Abstract: A smart thermostatic system is disclosed that applies one or more of a reinforcement and/or adaptive learning model for a new environment with the trained model from another environment so as to initiate status of a thermostatic device. In one example, the thermostatic system uses a pretrained machine learning model that is transferred from a first thermostatic system to a second thermostatic system in a similar sub-environment. Temperature data and other data collected by the thermostatic device is used to fine-tune and train the pretrained model to learn, predict, and better adjust the operation of the thermostatic system.

Abstract: A semiconductor device includes a first dielectric layer disposed over a substrate and a conductive feature, a doped dielectric layer disposed over the first dielectric layer, a first metal portion disposed in the first dielectric layer and in contact with the conductive feature, and a doped metal portion disposed over the first metal portion. The first metal portion and the doped metal portion include a same noble metal material. The doped dielectric layer and the doped metal portion include same dopants. The dopants are bonded to the noble metal material.

Abstract: An injection molding system includes an extruding system, a discharging channel, a molding device including a first and second mold cavities, and a pressure regulating system regulates pressures inside the first and second mold cavities. An injection molding method includes providing a molding device having a first and second mold cavities, a first feeding port in communication with the first mold cavity, and a second feeding port in communication with the second mold cavity; sensing a first pressure in the first mold cavity, and injecting a first gas into the first mold cavity until the first mold cavity is sensed to have a first predetermined pressure; and sensing a second pressure in the second mold cavity, and injecting a second gas into the second mold cavity until the second mold cavity is sensed to have a second predetermined pressure, wherein the first and second predetermined pressures are different.

Abstract: The embodiments of the present disclosure disclose an aircraft, including a housing, a first drive module, a first antenna module, a second drive module, a third drive module and a fourth drive module. The first drive module includes a first arm and a first drive assembly, one end of the first arm is arranged on the housing, and the first drive assembly is arranged at the other end of the first arm; the first antenna module is arranged at the other end of the first arm, and the first antenna module is located above the first drive assembly; and the second drive module includes a second arm and a second drive assembly, one end of the second arm is arranged on the housing, and the second drive assembly is arranged at the other end of the second arm.

Abstract: An AI-assisted automatic labeling system and a method thereof are disclosed. The method comprises steps: selecting images from microscopic images as candidate images, using a pre-labeling module to automatically label cells in the candidate images, and dividing the labeled images into training data and verification data; using a training module and the training data to train a basic model; using a verification module to verify and modify the basic model, wherein the verification module respectively verifies at least one cell area and at least one background area of the verification data to converge the basic model and form an automatic labeling model; using the automatic labeling model to automatically label cells in redundant images of the microscopic images. The basic model trained by the present invention can use few labeled images to perform regressive training and verification and then automatically labels the redundant images accurately and efficiently.

Abstract: A device includes a fin extending from a semiconductor substrate; a gate stack over the fin; a first spacer on a sidewall of the gate stack; a source/drain region in the fin adjacent the first spacer; an inter-layer dielectric layer (ILD) extending over the gate stack, the first spacer, and the source/drain region, the ILD having a first portion and a second portion, wherein the second portion of the ILD is closer to the gate stack than the first portion of the ILD; a contact plug extending through the ILD and contacting the source/drain region; a second spacer on a sidewall of the contact plug; and an air gap between the first spacer and the second spacer, wherein the first portion of the ILD extends across the air gap and physically contacts the second spacer, wherein the first portion of the ILD seals the air gap.

Abstract: A semiconductor device and a method of forming the same are provided. The semiconductor device includes a substrate, a gate structure, a dielectric structure and a contact structure. The substrate has source/drain (S/D) regions. The gate structure is on the substrate and between the S/D regions. The dielectric structure covers the gate structure. The contact structure penetrates through the dielectric structure to connect to the S/D region. A lower portion of a sidewall of the contact structure is spaced apart from the dielectric structure by an air gap therebetween, while an upper portion of the sidewall of the contact structure is in contact with the dielectric structure.

Abstract: An injection molding system includes a supplying unit configured to supply a flowable mixture; an injection unit communicable with the supplying unit, wherein the injection unit includes an outlet configured to discharge the flowable mixture; a molding device configured to receive the flowable mixture from the outlet and includes a mold cavity and a feeding port communicable with the mold cavity and engageable with the outlet; and a supporting device disposed between the injection unit and the molding device and configured to facilitate an engagement of the injection unit and the molding device. The supporting device includes a first element connected to the injection unit and a second element disposed on the molding device. The second element includes a slot configured to receive a protruding portion of the first element, the protruding portion of the first element is slidable within and along the slot of the second element.

Abstract: A method of forming a semiconductor structure includes the following operations. A semiconductor epitaxial layer is formed on a first semiconductor substrate. A first side of the semiconductor epitaxial layer is adhered to a transfer substrate by an adhesive layer covering the first side of the semiconductor epitaxial layer. The semiconductor epitaxial layer and the first semiconductor substrate are turned over by the transfer substrate. The first semiconductor substrate is removed to expose a second side of the semiconductor epitaxial layer opposite to the first side. A first semiconductor doped region is formed on the second side of the semiconductor epitaxial layer. After the first semiconductor doped region is formed, the adhesive layer and the transfer substrate are removed.

Abstract: Embodiments disclosed herein relate to using an implantation process and a melting anneal process performed on a nanosecond scale to achieve a high surface concentration (surface pile up) dopant profile and a retrograde dopant profile simultaneously. In an embodiment, a method includes forming a source/drain structure in an active area on a substrate, the source/drain structure including a first region comprising germanium, implanting a first dopant into the first region of the source/drain structure to form an amorphous region in at least the first region of the source/drain structure, implanting a second dopant into the amorphous region containing the first dopant, and heating the source/drain structure to liquidize and convert at least the amorphous region into a crystalline region, the crystalline region containing the first dopant and the second dopant.

Abstract: A system for remotely controlling microscopic machinery and a method thereof are provided. The system includes at least one local device and a remote host for sending a control command thereto. A microslide is placed on a microscopic camera device in the local device, and the microscopic camera device captures an image of the microslide according to a capture command in the control command. The local device transmits the image to the remote host in a video format. A motorized stage moves to a next preset position according to a movement command in the control command to capture another image of the microslide. The steps of capturing and transmitting the image and the step of moving are repeated until the microslide is captured completely. The invention can solve the problem of time delay when the image captured by the remote control microscopic camera device is displayed.

Abstract: A method includes forming a gate stack on a first portion of a semiconductor substrate, removing a second portion of the semiconductor substrate on a side of the gate stack to form a recess, growing a semiconductor region starting from the recess, implanting the semiconductor region with an impurity, and performing a melt anneal on the semiconductor region. At least a portion of the semiconductor region is molten during the melt anneal.

Abstract: The present invention provides a call processing method and a device. The call processing method includes: receiving, by a customized alerting tone server, a call request sent by a calling terminal, and forwarding the call request to a called terminal; receiving a called terminal ringing message, and playing a customized alerting tone audio stream and a customized alerting tone video stream to the calling terminal; receiving a called terminal message indicating that a called user answers a call, and performing call media resource negotiation and customized alerting tone video resource negotiation with the calling terminal; and stopping playing the customized alerting tone audio stream to the calling terminal, and playing the customized alerting tone video stream to the calling terminal. The customized alerting tone continuous playing solution of the present invention enriches user experience and improves network usage.

Abstract: A method of forming a semiconductor device includes forming a source/drain region and a gate electrode adjacent the source/drain region, forming a hard mask over the gate electrode, forming a bottom mask over the source/drain region, wherein the gate electrode is exposed, and performing a nitridation process on the hard mask over the gate electrode. The bottom mask remains over the source/drain region during the nitridation process and is removed after the nitridation. The method further includes forming a silicide over the source/drain region after removing the bottom mask.

Abstract: A device for measuring volume of spherical tanks, includes a base, four supporting rods, a driving mechanism, a rotating disc and a counterweight mechanism. The base is provided with a first through hole and a circular fixing base with a second through hole. The supporting rods are circumferentially provided on the fixing base, with a sliding rod slidably provided at the lower side. An outer end of the sliding rod is provided with a limiting plate. The driving mechanism can drive the sliding rods to move simultaneously in radial directions. The rotating disc with a third through hole is arranged on the fixing base, and is rotatably provided with a reel around which a steel tape is wound. A free end of the steel tape is provided with a balancing disc whose opposite sides are provided with laser rangefinders. The counterweight mechanism can keep the balancing disc stable.

Abstract: This application relates to the field of terminal technologies, and provides a Bluetooth communication method, a wearable device, and a system, to avoid always maintaining an HFP connection, so as to avoid an unnecessary delay or a call error caused when an electronic device processes a voice message. The Bluetooth communications system includes an electronic device and a wearable device, and an HFP connection is established between the electronic device and the wearable device. When the electronic device meets a preset condition, the HFP connection is automatically disconnected. The electronic device sends a first notification to the wearable device after receiving an incoming call, to reestablish the HFP connection. In this case, the electronic device may answer the incoming call by using the wearable device.

Abstract: An intelligent defecation device for living creature includes a device body, a supporting portion, an image module, and a first analysis module. The supporting portion is formed within the inner side of the device body for accommodating a moisture absorption member so as to allow the living creature to leave over its excrement therein. The image module is also arranged at the device body for dynamically capturing the images of the excrement in the supporting portion and outputting the image. The first analysis module is arranged in the device body and connected with the image module to analyze and calculate the defecation mode with the image based on preset or accumulated data, so as to generate a signal when an abnormal defecation mode is diagnosed.

Abstract: An intelligent defecation device for living creature includes a device body, a supporting portion, an image module, and a first analysis module. The supporting portion is formed within the inner side of the device body for accommodating a moisture absorption member so as to allow the living creature to leave over its excrement therein. The image module is also arranged at the device body for dynamically capturing the images of the excrement in the supporting portion and outputting the image. The first analysis module is arranged in the device body and connected with the image module to analyze and calculate the defecation mode with the image based on preset or accumulated data, so as to generate a signal when an abnormal defecation mode is diagnosed.

Abstract: An intelligent defecation device for living creature includes a device body, a supporting portion, an image module, and a first analysis module. The supporting portion is formed within the inner side of the device body for accommodating a moisture absorption member so as to allow the living creature to leave over its excrement therein. The image module is also arranged at the device body for dynamically capturing the images of the excrement in the supporting portion and outputting the image. The first analysis module is arranged in the device body and connected with the image module to analyze and calculate the defecation mode with the image based on preset or accumulated data, so as to generate a signal when an abnormal defecation mode is diagnosed.

Abstract: A touch panel includes a touch sensor layer including a first transparent electrode and a second transparent electrode, wherein an arrangement direction of the first transparent electrode can be perpendicular to that of the second transparent electrode, and both of the first and second transparent electrodes include two transparent metallic patterns which are stacked and electrically connected to each other.