Abstract: A clamping device for clamping silicon wafers of different sizes and cleaning same includes a main body and a plurality of clamping mechanisms. The surface of the main body defines a plurality of receiving grooves. Separate circular and concentric rows of clamping mechanisms are radially disposed around a central axis of the main body. The clamping mechanism includes first and second clamping members each received in one of the receiving grooves and are adjustable in respect of working height above or flush with the carrying surface of the main body. The first clamping member is closer to the center axis with respect to the second clamping member. A cleaning device with the clamping device is also disclosed.