Patents by Inventor Liang-Jen Lin
Liang-Jen Lin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Patent number: 11955298Abstract: A button module is provided. The button module comprises a base, a pressing part, and an elastic part. The pressing part includes a fixed end and a free end. The fixed end is pivotally connected to the base in a first axial direction. The elastic part is disposed on a side of the pressing part facing the base. The elastic part includes a first damping portion and a second damping portion selectively pressing against the base, where a hardness of the first damping portion is different from a hardness of the second damping portion.Type: GrantFiled: August 30, 2022Date of Patent: April 9, 2024Assignee: ASUSTEK COMPUTER INC.Inventors: Te-Wei Huang, Zih-Siang Huang, Jhih-Wei Rao, Hung-Chieh Wu, Liang-Jen Lin
-
Publication number: 20240008217Abstract: A thermal dissipation device for a handheld electronic device is provided. The thermal dissipation device includes a thermoelectric cooling chip, a temperature sensor, a humidity sensor, and a processing unit. The thermoelectric cooling chip has a cold surface and a hot surface. The cold surface is attached on a heating surface of the handheld electronic device by means of a heat conduction structure, and has a cold surface temperature. The temperature sensor and the humidity sensor are disposed in an area adjacent to the thermoelectric cooling chip for generating an environmental temperature and an environmental humidity respectively. The processing unit is configured to calculate a dew point temperature based on the environmental temperature and the environmental humidity; and determine whether to stop the thermoelectric cooling chip or not based on the cold surface temperature, the dew point temperature, and a heating surface temperature of the handheld electronic device.Type: ApplicationFiled: January 20, 2023Publication date: January 4, 2024Inventors: Jyun-Miao HONG, Jhih-Wei RAO, Zih-Siang HUANG, Chieh LI, Chen-Yu HSU, Chih-Hsien YANG, Hung-Chieh WU, Liang-Jen LIN
-
Publication number: 20240008201Abstract: A thermal dissipation holder for a handheld electronic device is provided. The thermal dissipation holder includes a main structure, a movable element, an elastic element, and a locker. The main structure has a front surface and a rear surface. The movable element is movably connected to the main structure along a first direction and has a clamp portion at a side away from the carrier. One end of the elastic element is connected to the main structure. The other end of the elastic element is connected to the movable element. The elastic element drives the movable element to move along the first direction. The locker is disposed in the main structure and has a locking portion, where a position of the locking portion corresponds to that of the clamp portion, and the locker is selectively engaged with the clamp portion through the locking portion to lock the movable element.Type: ApplicationFiled: January 13, 2023Publication date: January 4, 2024Inventors: Jhih-Wei RAO, Zih-Siang HUANG, Hung-Chieh WU, Liang-Jen LIN
-
Publication number: 20240008227Abstract: A heat dissipation holder applied to a handheld electronic device is provided. The heat dissipation holder includes a base, a cover, a heat dissipation module, and an air guiding structure. The base includes a first side and a second side that are opposite to each other and a front surface and a rear surface that are opposite to each other. The first side includes a first opening. The cover is combined onto the front surface to form an accommodating space with the base. The cover includes an air inlet region. The heat dissipation module is disposed in the accommodating space. The air guiding structure is disposed on the cover and extends to the first opening. The first opening, the air inlet region, and the air guiding structure form an airflow channel between the heat dissipation module and the cover.Type: ApplicationFiled: January 13, 2023Publication date: January 4, 2024Inventors: Jhih-Wei RAO, Zih-Siang HUANG, Hung-Chieh WU, Liang-Jen LIN
-
Publication number: 20230223218Abstract: A button module is provided. The button module comprises a base, a pressing part, and an elastic part. The pressing part includes a fixed end and a free end. The fixed end is pivotally connected to the base in a first axial direction. The elastic part is disposed on a side of the pressing part facing the base. The elastic part includes a first damping portion and a second damping portion selectively pressing against the base, where a hardness of the first damping portion is different from a hardness of the second damping portion.Type: ApplicationFiled: August 30, 2022Publication date: July 13, 2023Inventors: Te-Wei HUANG, Zih-Siang HUANG, Jhih-Wei RAO, Hung-Chieh WU, Liang-Jen LIN
-
Patent number: 9444144Abstract: An electronic device is provided. The electronic device includes a conductive housing, a first antenna element, a second antenna element and an insulation structure. The first antenna element is disposed in the conductive housing. The second antenna element is disposed on an external surface of the conductive housing and is opposite to the first antenna element. The conductive housing generates a first current in response to the operation of the second antenna element. The insulation structure penetrates through the conductive housing and extends from at least one side of the conductive housing to the second antenna element. The conductive housing generates an induction current in response to the operation of the first antenna element. The insulation structure blocks the induction current so that the conductive housing generates a second current, and a direction of the first current is the same as a direction of the second current.Type: GrantFiled: January 13, 2014Date of Patent: September 13, 2016Assignee: ASUSTeK COMPUTER INC.Inventors: Tsung-Han Cheng, Liang-Jen Lin, Hung-Chieh Wu
-
Publication number: 20140198010Abstract: An electronic device is provided. The electronic device includes a conductive housing, a first antenna element, a second antenna element and an insulation structure. The first antenna element is disposed in the conductive housing. The second antenna element is disposed on an external surface of the conductive housing and is opposite to the first antenna element. The conductive housing generates a first current in response to the operation of the second antenna element. The insulation structure penetrates through the conductive housing and extends from at least one side of the conductive housing to the second antenna element. The conductive housing generates an induction current in response to the operation of the first antenna element. The insulation structure blocks the induction current so that the conductive housing generates a second current, and a direction of the first current is the same as a direction of the second current.Type: ApplicationFiled: January 13, 2014Publication date: July 17, 2014Applicant: ASUSTeK COMPUTER INC.Inventors: Tsung-Han Cheng, Liang-Jen Lin, Hung-Chieh Wu
-
Publication number: 20130250499Abstract: An electronic device including a main body, a support arms, and a display is provided. The main body has a positioning portion. A first end of the support arm is pivoted to the main body, and the support arm is telescopic. A second end of the support arm is pivoted to the display. When the display is opened, the support arm rotates such that the display stands, and the display is driven to rotate by retracting the support arm to adjust a tilting angle of the display. At this time, an edge of the display is supported on the positioning portion of the main body.Type: ApplicationFiled: February 8, 2013Publication date: September 26, 2013Applicant: ASUSTeK COMPUTER INC.Inventors: Chang-Yi Tseng, Hung-Chieh Wu, Liang-Jen Lin
-
Publication number: 20050019679Abstract: A method of fabricating a color filter substrate is described. A black matrix is formed on a substrate. A color photoresist is formed for covering the black matrix. A photomask is located over the substrate, and then an exposure process is performed. The photomask comprises a transparent region, a partial transparent region and a no-transparent region, wherein the partial transparent region is located between the transparent region and the no-transparent region and is also located at the edge of the black matrix. A development process is performed for patterning the color photoresist. Since the exposure process is performed with the photomask via the partial transparent region, the issue that the height difference exists at the edge of the black matrix due to using black resin can be resolved.Type: ApplicationFiled: March 25, 2004Publication date: January 27, 2005Inventors: Wen-Chin Lo, Chien-Hsing Li, Liang-Jen Lin
-
Patent number: D687031Type: GrantFiled: May 30, 2012Date of Patent: July 30, 2013Assignee: ASUSTeK Computer Inc.Inventors: Yi-Chia Chen, Chang-Yi Tseng, Liang-Jen Lin, Yi-Chang Chen, Ke-Ming Chen, Hsien-Kuang Chiu, Cheng-Yao Huang
-
Patent number: D696659Type: GrantFiled: May 23, 2013Date of Patent: December 31, 2013Assignee: ASUSTeK Computer Inc.Inventors: Yi-Chia Chen, Chang-Yi Tseng, Liang-Jen Lin, Yi-Chang Chen, Ke-Ming Chen, Hsien-Kuang Chiu, Cheng-Yao Huang
-
Patent number: D696660Type: GrantFiled: May 23, 2013Date of Patent: December 31, 2013Assignee: ASUSTeK Computer Inc.Inventors: Yi-Chia Chen, Chang-Yi Tseng, Liang-Jen Lin, Yi-Chang Chen, Ke-Ming Chen, Hsien-Kuang Chiu, Cheng-Yao Huang
-
Patent number: D696661Type: GrantFiled: May 23, 2013Date of Patent: December 31, 2013Assignee: ASUSTeK Computer Inc.Inventors: Yi-Chia Chen, Chang-Yi Tseng, Liang-Jen Lin, Yi-Chang Chen, Ke-Ming Chen, Hsien-Kuang Chiu, Cheng-Yao Huang
-
Patent number: D865736Type: GrantFiled: July 12, 2018Date of Patent: November 5, 2019Assignee: ASUSTeK COMPUTER INC.Inventors: Yan-Jhang Cheng, Liang-Jen Lin, Hung-Chieh Wu, Min-Chieh Yang, Chung-Wei Wu, Hsin-Hua Hsieh
-
Patent number: D884689Type: GrantFiled: September 27, 2018Date of Patent: May 19, 2020Assignee: ASUSTeK COMPUTER INC.Inventors: Chui-Hung Chen, Zih-Siang Huang, Hung-Chieh Wu, Liang-Jen Lin, Ching-Yuan Yang, Cheng-Han Chung, Chia-Min Cheng
-
Patent number: D888700Type: GrantFiled: August 17, 2018Date of Patent: June 30, 2020Assignee: ASUSTEK COMPUTER INC.Inventors: Zih-Siang Huang, Yan-Jhang Cheng, Liang-Jen Lin, Hung-Chieh Wu, Min-Chieh Yang, Chung-Wei Wu, Hsin-Hua Hsieh
-
Patent number: D968391Type: GrantFiled: June 28, 2018Date of Patent: November 1, 2022Assignee: ASUSTeK COMPUTER INC.Inventors: Chuan-Hao Wen, Liang-Jen Lin, Hung-Chieh Wu, Min-Chieh Yang, Chung-Wei Wu