Abstract: A server including a chassis, a motherboard, a heat source and a heat exchanger. The motherboard is disposed in the chassis. The heat source is disposed on and electrically connected to the motherboard. The heat exchanger includes a first chamber body, a plurality of heat dissipation plates and a plurality of heat dissipation fins. The first chamber body is in thermal contact with the heat source and has a first channel. The plurality of heat dissipation plates are in thermal contact with and inserted into the first chamber body. The plurality of heat dissipation plates each have a second channel. The first channel of the first chamber body is in fluid communication with the second channels of the plurality of heat dissipation plates. The plurality of heat dissipation fins are in thermal contact with the plurality of heat dissipation plates.

Abstract: The present disclosure provides a fan management method and system, and a server. The method includes: monitoring working performance of each dual-motor fan in real-time; determining whether the working performance of the dual-motor fan is normal, if the working performance is normal, instructing the dual-motor fan to continue to operate with normal performance; if the working performance is not normal, instructing a single-motor fan that has no abnormality in the dual-motor fan to operate with a preset compensation strategy; the preset compensation strategy is a strategy for performing performance compensation for a single-motor fan that has no abnormality to normal performance of a dual-motor fan. The present disclosure can reduce energy consumption of the server, avoid ineffective waste, and save operating costs. The fan can be prevented from running at a high speed for a long time, and the service life of the fan can be improved.

Abstract: The present disclosure provides a method for automatically optimizing power consumption. The method includes: (S1) a baseboard management controller determines whether system information is correct or not after powered on. If correct, further proceeding the method. If not correct, stopping further proceeding the method. (S2) the baseboard management controller periodically detects the surface temperature and the internal temperature of the essential element with a first loop cycle and determines whether the surface temperature or the internal temperature is higher than a preset temperature. (S3) If the surface temperature or the internal temperature is higher than the preset temperature, performing a PID adjustment to the fan rotation speed according to the surface temperature or the internal temperature of the essential element.

Abstract: The disclosure provides a heat dissipation device. The heat dissipation device is configured to dissipate heat generated by a central process unit. The heat dissipation device includes a first heat dissipation component, at least one second heat dissipation component and at least one heat pipe. The at least one heat pipe is connected to the first heat dissipation component and the at least one second heat dissipation component, the first heat dissipation component is configured to be correspondingly disposed at a side of the central processing unit.

Abstract: The present disclosure provides a method for automatically optimizing power consumption. The method includes: (S1) a baseboard management controller determines whether system information is correct or not after powered on. If correct, further proceeding the method. If not correct, stopping further proceeding the method. (S2) the baseboard management controller periodically detects the surface temperature and the internal temperature of the essential element with a first loop cycle and determines whether the surface temperature or the internal temperature is higher than a preset temperature. (S3) If the surface temperature or the internal temperature is higher than the preset temperature, performing a PID adjustment to the fan rotation speed according to the surface temperature or the internal temperature of the essential element.

Abstract: A fan control method comprises: determining whether a processor power load value is larger than a load threshold, and generating a load determination result accordingly; determining whether a processor temperature is not larger than a temperature threshold, and generating a temperature determination result accordingly; choosing one set of PID coefficients from a plurality of sets of PID coefficients according to the load determination result and the temperature determination result; obtaining a temperature difference value related to the processor, and generating a first pulse width modulation value according to the temperature difference value and the set of PID coefficients; and calculating a second pulse width modulation value corresponding to an operation temperature, and obtaining a maximum of the first pulse width modulation value and the second pulse width modulation value to generate a fan control signal for controlling the fan.

Abstract: The present application discloses a liquid cooling system for a cabinet server, which includes a primary side liquid circulation pipe, a distribution control device, and a secondary side liquid circulation pipe, and the primary side liquid circulation pipe is connected to the water filling device. The distribution control device is connected to the primary side liquid circulation pipe, and the secondary side liquid circulation pipe is connected to the distribution control device and at least one cabinet server. The liquid cooling system of the present application cools the cabinet server by liquid cooling, and the energy efficiency ratio of the liquid cooling system is below 1.3, there is almost no noise, no low filling water temperature is needed, natural cooling source is fully utilized, and the cooling tower can be used to meet the heat dissipation requirement.

Abstract: A fan control method comprises: determining whether a processor power load value is larger than a load threshold, and generating a load determination result accordingly; determining whether a processor temperature is not larger than a temperature threshold, and generating a temperature determination result accordingly; choosing one set of PID coefficients from a plurality of sets of PID coefficients according to the load determination result and the temperature determination result; obtaining a temperature difference value related to the processor, and generating a first pulse width modulation value according to the temperature difference value and the set of PID coefficients; and calculating a second pulse width modulation value corresponding to an operation temperature, and obtaining a maximum of the first pulse width modulation value and the second pulse width modulation value to generate a fan control signal for controlling the fan.

Abstract: A heat dissipating unit includes a plurality of heat dissipating fins arranged in an annular array and each including a flow guide plate extending from an inner side to an outer side of the annular array, two connecting plates respectively connected to and forming an angle with two opposite sides of the flow guide plate, and an air inlet and an air channel communicating fluidly with each other. Each connecting plate includes a connecting hole, a slanting edge opposite to the flow guide plate, and a connecting portion projecting from the slanting edge. The connecting portions of the connecting plates of each heat dissipating fin engage respectively the connecting holes in the connecting plates of an adjacent heat dissipating fin. The heat dissipating fins overlap each other so that the air inlets of the heat dissipating fins are arranged in a staggered manner.