Patents by Inventor Liang C. Tay

Liang C. Tay has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for molding semiconductor components
    Patent number: 6652799
    Abstract: A molding apparatus for molding semiconductor components includes a pair of opposing mold chases having mating mold cavities. The mold cavities are configured to retain polymer release films for separating the molded components from the mold cavities. The molding apparatus also includes a movable pot having a reservoir for retaining a preform of molding compound, and a plunger for moving the molding compound into the mold cavities. The movable pot is mounted for axial movement within a chamfered opening in one of the mold chases. The movable pot is configured to clamp onto the release films to prevent wrinkling of the release films, and seepage of the molding compound under the release films. A system for molding semiconductor components includes the molding apparatus, a pot drive mechanism for moving the movable pot, a plunger drive mechanism for moving the plunger, and a clamping mechanism for clamping the mold chases together.
    Type: Grant
    Filed: December 31, 2001
    Date of Patent: November 25, 2003
    Assignee: Micron Technology, Inc.
    Inventors: Toh Kok Seng, Liang C. Tay, Kay Kit-Tan
  • Apparatus for molding semiconductor components
    Patent number: 6439869
    Abstract: A molding apparatus for molding semiconductor components includes a pair of opposing mold chases having mating mold cavities. The mold cavities are configured to retain polymer release films and also includes a movable pot having a reservoir for retaining a preform of molding compound, and a plunger for moving the molding compound into the mold cavities. The movable pot is mounted for axial movement within a chamfered opening in one of the mold chases. The movable pot is configured to clamp onto release films to prevent wrinkling of the release films, and seepage of the molding compound under the release films. A system for molding semiconductor components includes the molding apparatus, a pot drive mechanism for moving the movable pot, a plunger drive mechanism for moving the plunger, and a clamping mechanism for clamping the mold chases together.
    Type: Grant
    Filed: August 16, 2000
    Date of Patent: August 27, 2002
    Assignee: Micron Technology, Inc.
    Inventors: Toh Kok Seng, Liang C. Tay, Kay Kit-Tan
  • Method for molding semiconductor components
    Publication number: 20020056942
    Abstract: A molding apparatus for molding semiconductor components includes a pair of opposing mold chases having mating mold cavities. The mold cavities are configured to retain polymer release films for separating the molded components from the mold cavities. The molding apparatus also includes a movable pot having a reservoir for retaining a preform of molding compound, and a plunger for moving the molding compound into the mold cavities. The movable pot is mounted for axial movement within a chamfered opening in one of the mold chases. The movable pot is configured to clamp onto the release films to prevent wrinkling of the release films, and seepage of the molding compound under the release films. A system for molding semiconductor components includes the molding apparatus, a pot drive mechanism for moving the movable pot, a plunger drive mechanism for moving the plunger, and a clamping mechanism for clamping the mold chases together.
    Type: Application
    Filed: December 31, 2001
    Publication date: May 16, 2002
    Inventors: Toh Kok Seng, Liang C. Tay, Kay Kit - Tan