Patents by Inventor Lian Hee Tan

Lian Hee Tan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor devices having a back surface protective coating
    Patent number: 7642175
    Abstract: A wafer level method of forming a protective coating on the back surface of integrated circuit devices is described. In one aspect, a tape having a backcoat layer and a mount layer is applied to the back surface of a wafer. The backcoat layer is cured or set such that the backcoat layer is affixed to the back surface of the wafer. Thereafter, the mount layer of the backcoat/mount tape is removed while leaving the backcoat layer affixed to the back surface of the integrated circuit devices. In some embodiments, the mount layer includes an ultraviolet (UV) sensitive adhesive material that releases when exposed to UV light. The described arrangements can be used to form integrated circuits having very thin protective backcoatings. By way of example, opaque protective films having thickness in the range of 5 to 50 microns are readily obtainable.
    Type: Grant
    Filed: October 3, 2006
    Date of Patent: January 5, 2010
    Assignee: National Semiconductor Corporation
    Inventors: Viraj A. Patwardhan, Lian Hee Tan, Nikhil Vishwanath Kelkar
  • Semiconductor devices having a back surface protective coating
    Patent number: 7135385
    Abstract: A wafer level method of forming a protective coating on the back surface of integrated circuit devices is described. In one aspect, a tape having a backcoat layer and a mount layer is applied to the back surface of a wafer. The backcoat layer is cured or set such that the backcoat layer is affixed to the back surface of the wafer. Thereafter, the mount layer of the backcoat/mount tape is removed while leaving the backcoat layer affixed to the back surface of the integrated circuit devices. In some embodiments, the mount layer includes an ultraviolet (UV) sensitive adhesive material that releases when exposed to UV light. The described arrangements can be used to form integrated circuits having very thin protective backcoatings. By way of example, opaque protective films having thickness in the range of 5 to 50 microns are readily obtainable.
    Type: Grant
    Filed: April 23, 2004
    Date of Patent: November 14, 2006
    Assignee: National Semiconductor Corporation
    Inventors: Viraj A. Patwardhan, Lian Hee Tan, Nikhil Vishwanath Kelkar