Patents by Inventor Lian Sun

Lian Sun has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240157619
    Abstract: The disclosure belongs to the technical field of heat insulation materials, and discloses an in-situ microfibrillated reinforced polymer composite heat insulation foam material as well as a preparation method and application thereof. This disclosure adopts a polypropylene matrix, a fiber-forming polymer, an elastomer and an antioxidant as a foam material. The foaming material is subjected to a primary melt blending process and a hot stretching process first, then subjected to a secondary melt blending process and cooling granulation and subjected to a pressing process, and a composite board is obtained. The composite board is subjected to supercritical fluid foaming process, and a composite heat insulation foam material is obtained.
    Type: Application
    Filed: October 23, 2023
    Publication date: May 16, 2024
    Applicant: Zhengzhou University
    Inventors: Jing Jiang, Lian Yang, Junwei Sun, Min Qiao, Caiyi Jia, Xiaofeng Wang, Qian Li
  • Publication number: 20200208786
    Abstract: The present invention relates to a method for tracking and locating a contamination source in a water distribution system based on consumer complaints, comprising following steps: S1: generating a contamination matrix by location information complained by consumers; S2: determining similarity between candidate nodes and classifying the candidate nodes; S3: adding a random complaint hysteresis time and constructing a consumer complaint sample; and S4: training, validating and testing a convolutional neural network by the consumer complaint sample, and using the convolutional neural network in practically tracking and locating a contamination source. Compared with the prior art, the present invention has the following advantages. The contamination source is located in the consumer complaint pattern, according to the real-time consumer complaints after a contamination accident occurs.
    Type: Application
    Filed: October 13, 2019
    Publication date: July 2, 2020
    Inventors: Kunlun XIN, Lian SUN, Hexiang YAN, Tao TAO, Shuping LI, Jiaying WANG
  • Patent number: 9713249
    Abstract: A Chip on Film (COF) flexible circuit board and a display device using the COF flexible circuit board are provided. The circuit board includes: a substrate; a plurality of conductive terminals arranged separately in parallel over the substrate, each of the plurality of conductive terminals including a wide line and a narrow line; and a anisotropic conductive adhesive region provided over the substrate. A connection site of the wide line and the narrow line is located in an overlapping area of the anisotropic conductive adhesive region and the substrate. The embodiments of the invention can reduce the probability of the circuit board being broken and the undesirable phenomena such as open circuit.
    Type: Grant
    Filed: December 12, 2013
    Date of Patent: July 18, 2017
    Assignee: HEFEI Optoelectronics Technology Co., Ltd.
    Inventors: Liang Cheng, Yang Li, Peng Qi, Yang Huang, Xiaowei Gong, Lian Sun, Chunyang Nie, Min Wang
  • Publication number: 20150173170
    Abstract: A Chip on Film (COF) flexible circuit board and a display device using the COF flexible circuit board are provided. The circuit board includes: a substrate; a plurality of conductive terminals arranged separately in parallel over the substrate, each of the plurality of conductive terminals including a wide line and a narrow line; and a anisotropic conductive adhesive region provided over the substrate. A connection site of the wide line and the narrow line is located in an overlapping area of the anisotropic conductive adhesive region and the substrate. The embodiments of the invention can reduce the probability of the circuit board being broken and the undesirable phenomena such as open circuit.
    Type: Application
    Filed: December 12, 2013
    Publication date: June 18, 2015
    Inventors: Liang Cheng, Yang Li, Peng Qi, Yang Huang, Xiaowei Gong, Lian Sun, Chunyang Nie Nie, Min Wang
  • Publication number: 20090137417
    Abstract: This invention contemplates an accurate and efficient estimation of gene copy number using oligonucleotide microarrays. The method integrates gene copy number data obtained from perfect match and mismatch probe sequence structure intensities and probe binding affinities. In one embodiment, an accurate determination of single nucleotide polymorphisms (SNPs) sequences is obtained. In another embodiment, an accurate detection and determination of DNA copy number alteration is obtained. In another embodiment, an accurate estimation for RNA gene expression is obtained.
    Type: Application
    Filed: October 16, 2008
    Publication date: May 28, 2009
    Inventors: Wenjiang Fu, Minping Qian, Lin Wan, Ke Lian Sun