Patents by Inventor Liang Cui

Liang Cui has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 5811830
    Abstract: The present invention is achieved by layering a dielectric slab between a ground plane and a two dimensional quasi quantum well heterostructure and by switching between an unbiased state and a negative potential which is established between the quantum well heterostructure and the ground plane. In the unbiased state, the device supports wave propagation in the dielectric with a phase velocity similar to that of a wave propagating in a parallel plate waveguide. Upon application of the bias voltage, that is establishing a negative potential difference between contacts based on either side of the quantum well heterostructure, the conductivity of the quantum well decreases. Therefore, as the carrier wave propagates the wave interacts with a boundary similar to that of a dielectric-air interface. This new boundary condition, in turn, produces a faster phase velocity. Hence, toggling the bias modulates the quantum well conductivity which changes the phase velocity of the carrier wave.
    Type: Grant
    Filed: June 8, 1995
    Date of Patent: September 22, 1998
    Assignee: The United States of America as represented by the Secretary of the Army
    Inventors: Madan Dubey, Hong Liang Cui, Charles D. Hechtman, Norman J. Horing, George F. McLane
  • Patent number: 5801476
    Abstract: The invention is directed to resonators and more particularly to an MMIC-compatible resonator which can be fabricated on an MMIC chip using MMIC processing techniques. The MMIC-compatible resonator has a substrate approximately 100 microns thick made of semi-insulating GaAs and/or AlGaAs. The substrate flanks an air via on which is fabricated a thin film piezoelectric semi-insulating GaAs film, comprising the piezoelectrically active element. The piezoelectrically active element is flanked either laterally or from the top to bottom thereof by a pair of electrodes which serve to excite the thickness shear or thickness extensional mode of the thin film piezoelectrically active element. There are a number of III-V and II-VI binary compounds and ternary, and other piezoelectric semiconductor alloys, which can be used for the purposes of the invention. The thin film measures approximately 5 microns or less in thickness and is fabricated on the semi-insulating GaAs, on the ?110!, ?111! or ?100! axis thereof.
    Type: Grant
    Filed: August 9, 1996
    Date of Patent: September 1, 1998
    Assignee: The United States of America as represented by the Secretary of the Army
    Inventors: Dana J. Sturzebecher, John A. Kosinski, Arthur Ballato, Paul W. Cooke, Hong-Liang Cui