Patents by Inventor Liang-Jen Lin

Liang-Jen Lin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11955298
    Abstract: A button module is provided. The button module comprises a base, a pressing part, and an elastic part. The pressing part includes a fixed end and a free end. The fixed end is pivotally connected to the base in a first axial direction. The elastic part is disposed on a side of the pressing part facing the base. The elastic part includes a first damping portion and a second damping portion selectively pressing against the base, where a hardness of the first damping portion is different from a hardness of the second damping portion.
    Type: Grant
    Filed: August 30, 2022
    Date of Patent: April 9, 2024
    Assignee: ASUSTEK COMPUTER INC.
    Inventors: Te-Wei Huang, Zih-Siang Huang, Jhih-Wei Rao, Hung-Chieh Wu, Liang-Jen Lin
  • Publication number: 20240008217
    Abstract: A thermal dissipation device for a handheld electronic device is provided. The thermal dissipation device includes a thermoelectric cooling chip, a temperature sensor, a humidity sensor, and a processing unit. The thermoelectric cooling chip has a cold surface and a hot surface. The cold surface is attached on a heating surface of the handheld electronic device by means of a heat conduction structure, and has a cold surface temperature. The temperature sensor and the humidity sensor are disposed in an area adjacent to the thermoelectric cooling chip for generating an environmental temperature and an environmental humidity respectively. The processing unit is configured to calculate a dew point temperature based on the environmental temperature and the environmental humidity; and determine whether to stop the thermoelectric cooling chip or not based on the cold surface temperature, the dew point temperature, and a heating surface temperature of the handheld electronic device.
    Type: Application
    Filed: January 20, 2023
    Publication date: January 4, 2024
    Inventors: Jyun-Miao HONG, Jhih-Wei RAO, Zih-Siang HUANG, Chieh LI, Chen-Yu HSU, Chih-Hsien YANG, Hung-Chieh WU, Liang-Jen LIN
  • Publication number: 20240008201
    Abstract: A thermal dissipation holder for a handheld electronic device is provided. The thermal dissipation holder includes a main structure, a movable element, an elastic element, and a locker. The main structure has a front surface and a rear surface. The movable element is movably connected to the main structure along a first direction and has a clamp portion at a side away from the carrier. One end of the elastic element is connected to the main structure. The other end of the elastic element is connected to the movable element. The elastic element drives the movable element to move along the first direction. The locker is disposed in the main structure and has a locking portion, where a position of the locking portion corresponds to that of the clamp portion, and the locker is selectively engaged with the clamp portion through the locking portion to lock the movable element.
    Type: Application
    Filed: January 13, 2023
    Publication date: January 4, 2024
    Inventors: Jhih-Wei RAO, Zih-Siang HUANG, Hung-Chieh WU, Liang-Jen LIN
  • Publication number: 20240008227
    Abstract: A heat dissipation holder applied to a handheld electronic device is provided. The heat dissipation holder includes a base, a cover, a heat dissipation module, and an air guiding structure. The base includes a first side and a second side that are opposite to each other and a front surface and a rear surface that are opposite to each other. The first side includes a first opening. The cover is combined onto the front surface to form an accommodating space with the base. The cover includes an air inlet region. The heat dissipation module is disposed in the accommodating space. The air guiding structure is disposed on the cover and extends to the first opening. The first opening, the air inlet region, and the air guiding structure form an airflow channel between the heat dissipation module and the cover.
    Type: Application
    Filed: January 13, 2023
    Publication date: January 4, 2024
    Inventors: Jhih-Wei RAO, Zih-Siang HUANG, Hung-Chieh WU, Liang-Jen LIN
  • Publication number: 20230223218
    Abstract: A button module is provided. The button module comprises a base, a pressing part, and an elastic part. The pressing part includes a fixed end and a free end. The fixed end is pivotally connected to the base in a first axial direction. The elastic part is disposed on a side of the pressing part facing the base. The elastic part includes a first damping portion and a second damping portion selectively pressing against the base, where a hardness of the first damping portion is different from a hardness of the second damping portion.
    Type: Application
    Filed: August 30, 2022
    Publication date: July 13, 2023
    Inventors: Te-Wei HUANG, Zih-Siang HUANG, Jhih-Wei RAO, Hung-Chieh WU, Liang-Jen LIN
  • Patent number: 9444144
    Abstract: An electronic device is provided. The electronic device includes a conductive housing, a first antenna element, a second antenna element and an insulation structure. The first antenna element is disposed in the conductive housing. The second antenna element is disposed on an external surface of the conductive housing and is opposite to the first antenna element. The conductive housing generates a first current in response to the operation of the second antenna element. The insulation structure penetrates through the conductive housing and extends from at least one side of the conductive housing to the second antenna element. The conductive housing generates an induction current in response to the operation of the first antenna element. The insulation structure blocks the induction current so that the conductive housing generates a second current, and a direction of the first current is the same as a direction of the second current.
    Type: Grant
    Filed: January 13, 2014
    Date of Patent: September 13, 2016
    Assignee: ASUSTeK COMPUTER INC.
    Inventors: Tsung-Han Cheng, Liang-Jen Lin, Hung-Chieh Wu
  • Publication number: 20140198010
    Abstract: An electronic device is provided. The electronic device includes a conductive housing, a first antenna element, a second antenna element and an insulation structure. The first antenna element is disposed in the conductive housing. The second antenna element is disposed on an external surface of the conductive housing and is opposite to the first antenna element. The conductive housing generates a first current in response to the operation of the second antenna element. The insulation structure penetrates through the conductive housing and extends from at least one side of the conductive housing to the second antenna element. The conductive housing generates an induction current in response to the operation of the first antenna element. The insulation structure blocks the induction current so that the conductive housing generates a second current, and a direction of the first current is the same as a direction of the second current.
    Type: Application
    Filed: January 13, 2014
    Publication date: July 17, 2014
    Applicant: ASUSTeK COMPUTER INC.
    Inventors: Tsung-Han Cheng, Liang-Jen Lin, Hung-Chieh Wu
  • Publication number: 20130250499
    Abstract: An electronic device including a main body, a support arms, and a display is provided. The main body has a positioning portion. A first end of the support arm is pivoted to the main body, and the support arm is telescopic. A second end of the support arm is pivoted to the display. When the display is opened, the support arm rotates such that the display stands, and the display is driven to rotate by retracting the support arm to adjust a tilting angle of the display. At this time, an edge of the display is supported on the positioning portion of the main body.
    Type: Application
    Filed: February 8, 2013
    Publication date: September 26, 2013
    Applicant: ASUSTeK COMPUTER INC.
    Inventors: Chang-Yi Tseng, Hung-Chieh Wu, Liang-Jen Lin
  • Publication number: 20050019679
    Abstract: A method of fabricating a color filter substrate is described. A black matrix is formed on a substrate. A color photoresist is formed for covering the black matrix. A photomask is located over the substrate, and then an exposure process is performed. The photomask comprises a transparent region, a partial transparent region and a no-transparent region, wherein the partial transparent region is located between the transparent region and the no-transparent region and is also located at the edge of the black matrix. A development process is performed for patterning the color photoresist. Since the exposure process is performed with the photomask via the partial transparent region, the issue that the height difference exists at the edge of the black matrix due to using black resin can be resolved.
    Type: Application
    Filed: March 25, 2004
    Publication date: January 27, 2005
    Inventors: Wen-Chin Lo, Chien-Hsing Li, Liang-Jen Lin
  • Patent number: D687031
    Type: Grant
    Filed: May 30, 2012
    Date of Patent: July 30, 2013
    Assignee: ASUSTeK Computer Inc.
    Inventors: Yi-Chia Chen, Chang-Yi Tseng, Liang-Jen Lin, Yi-Chang Chen, Ke-Ming Chen, Hsien-Kuang Chiu, Cheng-Yao Huang
  • Patent number: D696659
    Type: Grant
    Filed: May 23, 2013
    Date of Patent: December 31, 2013
    Assignee: ASUSTeK Computer Inc.
    Inventors: Yi-Chia Chen, Chang-Yi Tseng, Liang-Jen Lin, Yi-Chang Chen, Ke-Ming Chen, Hsien-Kuang Chiu, Cheng-Yao Huang
  • Patent number: D696660
    Type: Grant
    Filed: May 23, 2013
    Date of Patent: December 31, 2013
    Assignee: ASUSTeK Computer Inc.
    Inventors: Yi-Chia Chen, Chang-Yi Tseng, Liang-Jen Lin, Yi-Chang Chen, Ke-Ming Chen, Hsien-Kuang Chiu, Cheng-Yao Huang
  • Patent number: D696661
    Type: Grant
    Filed: May 23, 2013
    Date of Patent: December 31, 2013
    Assignee: ASUSTeK Computer Inc.
    Inventors: Yi-Chia Chen, Chang-Yi Tseng, Liang-Jen Lin, Yi-Chang Chen, Ke-Ming Chen, Hsien-Kuang Chiu, Cheng-Yao Huang
  • Patent number: D865736
    Type: Grant
    Filed: July 12, 2018
    Date of Patent: November 5, 2019
    Assignee: ASUSTeK COMPUTER INC.
    Inventors: Yan-Jhang Cheng, Liang-Jen Lin, Hung-Chieh Wu, Min-Chieh Yang, Chung-Wei Wu, Hsin-Hua Hsieh
  • Patent number: D884689
    Type: Grant
    Filed: September 27, 2018
    Date of Patent: May 19, 2020
    Assignee: ASUSTeK COMPUTER INC.
    Inventors: Chui-Hung Chen, Zih-Siang Huang, Hung-Chieh Wu, Liang-Jen Lin, Ching-Yuan Yang, Cheng-Han Chung, Chia-Min Cheng
  • Patent number: D888700
    Type: Grant
    Filed: August 17, 2018
    Date of Patent: June 30, 2020
    Assignee: ASUSTEK COMPUTER INC.
    Inventors: Zih-Siang Huang, Yan-Jhang Cheng, Liang-Jen Lin, Hung-Chieh Wu, Min-Chieh Yang, Chung-Wei Wu, Hsin-Hua Hsieh
  • Patent number: D968391
    Type: Grant
    Filed: June 28, 2018
    Date of Patent: November 1, 2022
    Assignee: ASUSTeK COMPUTER INC.
    Inventors: Chuan-Hao Wen, Liang-Jen Lin, Hung-Chieh Wu, Min-Chieh Yang, Chung-Wei Wu