Abstract: A method includes bonding a first package component over a second package component, dispensing a first underfill between the first package component and the second package component, and bonding a third package component over the second package component. A second underfill is between the third package component and the second package component. The first underfill and the second underfill are different types of underfills.

Abstract: A method of forming a semiconductor device includes applying an adhesive material in a first region of an upper surface of a substrate, where applying the adhesive material includes: applying a first adhesive material at first locations of the first region; and applying a second adhesive material at second locations of the first region, the second adhesive material having a different material composition from the first adhesive material. The method further includes attaching a ring to the upper surface of the substrate using the adhesive material applied on the upper surface of the substrate, where the adhesive material is between the ring and the substrate after the ring is attached.

Abstract: A keyboard testing system includes a processor-based test unit electrically coupled to a microprocessor of a keyboard to be tested to test and determine if the microprocessor function properly, at least one optic sensor which is controlled by the test unit to detect light emitted from LED indicators of the keyboard for testing the indicators and a key testing device which is controlled by the test unit to sequentially actuate keys of the keyboard for testing the keys. The key testing device includes at least one pneumatic cylinder to which an end effector is mounted. The pneumatic cylinder is controlled by the test unit to move the end effector toward/away from and thus actuating/de-actuating the keys. A conveying device moves the key testing device to each of the keys for testing each of the keys.