Patents by Inventor Liang-Jie Lin

Liang-Jie Lin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for manufacturing copper foil with rough surface in plating tank and its product
    Patent number: 11008665
    Abstract: A method for manufacturing a copper foil with a rough surface in a plating tank includes causing an electrolyte solution to flow between an anode and a cathode with a current density of 5 ASF-40 ASF. The copper foil with a rough surface including dense nodules of single copper crystals is deposited on the cathode. The electrolyte solution includes chloride ions (20 ppm-80 ppm), polyethylene glycol (PEG) with a molecular weight of 400-8000 (100 ppm-700 ppm), sulfuric acid (20 g/L-200 g/L), copper sulfate pentahydrate (70 g/L-320 g/L) and a sulfur compound (1 ppm-60 ppm).
    Type: Grant
    Filed: May 30, 2019
    Date of Patent: May 18, 2021
    Assignee: NATIONAL CHUNG HSING UNIVERSITY
    Inventors: Wei-Ping Dow, Liang-Jie Lin, Chia-Hsiang Chen
  • METHOD FOR MANUFACTURING COPPER FOIL WITH ROUGH SURFACE IN PLATING TANK AND ITS PRODUCT
    Publication number: 20190376198
    Abstract: A method for manufacturing a copper foil with a rough surface in a plating tank includes causing an electrolyte solution to flow between an anode and a cathode with a current density of 5 ASF-40 ASF. The copper foil with a rough surface including dense nodules of single copper crystals is deposited on the cathode. The electrolyte solution includes chloride ions (20 ppm-80 ppm), polyethylene glycol (PEG) with a molecular weight of 400-8000 (100 ppm-700 ppm), sulfuric acid (20 g/L-200 g/L), copper sulfate pentahydrate (70 g/L-320 g/L) and a sulfur compound (1 ppm-60 ppm).
    Type: Application
    Filed: May 30, 2019
    Publication date: December 12, 2019
    Inventors: Wei-Ping Dow, Liang-Jie Lin, Chia-Hsiang Chen
  • Method for producing flexible conductive substrate with high transmittance and product thereof
    Patent number: 10465056
    Abstract: The method for producing a transparent conductive substrate includes forming metal meshes on a flexible non-conductive substrate with high transmittance. It's unnecessary to use palladium as a catalyst in this method. The metal meshes are in the form of nano/micro wires and the conductive substrate has high transmittance of 80%-90% at visible light wavelengths of 390-750 nm.
    Type: Grant
    Filed: November 6, 2017
    Date of Patent: November 5, 2019
    Assignee: NATIONAL CHUNG HSING UNIVERSITY
    Inventors: Wei-Ping Dow, Po-Ting Chen, Liang-Jie Lin, Hung-Ming Chang, Ting-Yun Lin, Fang-Yu Lin
  • METHOD FOR PRODUCING FLEXIBLE CONDUCTIVE SUBSTRATE WITH HIGH TRANSMITTANCE AND PRODUCT THEREOF
    Publication number: 20180340050
    Abstract: The method for producing a transparent conductive substrate includes forming metal meshes on a flexible non-conductive substrate with high transmittance. It's unnecessary to use palladium as a catalyst in this method. The metal meshes are in the form of nano/micro wires and the conductive substrate has high transmittance of 80%-90% at visible light wavelengths of 390-750 nm.
    Type: Application
    Filed: November 6, 2017
    Publication date: November 29, 2018
    Inventors: Wei-Ping Dow, Po-Ting Chen, Liang-Jie Lin, Hung-Ming Chang, Ting-Yun Lin, Fang-Yu Lin