Patents by Inventor Liam PARKES

Liam PARKES has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11735844
    Abstract: An interconnect system includes various anti-backout latches that are movable between an engaged position and a disengaged position. When in the engaged position, the anti-backout latches can be configured to prevent an interconnect module, such as an optical transceiver, from becoming unmated from a host module. When in the disengaged position, the anti-backout latches permit the interconnect module to become unmated from a host module. Securement members are also disclosed that secure a heat sink to a module housing of the interconnect module.
    Type: Grant
    Filed: October 7, 2021
    Date of Patent: August 22, 2023
    Assignee: SAMTEC, INC.
    Inventors: Liam Parkes, Eric Zbinden, Keith Guetig, Jignesh H. Shah, Jean Karlo Williams Barnett, Chadrick Paul Faith, R. Brad Bettman
  • Publication number: 20220029323
    Abstract: An interconnect system includes various anti-backout latches that are movable between an engaged position and a disengaged position. When in the engaged position, the anti-backout latches can be configured to prevent an interconnect module, such as an optical transceiver, from becoming unmated from a host module. When in the disengaged position, the anti-backout latches permit the interconnect module to become unmated from a host module. Securement members are also disclosed that secure a heat sink to a module housing of the interconnect module.
    Type: Application
    Filed: October 7, 2021
    Publication date: January 27, 2022
    Inventors: Liam PARKES, Eric ZBINDEN, Keith Guetig, Jignesh H. Shah, Jean Karlo Williams Barnett, Chadrick Paul Faith, R. Brad Bettman
  • Patent number: 11196195
    Abstract: Interconnect systems having anti-backout latches and securement members are disclosed.
    Type: Grant
    Filed: April 10, 2018
    Date of Patent: December 7, 2021
    Assignee: SAMTEC, INC.
    Inventors: R. Brad Bettman, Liam Parkes, Eric Zbinden, Keith Guetig, Jignesh H. Shah, Jean Karlo Williams Barnett, Chadrick Paul Faith, Edwin Loy
  • Patent number: 11171432
    Abstract: An interconnect system includes various anti-backout latches that are movable between an engaged position and a disengaged position. When in the engaged position, the anti-backout latches can be configured to prevent an interconnect module, such as an optical transceiver, from becoming unmated from a host module. When in the disengaged position, the anti-backout latches permit the interconnect module to become unmated from a host module. Securement members are also disclosed that secure a heat sink to a module housing of the interconnect module.
    Type: Grant
    Filed: August 15, 2017
    Date of Patent: November 9, 2021
    Assignee: SAMTEC, INC.
    Inventors: Liam Parkes, Eric Zbinden, Keith Guetig, Jignesh H. Shah, Jean Karlo Williams Barnett, Chadrick Paul Faith, R. Brad Bettman
  • Publication number: 20200403334
    Abstract: An interconnect system includes various anti-backout latches that are movable between an engaged position and a disengaged position. When in the engaged position, the anti-backout latches can be configured to prevent an interconnect module, such as an optical transceiver, from becoming unmated from a host module. When in the disengaged position, the anti-backout latches permit the interconnect module to become unmated from a host module. Securement members are also disclosed that secure a heat sink to a module housing of the interconnect module.
    Type: Application
    Filed: August 15, 2017
    Publication date: December 24, 2020
    Inventors: Liam PARKES, Eric ZBINDEN, Keith GUETIG, Jignesh H. SHAH, Jean Carlo WILLIAMS BARNETT, Chadrick Paul FAITH, R. Brad BETTMAN
  • Publication number: 20200220286
    Abstract: Interconnect systems having anti-backout latches and securement members are disclosed.
    Type: Application
    Filed: April 10, 2018
    Publication date: July 9, 2020
    Inventors: R. Brad BETTMAN, Liam PARKES, Eric ZBINDEN, Keith GUETIG, Jignesh H. SHAH, Jean Karlo WILLIAMS BARNETT, Chadrick Paul FAITH, Edwin LOY