Patents by Inventor Liang-Chi Tu

Liang-Chi Tu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Polishing pad, manufacturing method of polishing pad and polishing method
    Patent number: 11850701
    Abstract: A polishing pad is provided. The polishing surface of the polishing pad corresponds to a two-dimensional orthogonal coordinate system having a first coordinate direction and a second coordinate direction, the rotating axis of the polishing pad corresponds to the original point of the two-dimensional orthogonal coordinate system, and the polishing pad includes a polishing layer and a surface pattern. The surface pattern is disposed in the polishing layer, and includes at least one first groove and at least one second groove respectively distributing along the first coordinate direction, wherein the at least one first groove has a first cutting trajectory direction, the first cutting trajectory direction is forward with the first coordinate direction, and the at least one second groove has a second cutting trajectory direction, the second cutting trajectory direction is reverse with the first coordinate direction.
    Type: Grant
    Filed: March 23, 2020
    Date of Patent: December 26, 2023
    Assignee: IV Technologies CO., Ltd.
    Inventors: Liang-Chi Tu, Yu-Piao Wang
  • POLISHING PAD, MANUFACTURING METHOD OF POLISHING PAD AND POLISHING METHOD
    Publication number: 20200306923
    Abstract: A polishing pad is provided. The polishing surface of the polishing pad corresponds to a two-dimensional orthogonal coordinate system having a first coordinate direction and a second coordinate direction, the rotating axis of the polishing pad corresponds to the original point of the two-dimensional orthogonal coordinate system, and the polishing pad includes a polishing layer and a surface pattern. The surface pattern is disposed in the polishing layer, and includes at least one first groove and at least one second groove respectively distributing along the first coordinate direction, wherein the at least one first groove has a first cutting trajectory direction, the first cutting trajectory direction is forward with the first coordinate direction, and the at least one second groove has a second cutting trajectory direction, the second cutting trajectory direction is reverse with the first coordinate direction.
    Type: Application
    Filed: March 23, 2020
    Publication date: October 1, 2020
    Applicant: IV Technologies CO., Ltd.
    Inventors: Liang-Chi Tu, Yu-Piao Wang