Patents by Inventor Lianghui Wu

Lianghui Wu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8556318
    Abstract: An electric-controlled operator includes, in part, a first group of grippers and a second group of grippers which are coupled to a base. Grippers in the first group of grippers are adapted to cooperatively grip an object and cooperatively release the object. Grippers in the second group of grippers are adapted to cooperatively grip an object and cooperatively release the object. When the first (or the second) group of grippers cooperatively grips an object, the second (or the first) group of grippers is in a state in which the object is released. The first and second groups of grippers are adapted to put in and take out objects from the same surface of the base thus eliminating the need for turning of the base during the operation.
    Type: Grant
    Filed: December 14, 2011
    Date of Patent: October 15, 2013
    Assignee: Semiconductor Manufacturing International (Beijing) Corporation
    Inventor: Lianghui Wu
  • Publication number: 20130043696
    Abstract: An electric-controlled operator includes, in part, a first group of grippers and a second group of grippers which are coupled to a base. Grippers in said first group of grippers are adapted to cooperatively grip an object and cooperatively release the object. Grippers in the second group of grippers are adapted to cooperatively grip an object and cooperatively release the object. When the first (or the second) group of grippers cooperatively grips an object, the second (or the first) group of grippers is in a state in which the object is released. The first and second groups of grippers are adapted to put in and take out objects from the same surface of the said base thus eliminating the need for turning of the base during the operation.
    Type: Application
    Filed: December 14, 2011
    Publication date: February 21, 2013
    Applicant: SEMICONDUCTOR MANUFACTURING INTERNATIONAL (BEIJING) CORPORATION
    Inventor: Lianghui Wu