Abstract: A skived-fin annular heat sink is manufactured via a skived-fin technology and includes at least one bottom board and a plurality of fins. The at least one bottom board is bended to form a closed-shaped. The fins are extended outwardly from the at least one bottom board, wherein each of the fins has a bending portion for connecting the fin with the bottom board. Hence the skived-fin annular heat sink can be adapted to a chip of PCB with over limited space, and can used to increase the number of fins for increasing the heat-dissipating area between the chip and the heat sink.