Abstract: A thermal module includes a heat spreader (50) for contacting with a heat-generating electronic device mounted on a printed circuit board, a heat sink (60), a heat pipe (70) thermally connecting the heat spreader and the heat sink. A frame (80) is detachably mounted on the heat spreader, for fixing the heat spreader to the printed circuit board so that the heat spreader can thermally contact with the heat-generating device on the printed circuit board. The heat spreader has a simple polygonal configuration. The frame is formed by stamping a metal sheet or plastics injection molding.

Abstract: A mounting device for a heat sink includes a basis and a pair of operating bodies. Two pair of supporting members are provided on opposite sides of the basis. The operating body includes a pole connecting the supporting members, a pivot member pivotably attached to the pole, and at least a spring member encircling the pole. The pivot member includes a pressing portion adapted for pressing the heat sink. One end of the spring member is fixed on one of the supporting members, and the other end of the spring member is secured with the pivot member. The pivot member is pivotable from a first position to a second position under action of a force and returns back to the first position from the second position under action of the spring member after withdrawing the force.

Abstract: A fastener (20) comprises a fixing post (21) and a washer (25). The fixing post has a locking tongue (213) and a slot (2110) just above the locking tongue. The washer defines a hole (253) and has at least one tab (255) near the hole. The fixing post extends through a heat sink (100) and engages with the washer by fitting the washer into the slot, whereby the washer is sandwiched between the locking tongue and a base (12) of the heat sink and the fixing post is securely attached to the heat sink. The tab engages with a straight side of the locking tongue. The fixing post is used for threadedly engaging with a screw thereby attaching the heat sink to an electronic device mounted on a printed circuit board.

Abstract: A heat dissipation device includes a heat sink, a retention module and a clip. The retention module includes a plurality of locking portions. The clip includes a main piece, an operating piece pivotally connecting with the main piece, and a buckling piece pivotally connecting with the operating piece. The main piece includes a pressing beam resting on the heat sink and a clamping portion engaging with a corresponding locking portion of the retention module. By operating the operating piece, the heat dissipation device has two positions, at a first of which a clamping portion of the buckling piece engages with a corresponding locking portion of the retention module and the pressing beam of the main piece presses the heat sink toward the retention module; at a second of the two positions, the clamping portion of the buckling piece disengages from the retention module.

Abstract: A thermal module includes a heat spreader (50) for contacting with a heat-generating electronic device mounted on a printed circuit board, a heat sink (60), a heat pipe (70) thermally connecting the heat spreader and the heat sink. A frame (80) is detachably mounted on the heat spreader, for fixing the heat spreader to the printed circuit board so that the heat spreader can thermally contact with the heat-generating device on the printed circuit board. The heat spreader has a simple polygonal configuration. The frame is formed by stamping a metal sheet or plastics injection molding.

Abstract: A heat dissipation device for dissipating heat from an electronic element includes a heat spreader (12) for contacting with the electronic element, a conducting member (30) having a lower base plate (32) thermally contacting with the heat spreader and an upper base plate (34) with a plurality of first fins (36) extending downwardly from the upper base plate towards the lower base plate and a connecting portion (33) interconnecting the lower and upper base plate. A plurality of second fins (38) is mounted on the conducting member. A plurality of heat pipes (40) thermally connects the heat spreader and the conducting member and the second fins to transfer heat from the heat spreader to the conducting member and the second fins. A fan (20) is mounted adjacent to air passages of the first and second fins for generating a forced airflow through the air passages.

Abstract: A heat dissipation device for dissipating heat from an electronic element includes a heat spreader (12) for contacting with the electronic element, a conducting member (30) having a lower base plate (32) thermally contacting with the heat spreader and an upper base plate (34) with a plurality of first fins (36) extending downwardly from the upper base plate towards the lower base plate and a connecting portion (33) interconnecting the lower and upper base plate. A plurality of second fins (38) is mounted on the conducting member. A plurality of heat pipes (40) thermally connects the heat spreader and the conducting member and the second fins to transfer heat from the heat spreader to the conducting member and the second fins. A fan (20) is mounted adjacent to air passages of the first and second fins for generating a forced airflow through the air passages.

Abstract: A heat dissipation device includes a heat spreader (100) for contacting a heat-generating component, a heat sink (200) mounted on the heat spreader, a fan (300) mounted on the heat sink, a heat-dissipating component (400), and a heat pipe (500) thermally connecting the heat spreader, the heat sink and the heat-dissipating component together. The heat sink comprises a core (210) having an axis substantially perpendicular to the heat spreader, and a plurality of fins (220) outwardly and radially extending from the core.

Abstract: A heat dissipation device includes a heat sink, a retention module and a clip. The retention module includes a plurality of locking portions. The clip includes a main piece, an operating piece pivotally connecting with the main piece, and a buckling piece pivotally connecting with the operating piece. The main piece includes a pressing beam resting on the heat sink and a clamping portion engaging with a corresponding locking portion of the retention module. By operating the operating piece, the heat dissipation device has two positions, at a first of which a clamping portion of the buckling piece engages with a corresponding locking portion of the retention module and the pressing beam of the main piece presses the heat sink toward the retention module; at a second of the two positions, the clamping portion of the buckling piece disengages from the retention module.

Abstract: A heat dissipation device includes a base (10), a first heat sink (20) disposed on the base (10), a second heat sink (30) attached on top of the first heat sink and a first heat pipe (40) connecting the base and the first heat sink and a pair of second heat pipes (50) connecting the base and the second heat sink.

Abstract: A mounting apparatus (1) includes a locking pin (10) and an operation member (20) attaching to the locking pin. Resilient prongs (13) are formed at a first end of the locking pin. A detent (16) is formed at a periphery of the locking pin. The operation member comprises a compressing portion (21) capable of compressing the prongs radially to a predetermined compressed state when the operation member moves axially in a first direction from the second end to the first end and capable of releasing the prongs when the operation member moves axially in an opposite second direction to allow the prongs to return to their original states, and a catch (24) to engage with the detent to prevent movement of the operation member in the second direction to maintain the prongs at the predetermined compressed state.

Abstract: A heat dissipation device includes a base, a plurality of first fins, a plate, a plurality of second fins and two heat pipes. Each heat pipe includes a heat-receiving portion sandwiched between the base and the first fins, a heat-exchange portion sandwiched between the plate and the first fins, a connecting portion connecting the heat-receiving portion and the heat-exchange portion, a heat-discharging portion extending through the plate and inserted into the second fins. At least one of the heat pipes defines two different planes which intercross at the heat-exchange portion of the at least one of the heat pipes.

Abstract: A mounting device for a heat sink includes a basis and a pair of operating bodies. Two pair of supporting members are provided on opposite sides of the basis. The operating body includes a pole connecting the supporting members, a pivot member pivotably attached to the pole, and at least a spring member encircling the pole. The pivot member includes a pressing portion adapted for pressing the heat sink. One end of the spring member is fixed on one of the supporting members, and the other end of the spring member is secured with the pivot member. The pivot member is pivotable from a first position to a second position under action of a force and returns back to the first position from the second position under action of the spring member after withdrawing the force.

Abstract: A mounting apparatus (1) includes a locking pin (10) and an operation member (20) attaching to the locking pin. Resilient prongs (13) are formed at a first end of the locking pin. A detent (16) is formed at a periphery of the locking pin. The operation member comprises a compressing portion (21) capable of compressing the prongs radially to a predetermined compressed state when the operation member moves axially in a first direction from the second end to the first end and capable of releasing the prongs when the operation member moves axially in an opposite second direction to allow the prongs to return to their original states, and a catch (24) to engage with the detent to prevent movement of the operation member in the second direction to maintain the prongs at the predetermined compressed state.