Patents by Inventor Liang He

Liang He has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12288867
    Abstract: A method and apparatus for controlling the atmosphere of a multizone calcination (firing) furnace for production of high-quality nickel-rich cathode material for lithium-ion and solid-state batteries. A high-quality oxygen-rich atmosphere is maintained to ensure the quality of the cathode material. An atmosphere control system continuously measures and analyzes the composition of the calcination furnace atmosphere in different zones and adjusts the flowrate of oxygen-rich atmosphere into the furnace to optimize the calcination process.
    Type: Grant
    Filed: August 7, 2023
    Date of Patent: April 29, 2025
    Assignee: Air Products and Chemicals, Inc.
    Inventors: Jingjing Cai, Paulina Weronika Kus, Liang He, Guido Plicht, David Millington
  • Publication number: 20250043217
    Abstract: A stripper composition and a method for stripping a photoresist are provided. The stripper composition includes an ether-alcohol-based organic solvent (A), another organic solvent (B), an alkaline substance (C), a substrate corrosion inhibitor (D), and water (E). The another organic solvent (B) does not include the ether-alcohol-based organic solvent. The alkaline substance (C) includes an organic base (C1), an inorganic base (C2), or a combination thereof. Based on a total usage amount of 100 parts by weight of the stripper composition, a usage amount of the ether-alcohol-based organic solvent (A) is 7 parts by weight to 70 parts by weight, and a usage amount of the substrate corrosion inhibitor (D) is greater than 0 part by weight and less than 18 parts by weight.
    Type: Application
    Filed: July 21, 2024
    Publication date: February 6, 2025
    Applicant: Advanced Echem Materials Company Limited
    Inventors: Chi-Liang He, Yun-Ju Chiang, Ting-Ruei Xu, Ming-Chia Tsai
  • Patent number: 12215816
    Abstract: What the present invention discloses belongs to the technical field of aluminum hoses, and in particular relates to a one-time punch formed aluminum hose whose head can be broken and used as a plug. A broken part is provided between an extrusion head and a plugging head, so that the connection between the extrusion head and the plugging head is relatively “fragile”. A user breaks the broken part to realize the separation of the plugging head from the extrusion head, and at the same time, the other end of the plugging head is inserted into an extrusion port and is in an interference fit with the extrusion port, thus achieving the effect of plugging.
    Type: Grant
    Filed: June 2, 2022
    Date of Patent: February 4, 2025
    Assignee: GOLD FORTUNE (GUANGDONG) IMPORT & EXPORT CO., LTD
    Inventors: Liang He, Jianyi Huang
  • Patent number: 12187899
    Abstract: The disclosure relates to a method for improving the alkali resistance and oxidation resistance of a benzothiazole disperse dye, and belongs to the field of disperse dyes. In the disclosure, 4 kinds of diazo components and 8 kinds of coupling components are used in designing and synthesizing 28 thiazole heterocyclic azo disperse dyes, and the alkali resistance and oxidation resistance of the disperse dyes are improved. Structure confirmation is performed on the synthetic disperse dyes, and the alkali resistance, oxidation resistance and other dyeing properties of the disperse dyes are tested.
    Type: Grant
    Filed: August 3, 2021
    Date of Patent: January 7, 2025
    Assignees: Qingdao University, Penglai Jiaxin Dye Chemical Co., LTD
    Inventors: Changhai Xu, Xiaoyan Wang, Jiaxue Yu, Liang He, Mingtao Qiu, Xinting Zhao, Jinmei Du, Jinglin Tang
  • Publication number: 20240396107
    Abstract: A battery pack, comprising: a housing; a battery cell assembly; a circuit board; and a battery cell supporting member. The battery pack further comprises a temperature detection device. The temperature detection device comprises: a temperature sensor for detecting the temperature of a battery cell surface; and a thermally conductive element disposed corresponding to the temperature sensor, wherein the thermally conductive element is located between the temperature sensor and the battery cell surface, transfers the temperature of the battery cell surface to the temperature sensor, and fixes the position of the temperature sensor relative to the battery cell surface, and wherein the cell supporting member is provided with a through hole corresponding to the position of the temperature detection device, and the through hole allows the temperature sensor and/or the thermally conductive element to be at least partially located in the through hole.
    Type: Application
    Filed: May 21, 2024
    Publication date: November 28, 2024
    Inventors: Ren Jie WANG, Ya Bin LIU, Liang He WANG, Hai Bo MA
  • Publication number: 20240384258
    Abstract: Embodiments disclosed herein provide a general, scalable, high-throughput, and high-resolution approach for experimental dissection of regulatory regions and driver nucleotides in the context of human biology and disease. Applicants present HiDRA, a novel high-resolution global screen for transcriptional regulatory activity in accessible chromatin regions, enabling high-efficiency, high-throughput, and high-resolution inference of regulatory activity.
    Type: Application
    Filed: May 17, 2024
    Publication date: November 21, 2024
    Inventors: Melina Claussnitzer, Liang He, Manolis Kellis, Xinchen Wang
  • Publication number: 20240362890
    Abstract: A data processing method includes: obtaining at least one frame of an original image; performing visual saliency detection on each frame of the original image in the at least one frame of the original image to obtain visual saliency data of each frame of the original image; performing differential processing on different positions of each frame of the original image to obtain at least one frame of a processed target image based on the visual saliency data; and encoding the processed target image.
    Type: Application
    Filed: April 9, 2024
    Publication date: October 31, 2024
    Inventors: Linlin CHEN, Liang HE
  • Publication number: 20240332134
    Abstract: Methods and apparatus to mitigate electromigration are disclosed. A disclosed example integrated circuit (IC) package includes a dielectric substrate, a contact pad at least partially extending though or positioned on the dielectric substrate, the contact pad including copper, and a metal interconnect coupled to the contact pad, the interconnect including indium.
    Type: Application
    Filed: March 30, 2023
    Publication date: October 3, 2024
    Inventors: Liang He, Jung Kyu Han, Gang Duan
  • Publication number: 20240329314
    Abstract: Disclosed is a mode scrambler. The mode scrambler includes a fastening connection component, a first translation plate and a second translation plate. The fastening connection component is provided with an L-shaped groove for placing an optical fiber. The first translation plate and the second translation plate are both connected to the fastening connection component, the first translation plate is configured to reciprocate relatively to the fastening connection component along a radial direction of the optical fiber, and the second translation plate is configured to reciprocate relatively to the fastening connection component in a vertical direction. The second translation plate is abutted against a top of the optical fiber and is in close contact with a part of the sinusoidal surface of the first translation plate. The optical fiber is enclosed among the fastening connection component, the first translation plate and the second translation plate.
    Type: Application
    Filed: June 12, 2024
    Publication date: October 3, 2024
    Applicant: WUHAN RAYCUS FIBER LASER TECHNOLOGIES CO., LTD.
    Inventors: Jixin SHI, Yang LIU, Liang HE, Dapeng YAN
  • Patent number: 12094962
    Abstract: The present invention relates to an enhancement-mode semiconductor device and a preparation method therefor. The device includes a substrate, a semiconductor epitaxial layer, a gate electrode, a source electrode, and a drain electrode. The epitaxial layer includes a nitride nucleation layer, a nitride stress buffer layer, a nitride channel layer, a primary epitaxial nitride barrier layer, a p-type nitride layer and a secondary epitaxial nitride barrier layer. By means of etching, the p-type nitride in a gate electrode region is reserved, realizing the depletion of a gate electrode channel. By means of maskless regrowth, the secondary epitaxial nitride barrier layer is grown on the primary epitaxial barrier layer and the p-type nitride layer in the gate electrode region, realizing a high-conduction access region.
    Type: Grant
    Filed: June 24, 2021
    Date of Patent: September 17, 2024
    Assignee: SUN YAT-SEN UNIVERSITY
    Inventors: Yang Liu, Liang He
  • Publication number: 20240213164
    Abstract: Embodiments disclosed herein include an electronic package. In an embodiment, the electronic package comprises a package substrate, and an opening in the package substrate. In an embodiment, a plurality of first pads are provided at a bottom of the opening, and a bridge die is in the opening. In an embodiment, the bridge die comprises a plurality of second pads that are coupled to the first pads by solder. In an embodiment, a non-conductive film (NCF) is around the solder between the first pads and the second pads.
    Type: Application
    Filed: December 27, 2022
    Publication date: June 27, 2024
    Inventors: Minglu LIU, Gang DUAN, Liang HE, Ziyin LIN, Elizabeth NOFEN, Yiqun BAI, Jonathan ATKINS, Jesus S. NIETO PESCADOR, Srinivas V. PIETAMBARAM, Kristof DARMAWIKARTA
  • Publication number: 20240213198
    Abstract: An electronic package comprises a first die having at least one first interconnect with solder over or under a first metal feature. A second die has at least one second interconnect to the first die, each second interconnect comprising a second metal feature comprising copper, solder over or under the second metal feature, and a layer between the solder and the second metal feature, wherein the layer comprises iron and has a different material than material of the first interconnect.
    Type: Application
    Filed: December 22, 2022
    Publication date: June 27, 2024
    Applicant: Intel Corporation
    Inventors: Liang He, Yue Deng, Gang Duan, Jung Kyu Han, Ali Lehaf, Srinivas Pietambaram
  • Publication number: 20240186263
    Abstract: The present disclosure is directed to a semiconductor carrier platform having a support panel with a top surface and a bottom surface, with the top surface providing a working surface for assembling IC packages using panel-level packaging technology. In an aspect, a backside molding layer may be positioned on the bottom surface of the support panel to prevent or correct any panel warpage. In another aspect, a removable film may be positioned between the bottom surface of the support panel and the backside molding layer to allow the support panel to be readily cleaned and reused.
    Type: Application
    Filed: December 1, 2022
    Publication date: June 6, 2024
    Inventors: Hong Seung YEON, Liang HE, Whitney BRYKS, Jung Kyu HAN, Gang DUAN
  • Patent number: 11987790
    Abstract: Embodiments disclosed herein provide a general, scalable, high-throughput, and high-resolution approach for experimental dissection of regulatory regions and driver nucleotides in the context of human biology and disease. Applicants present HiDRA, a novel high-resolution global screen for transcriptional regulatory activity in accessible chromatin regions, enabling high-efficiency, high-throughput, and high-resolution inference of regulatory activity.
    Type: Grant
    Filed: October 17, 2018
    Date of Patent: May 21, 2024
    Assignees: Massachusetts Institute of Technology, Beth Israel Deaconess Medical Center
    Inventors: Melina Claussnitzer, Liang He, Manolis Kellis, Xinchen Wang
  • Publication number: 20240109802
    Abstract: A controller, process, and glass manufacturing apparatus can be configured to minimize defects. Embodiments can be adapted to control injection of nitrogen and/or argon and a mixture of nitrogen and hydrogen or nitrogen, hydrogen, and argon during glass float manufacturing to facilitate a pre-selected hydrogen concentration within a tin bath furnace while also minimizing glass surface defects that can be caused from tin condensation and tin bath impurity concentrations. Empirical use data can also be collected and provided to a pre-defined machine learning element of a host device to update a pre-defined control scheme of a controller for adapting the operational condition set points or other target values to account for furnace operation history and performance.
    Type: Application
    Filed: June 27, 2023
    Publication date: April 4, 2024
    Applicant: Air Products and Chemicals, Inc.
    Inventors: Eric R. Seo, Liang He, Reed Jacob Hendershot, Michael J. Gallagher, Ranajit Ghosh
  • Patent number: 11897030
    Abstract: A method and system for providing cooling to a part formed using high-temperature additive manufacturing process. Infrared sensors or cameras are used to measure sidewall temperatures and, optionally, top layer temperature. Coolant nozzles provide cooling to the sidewalls of the finished layers and, optionally, to the top layer. The coolant intensity of the coolant nozzles is controlled in order to reduce temperature gradients between layers and/or to maintain temperatures in each layer below preferred maximum temperature.
    Type: Grant
    Filed: June 8, 2021
    Date of Patent: February 13, 2024
    Assignee: Air Products and Chemicals, Inc.
    Inventors: Liang He, Ranajit Ghosh, Mark Kurt Weise
  • Publication number: 20240037727
    Abstract: A method for fault isolation includes: acquiring a thermal imaging picture of a surface of a to-be-tested chip, the thermal imaging picture being obtained by scanning the to-be-tested chip to which a test signal is applied through an infrared thermal imaging device, and analyzing the thermal imaging picture to obtain a phase angle of each point on the surface of the to-be-tested chip; acquiring a three-dimensional image of the surface of the to-be-tested chip, the three-dimensional image being obtained by scanning the to-be-tested chip to which the test signal is applied through an image scanning device, and analyzing the three-dimensional image to obtain a three-dimensional coordinate of each point on the surface of the to-be-tested chip; calculating a three-dimensional coordinate of the fault in the to-be-tested chip according to the phase angle and the three-dimensional coordinate of each point on the surface of the to-be-tested chip.
    Type: Application
    Filed: December 5, 2022
    Publication date: February 1, 2024
    Applicant: China Electronics Reliability And Environmental Testing Institute
    Inventors: Chao Pang, Yiqiang Ni, Liang He, Shizheng Yang, Yinle Li
  • Publication number: 20230415103
    Abstract: The present invention belongs to the technical field of membranes, and in particular relates to a polyamide composite reverse osmosis membrane and to a preparation method thereof. The polyamide composite reverse osmosis membrane provided by the present invention comprises: a nascent membrane and a temperature-responsive polypeptide grafted to a surface of the nascent membrane; the nascent membrane comprises a support layer and a polyamide separation layer joined to the support layer; the temperature-responsive polypeptide is a homopolymeric (L-glutamate) containing oligo(ethylene glycol). The polyamide composite reverse osmosis membrane provided in the present invention has excellent pollution resistance and oxidation resistance capabilities, has a low difficulty of cleaning, and has extremely broad market prospects.
    Type: Application
    Filed: July 6, 2022
    Publication date: December 28, 2023
    Applicant: HUNAN KEENSEN TECHNOLOGY CO., LTD.
    Inventors: Liang ZHAO, Haohao ZENG, Jing LONG, Xing CHEN, Jiaojiao TU, Zhaohua REN, Yu LIU, Chudao SHI, Liang HE
  • Patent number: D1045560
    Type: Grant
    Filed: January 19, 2022
    Date of Patent: October 8, 2024
    Assignee: Techtronic Cordless GP
    Inventors: Shane E. Hurin, Nataraj Chandrasekharan, Matthew T. Mandel, Michael Nemshon, Steven T. O'Shields, Zachary R. Jones, Jonathan C. Loftis, Samantha K. Smith, Michael Romano, Adam Gathers, Liang He Wang, Long Long Hu, Wei Bing Wang, Silas Strawderman
  • Patent number: D1067186
    Type: Grant
    Filed: January 19, 2022
    Date of Patent: March 18, 2025
    Assignee: Techtronic Cordless GP
    Inventors: Shane E. Hurin, Nataraj Chandrasekharan, Matthew T. Mandel, Michael Nemshon, Michael Romano, Nicholas Scott Norton, Ryan Altenburger, Liang He Wang, Sheng Ping Li, Zhao Jie Guo