Patents by Inventor Liang Harry

Liang Harry has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method to modulate the surface roughness of a plated deposit and create fine-grained flat bumps
    Publication number: 20070158199
    Abstract: The present invention relates to a plating bath consisting of a plating solution, accelerating agent and a suppressing agent and a method of forming contact formations on a semiconductor substrate. In an embodiment, the deposition of contact formations occurs in a two step deposition process wherein the deposition process has different deposition rates. Furthermore, the present invention includes a method of forming smooth, flat contact formations for use in electronic packages.
    Type: Application
    Filed: December 30, 2005
    Publication date: July 12, 2007
    Inventors: Scott Haight, Tzuen-Iuh Huang, Liang Harry