Abstract: An electrically conductive element, including an insulator and a first conductor, is provided, which can be affixed to a second conductor consisting of conductive structural element, wherein the insulator is positioned between the first and second conductors to electrically isolate them. A power supply may be connected between the first and second conductors to provide power thereto, and an electrical device may be connected across the first and second conductors.

Abstract: An electrically conductive element, including an insulator and a first conductor, is provided, which can be affixed to a second conductor consisting of conductive structural element, wherein the insulator is positioned between the first and second conductors to electrically isolate them. A power supply may be connected between the first and second conductors to provide power thereto, and an electrical device may be connected across the first and second conductors.

Abstract: A capacitor includes a pair of electrodes and a metalized dielectric layer disposed between the pair of electrodes, in which the metalized dielectric layer has a plurality of metal aggregates distributed within a dielectric material. The distribution is such that a volume fraction of metal in the metalized dielectric layer is at least about 30%. Meanwhile, the plurality of metal aggregates are separated from one another by the dielectric material. A method for forming a metal-dielectric composite may include coating a plurality of dielectric particles with a metal to form a plurality of metal-coated dielectric particles and sintering the plurality of metal-coated dielectric particles at a temperature of at least about 750° C. to about 950° C. to transform the metal coatings into discrete, separated metal aggregates.

Abstract: A capacitor includes a pair of electrodes and a metalized dielectric layer disposed between the pair of electrodes, in which the metalized dielectric layer has a plurality of metal aggregates distributed within a dielectric material. The distribution is such that a volume fraction of metal in the metalized dielectric layer is at least about 30%. Meanwhile, the plurality of metal aggregates are separated from one another by the dielectric material. A method for forming a metal-dielectric composite may include coating a plurality of dielectric particles with a metal to form a plurality of metal-coated dielectric particles and sintering the plurality of metal-coated dielectric particles at a temperature of at least about 750° C. to about 950° C. to transform the metal coatings into discrete, separated metal aggregates.

Abstract: A capacitor, and methods of its manufacture, having improved capacitance efficiency which results from increasing the effective area of an electrode surface are disclosed. An improved “three-dimensional” capacitor may be constructed with electrode layers having three-dimensional aspects at the point of interface with a dielectric such that portions of the electrode extend into the dielectric layer. Advantageously, embodiments of a three-dimensional capacitor drastically reduce the space footprint that is required in a circuit to accommodate the capacitor, when compared to current capacitor designs. Increased capacitance density may be realized without using high k (high constant) dielectric materials, additional “electrode—dielectric—electrode” arrangements in an ever increasing stack, or serially stringing together multiple capacitors.

Abstract: A method for making a capacitor having improved capacitance efficiency which results from increasing the effective area of an electrode surface is disclosed. Specifically, an improved “three-dimensional” capacitor may be constructed with electrode layers having three-dimensional aspects at the point of interface with a dielectric such that portions of the electrode extend into the dielectric layer. Advantageously, embodiments of a three-dimensional capacitor drastically reduce the space footprint that is required in a circuit to accommodate the capacitor, when compared to current capacitor designs. Increased capacitance density may be realized without using high k (high constant) dielectric materials, additional “electrode-dielectric-electrode” arrangements in an ever increasing stack, or serially stringing together multiple capacitors.

Abstract: An electrically conductive module is provided. The module includes a panel configured to engage with one or more conductive structural elements. The module further includes conductive layers formed on or in the panel. Each conductive layer has a terminal configured to be in electrical communication with at least one of the conductive structural elements. In one embodiment of the present invention, a first terminal is configured to be in electrical communication with a first conductive structural element and a second terminal is configured to be in electrical communication with a second conductive structural element. In another embodiment of the present invention, both a first terminal and a second terminal are configured to be in electrical communication with a first conductive structural element. In this embodiment, the first and second terminals are respectively configured to be in electrical communication with first and second conductive portions of the first conductive structural element.

Abstract: A capacitor includes a pair of electrodes and a metalized dielectric layer disposed between the pair of electrodes, in which the metalized dielectric layer has a plurality of metal aggregates distributed within a dielectric material. The distribution is such that a volume fraction of metal in the metalized dielectric layer is at least about 30%. Meanwhile, the plurality of metal aggregates are separated from one another by the dielectric material. A method for forming a metal-dielectric composite may include coating a plurality of dielectric particles with a metal to form a plurality of metal-coated dielectric particles and sintering the plurality of metal-coated dielectric particles at a temperature of at least about 750° C. to about 950° C. to transform the metal coatings into discrete, separated metal aggregates.

Abstract: A capacitor, and methods of its manufacture, having improved capacitance efficiency which results from increasing the effective area of an electrode surface are disclosed. An improved “three-dimensional” capacitor may be constructed with electrode layers having three-dimensional aspects at the point of interface with a dielectric such that portions of the electrode extend into the dielectric layer. Advantageously, embodiments of a three-dimensional capacitor drastically reduce the space footprint that is required in a circuit to accommodate the capacitor, when compared to current capacitor designs. Increased capacitance density may be realized without using high k (high constant) dielectric materials, additional “electrode-dielectric-electrode” arrangements in an ever increasing stack, or serially stringing together multiple capacitors.

Abstract: An electrically conductive tape for walls and ceilings is provided. The tape includes a substrate configured to be applied to at least one surface including at least one surface of a wall or ceiling and at least one conductive layer applied to the substrate. The conductive layer is penetrable by at least a conductor of an electrical device to provide an electrical connection thereto. In one embodiment the conductive layer is formed from a conductive composition including an electrically conductive material therein. The conductive composition can include a conductive ink. A method of manufacturing an electrically conductive tape or film for walls and ceilings is also provided. The method includes providing a conductive composition including an electrically conductive material therein, and providing a substrate configured to be applied to at least one surface including at least one surface of a wall or ceiling.

Abstract: An electrically conductive module is provided. The module includes a panel configured to engage with one or more conductive structural elements. The module further includes conductive layers formed on or in the panel. Each conductive layer has a terminal configured to be in electrical communication with at least one of the conductive structural elements. In one embodiment of the present invention, a first terminal is configured to be in electrical communication with a first conductive structural element and a second terminal is configured to be in electrical communication with a second conductive structural element. In another embodiment of the present invention, both a first terminal and a second terminal are configured to be in electrical communication with a first conductive structural element. In this embodiment, the first and second terminals are respectively configured to be in electrical communication with first and second conductive portions of the first conductive structural element.

Abstract: An electrically conductive element, including an insulator and a first conductor, is provided, which can be affixed to a second conductor consisting of conductive structural element, wherein the insulator is positioned between the first and second conductors to electrically isolate them. A power supply may be connected between the first and second conductors to provide power thereto, and an electrical device may be connected across the first and second conductors.