosure provides an extreme ultraviolet (EUV) lithography system including a radiation source and an EUV control system integrated with the radiation source. The EUV control system includes a 3-dimensional diagnostic module (3DDM) designed to collect a laser beam profile of a laser beam from the radiation source in a 3-dimensional (3D) mode, an analysis module designed to analyze the laser beam profile, a database designed to store the laser beam profile, and an EUV control module designed to adjust the radiation source. The analysis module is coupled with the database and the EUV control module. The database is coupled with the 3DDM and the analysis module. The EUV control module is coupled with the analysis module and the radiation source.Type: ApplicationFiled: November 30, 2023Publication date: March 28, 2024Inventors: Tai-Yu CHEN, Tzu-Jung PAN, Kuan-Hung CHEN, Sheng-Kang YU, Shang-Chieh CHIEN, Li-Jui CHEN, Heng-Hsin LIU
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Patent number: 11936927Abstract: A multimedia signal transmission control system is provided, which includes a transmitter control circuit and a receiver control circuit coupled with each other. The transmitter control circuit packs a control signal and at least one of multimedia signals into first hybrid data packets in an active video period of a video frame, and packs the control signal and another at least one of the multimedia signals into second hybrid data packets in a vertical front porch and a vertical back porch of the video frame. The receiver control circuit receives the first hybrid data packets in the active video period, and receives the second hybrid data packets in the vertical front porch and the vertical back porch. The receiver control circuit unpacks the first hybrid data packets and the second hybrid data packets to provide the control signal and the multimedia signals to a display module.Type: GrantFiled: September 8, 2021Date of Patent: March 19, 2024Assignee: Realtek Semiconductor CorporationInventors: Yun-Hung Lin, Po-Hsien Wu, Li-Yu Chen
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Publication number: 20240088030Abstract: Provided are semiconductor devices that include a first gate structure having a first end cap portion, a second gate structure having a second end cap portion coaxial with the first gate structure, a first dielectric region separating the first end cap portion and the second end cap portion, a first conductive element extending over the first gate structure, a second conductive element extending over the second gate structure, and a gate via electrically connecting the second gate structure and the second conductive element, with the first dielectric region having a first width and being positioned at least partially under the first conductive element and defines a spacing between the gate via and an end of the second end cap portion that exceeds a predetermined distance.Type: ApplicationFiled: January 23, 2023Publication date: March 14, 2024Inventors: Chin-Liang CHEN, Chi-Yu LU, Ching-Wei TSAI, Chun-Yuan CHEN, Li-Chun TIEN
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Publication number: 20240081056Abstract: A double patterning method of manufacturing select gates and word lines is provided in the present invention, including forming first string patterns composed of word line patterns and select gate patterns on a target layer, forming a conformal spacer layer on first string patterns, wherein the spacer layer forms trenches between first string patterns, forming a fill layer filling up the trenches on the spacer layer, removing fill layer outside of the trenches, so that fill layer in the trenches forms second string patterns, wherein the second string patterns and the first string patterns are spaced apart, removing exposed spacer layer, so that the first string patterns and the second string patterns constitute target patterns spaced apart from each other on the target layer, and performing an etching process using those target patterns as a mask to remove exposed target layer, so as to form word lines and select gates.Type: ApplicationFiled: April 25, 2023Publication date: March 7, 2024Applicant: Powerchip Semiconductor Manufacturing CorporationInventors: Yi-Yeh Chuang, Zih-Song Wang, Li-Ta Chen, Shun-Yu Gao
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Publication number: 20240072021Abstract: A package structure and the manufacturing method thereof are provided. The package structure includes a first package including at least one first semiconductor die encapsulated in an insulating encapsulation and through insulator vias electrically connected to the at least one first semiconductor die, a second package including at least one second semiconductor die and conductive pads electrically connected to the at least one second semiconductor die, and solder joints located between the first package and the second package. The through insulator vias are encapsulated in the insulating encapsulation. The first package and the second package are electrically connected through the solder joints. A maximum size of the solder joints is greater than a maximum size of the through insulator vias measuring along a horizontal direction, and is greater than or substantially equal to a maximum size of the conductive pads measuring along the horizontal direction.Type: ApplicationFiled: October 26, 2023Publication date: February 29, 2024Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Wei-Yu Chen, An-Jhih Su, Chi-Hsi Wu, Der-Chyang Yeh, Li-Hsien Huang, Po-Hao Tsai, Ming-Shih Yeh, Ta-Wei Liu
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Publication number: 20240071849Abstract: A semiconductor package including one or more dam structures and the method of forming are provided. A semiconductor package may include an interposer, a semiconductor die bonded to a first side of the interposer, an encapsulant on the first side of the interposer encircling the semiconductor die, a substrate bonded to the a second side of the interposer, an underfill between the interposer and the substrate, and one or more of dam structures on the substrate. The one or more dam structures may be disposed adjacent respective corners of the interposer and may be in direct contact with the underfill. The coefficient of thermal expansion of the one or more of dam structures may be smaller than the coefficient of thermal expansion of the underfill.Type: ApplicationFiled: August 26, 2022Publication date: February 29, 2024Inventors: Jian-You Chen, Kuan-Yu Huang, Li-Chung Kuo, Chen-Hsuan Tsai, Kung-Chen Yeh, Hsien-Ju Tsou, Ying-Ching Shih, Szu-Wei Lu
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Publication number: 20240014572Abstract: A multiband antenna array is provided. The multiband antenna array includes a first multi-band antenna unit, a first high band antenna member, and a first low band antenna member. The first multi-band antenna unit includes a first high band antenna element and a first low band antenna element. A first distance is formed between the center of the first multi-band antenna unit and the center of the first high band antenna member. The first distance is 0.3˜0.8 times the wavelength of a high band signal. A second distance is formed between the center of the first multi-band antenna unit and the center of the first low band antenna member. The second distance is 0.3˜0.8 times the wavelength of a low band signal.Type: ApplicationFiled: June 8, 2023Publication date: January 11, 2024Inventors: Li-Yu CHEN, Yeh-Chun KAO, Chih-Wei LEE
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Publication number: 20230169931Abstract: A display includes a system on chip (SoC), a plurality of driver integrated circuits (ICs), and a plurality of groups of light-emitting diodes (LEDs). The SoC is arranged to generate a plurality of backlight control signals according to an input image data. The plurality of driver ICs are coupled to the SoC, and arranged to receive the plurality of backlight control signals, respectively, to generate a plurality of driving signals. The plurality of groups of LEDs are coupled to the plurality of driver ICs, respectively, wherein the plurality of driving signals are arranged to control brightness of the plurality of groups of LEDs, respectively.Type: ApplicationFiled: October 11, 2022Publication date: June 1, 2023Applicant: Realtek Semiconductor Corp.Inventors: Shi-Xuan Hong, Li-Yu Chen, Po-Hsien Wu
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Patent number: 11532875Abstract: An antenna module includes a first dielectric layer, an antenna layer, a grounding layer and a conductive layer. The first dielectric layer has a first dielectric surface and a second dielectric surface opposite to the first dielectric surface and a first dielectric lateral surface extending between the first dielectric surface and the second dielectric surface. The antenna layer is formed on the first dielectric surface. The grounding layer is formed below the second dielectric surface. The conductive layer is formed on the first dielectric lateral surface of first dielectric layer, wherein the conductive layer electrically connects to the grounding layer and extends from the grounding layer toward the antenna layer but not contacts the first dielectric surface.Type: GrantFiled: September 30, 2021Date of Patent: December 20, 2022Assignee: MEDIATEK INC.Inventors: Chung-Hsin Chiang, Li-Yu Chen, Shih-Huang Yeh
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Publication number: 20220384966Abstract: An antenna for multi-broadband and multi-polarization communication, may include a plurality of radiators configured to jointly function as one or more dipoles, a first feed terminal for a first signal of a first polarization, and a second feed terminal for a second signal of a second polarization different from the first polarization. Each radiator may be configured to contribute to resonances at two or more nonoverlapping bands. In an embodiment, the antenna may further include a third feed terminal for a third signal of the first polarization, and a fourth feed terminal for a fourth signal of the second polarization.Type: ApplicationFiled: June 13, 2022Publication date: December 1, 2022Inventors: Chung-Hsin CHIANG, Li-Yu CHEN, Shih-Huang YEH
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Patent number: 11387557Abstract: The invention provides an antenna for multi-broadband and multi-polarization communication, which may include a plurality of radiators configured to jointly function as one or more dipoles, and a plurality of parasitic elements. Each radiator may be configured to contribute to resonances at two or more nonoverlapping bands, and may comprise an arm and a ground wall connecting the arm and a ground plane. The arm may comprise an arm plate and a folded arm. The ground wall may comprise a meandering portion causing a distance between the arm and the ground plane to be shorter than a length of a current conduction path along the ground wall between the arm and the ground plane. On a geometric reference surface, a projection of each parasitic element may extend between two gaps which clamp a projection of an associated one of the radiators.Type: GrantFiled: June 11, 2020Date of Patent: July 12, 2022Assignee: MEDIATEK INC.Inventors: Chung-Hsin Chiang, Li-Yu Chen, Shih-Huang Yeh
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Publication number: 20220131262Abstract: An antenna module includes a first dielectric layer, an antenna layer, a grounding layer and a conductive layer. The first dielectric layer has a first dielectric surface and a second dielectric surface opposite to the first dielectric surface and a first dielectric lateral surface extending between the first dielectric surface and the second dielectric surface. The antenna layer is formed on the first dielectric surface. The grounding layer is formed below the second dielectric surface. The conductive layer is formed on the first dielectric lateral surface of first dielectric layer, wherein the conductive layer electrically connects to the grounding layer and extends from the grounding layer toward the antenna layer but not contacts the first dielectric surface.Type: ApplicationFiled: September 30, 2021Publication date: April 28, 2022Inventors: Chung-Hsin CHIANG, Li-Yu CHEN, Shih-Huang YEH
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Publication number: 20220094994Abstract: A multimedia signal transmission control system is provided, which includes a transmitter control circuit and a receiver control circuit coupled with each other. The transmitter control circuit packs a control signal and at least one of multimedia signals into first hybrid data packets in an active video period of a video frame, and packs the control signal and another at least one of the multimedia signals into second hybrid data packets in a vertical front porch and a vertical back porch of the video frame. The receiver control circuit receives the first hybrid data packets in the active video period, and receives the second hybrid data packets in the vertical front porch and the vertical back porch. The receiver control circuit unpacks the first hybrid data packets and the second hybrid data packets to provide the control signal and the multimedia signals to a display module.Type: ApplicationFiled: September 8, 2021Publication date: March 24, 2022Inventors: Yun-Hung LIN, Po-Hsien WU, Li-Yu CHEN
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Patent number: 10930039Abstract: One or more computing devices, systems, and/or methods for personalized banner generation and display is provided. For example, an image comprising a product object depicting a product is identified. A background of the image is identified and removed. Features of the product object are evaluated to determine a product type of the product. A new background is selected based upon the product type. A banner comprising the new background and the product object positioned over the new background at a position within the banner is generated. The banner is rendered on a display of a computing device through a user interface.Type: GrantFiled: January 29, 2019Date of Patent: February 23, 2021Assignee: Verizon Media Inc.Inventors: Wan-Ting Lin, Man-Ju Chou, Li-Yu Chen, Chih-Kuei Weng