Patents by Inventor Liamh-Cheng Chang

Liamh-Cheng Chang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Process and structure for semiconductor package
    Patent number: 7005327
    Abstract: A packaging process for a semiconductor chip that includes the following steps. A carrier having an upper surface and a corresponding lower surface is provided. A photoresist layer is formed on the upper surface of the carrier. A plurality of photoresist openings that expose the carrier is formed in the photoresist layer. A plurality of openings that connects with the photoresist openings are formed in the carrier. A tape is attached to the lower surface of the carrier. The body is filled into the openings of the carrier. A chip is mounted onto the upper surface of the carrier and electrically connected therewith. Finally, the tape is removed from the lower surface of the carrier.
    Type: Grant
    Filed: September 5, 2003
    Date of Patent: February 28, 2006
    Assignee: Advanced Semiconductor Engineering, Inc.
    Inventors: Wei-Chun Kung, Liamh-Cheng Chang
  • [PROCESS AND STRUCTURE FOR SEMICONDUCTOR PACKAGE]
    Publication number: 20040115862
    Abstract: A packaging process for a semiconductor chip that includes the following steps. A carrier having an upper surface and a corresponding lower surface is provided. A photoresist layer is formed on the upper surface of the carrier. A plurality of photoresist openings that expose the carrier is formed in the photoresist layer. A plurality of openings that connects with the photoresist openings are formed in the carrier. A tape is attached to the lower surface of the carrier. The body is filled into the openings of the carrier. A chip is mounted onto the upper surface of the carrier and electrically connected therewith. Finally, the tape is removed from the lower surface of the carrier.
    Type: Application
    Filed: September 5, 2003
    Publication date: June 17, 2004
    Inventors: WEI-CHUN KUNG, LIAMH-CHENG CHANG