Abstract: This disclosure provides a semiconductor package including a chip, a drain lead frame assembly, a source lead frame assembly, and an insulation layer. The chip includes an opposite drain surface and source surface. The drain lead frame assembly includes a drain contact plate, a drain connecting section, and drain leads integrally formed into one piece. The drain contact plate is physically connected to the drain surface. An area of the drain contact plate is larger than that of the drain surface. The source lead frame assembly includes a source contact plate, a source connecting section, and source leads integrally formed into one piece. The source contact plate is physically connected to the source surface. An area of the source contact plate is smaller than that of the source surface. The insulation layer encapsulates the chip and surrounds the drain contact plate and the source contact plate.