Abstract: An antenna for multi-broadband and multi-polarization communication, may include a plurality of radiators configured to jointly function as one or more dipoles, a first feed terminal for a first signal of a first polarization, and a second feed terminal for a second signal of a second polarization different from the first polarization. Each radiator may be configured to contribute to resonances at two or more nonoverlapping bands. In an embodiment, the antenna may further include a third feed terminal for a third signal of the first polarization, and a fourth feed terminal for a fourth signal of the second polarization.

Abstract: Disclosed is an electronic device including a device body and an antenna module. The antenna module includes a conductive element and at least one antenna element. The conductive element includes a main body portion and at least one assembly portion connected with each other. The at least one assembly portion is assembled on the device body. The at least one antenna element is disposed on the device body and coupled with the conductive element to excite a first resonance mode. The at least one assembly portion overlaps the at least one antenna element in the length direction of the main body portion.

Abstract: An electronic device includes a device body and an antenna module disposed in the device body and including a conductive structure and a coaxial cable including a core wire, a shielding layer wrapping the core wire, and an outer jacket wrapping the shielding layer. The conductive structure includes a structure body and a slot formed on the structure body and penetrating the structure body in a thickness direction of the structure body. A section of the shielding layer extends from the outer jacket and is connected to the structure body. A physical portion of the structure body and the section of the shielding layer are respectively located on two opposite sides of the slot in a width direction of the slot. A section of the core wire extends from the section of the shielding layer and overlaps the slot and the physical portion in the thickness direction.

Abstract: A package structure and the manufacturing method thereof are provided. The package structure includes a first package including at least one first semiconductor die encapsulated in an insulating encapsulation and through insulator vias electrically connected to the at least one first semiconductor die, a second package including at least one second semiconductor die and conductive pads electrically connected to the at least one second semiconductor die, and solder joints located between the first package and the second package. The through insulator vias are encapsulated in the insulating encapsulation. The first package and the second package are electrically connected through the solder joints. A maximum size of the solder joints is greater than a maximum size of the through insulator vias measuring along a horizontal direction, and is greater than or substantially equal to a maximum size of the conductive pads measuring along the horizontal direction.

Abstract: A semiconductor package including one or more dam structures and the method of forming are provided. A semiconductor package may include an interposer, a semiconductor die bonded to a first side of the interposer, an encapsulant on the first side of the interposer encircling the semiconductor die, a substrate bonded to the a second side of the interposer, an underfill between the interposer and the substrate, and one or more of dam structures on the substrate. The one or more dam structures may be disposed adjacent respective corners of the interposer and may be in direct contact with the underfill. The coefficient of thermal expansion of the one or more of dam structures may be smaller than the coefficient of thermal expansion of the underfill.

Abstract: An internal printed antenna is revealed. The internal printed antenna includes a dielectric substrate, a ground plane, a metal loop radiating portion, and a microstrip feed line. The metal loop radiating portion includes a plurality of bends and a gap area is formed between adjacent bends. Two short circuit parts are arranged at the gap area.

Abstract: An internal printed antenna is revealed. The internal printed antenna includes a dielectric substrate, a ground plane, a metal loop radiating portion, and a microstrip feed line. The metal loop radiating portion includes a plurality of bends and a gap area is formed between adjacent bends. Two short circuit parts are arranged at the gap area.