Abstract: A semiconductor device and a method of forming the same are provided. The semiconductor device includes a substrate, a gate structure, a dielectric structure and a contact structure. The substrate has source/drain (S/D) regions. The gate structure is on the substrate and between the S/D regions. The dielectric structure covers the gate structure. The contact structure penetrates through the dielectric structure to connect to the S/D region. A lower portion of a sidewall of the contact structure is spaced apart from the dielectric structure by an air gap therebetween, while an upper portion of the sidewall of the contact structure is in contact with the dielectric structure.

Abstract: The present invention relates to a method of fabricating an electronic module having a side contact, at least comprising the steps of: providing a printed circuit board (PCB), with a first surface thereof having a first electrical contact as well as a second surface thereof forming a layout of a second electrical contact, such that the first electrical contact connects to the second electrical contact; providing an electronic actuator, having a pin thereof electrically connected to the first electrical contact on the first surface of the PCB; and bending an edge of at least one side of the PCB to the first surface, thereby forming an electronic module having a side contact through the layout of the second electrical contact.

Abstract: The present invention provides an apparatus for adhering electronic devices comprising an electronic device, an adhesive, and a circuit board. Because the conventional circuit board includes air bubbles, these air bubbles are heated to the expansion state so as to forming the illness structure with holes. The circuit board of the present invention has an improved structure to improve the speed of filling and forming shape of the adhesive disposed at the bottom of the electronic device, so that when the electronic device is placed on the circuit board with the edges thereof coated with the adhesive, it can be adhered on the circuit board quickly while it can render the air in the interlayer between the electronic device and the circuit board exhausted through the hole. In addition, the present invention provides a method for adhering electronic devices, in order for the electronic device to be adhered on the circuit board quickly.

Abstract: A CD holder structure having a flexible, circular, convex pad integral with a plate mounted inside a CD case, convex pad having a keeper with a top button, a plurality of main cuts respectively extended from respective splits in the keeper, and a plurality of working areas respectively defined between each two adjacent main cuts, the working areas each having a substantially U-shaped cut and a springy strip surrounded by the U-shaped cut, the spring strip having an upright top bearing flange adapted to support the storage CD, and a downward bottom supporting flange stopped at the plate and adapted to give an upward reactive force to the storage CD through the upright top flange upon pressing of the button by the user.

Abstract: A CD holder structure having a flexible, circular, convex pad integral with a plate mounted inside a CD case, convex pad having a keeper with a top button, a plurality of main cuts respectively extended from respective splits in the keeper, and a plurality of working areas respectively defined between each two adjacent main cuts, the working areas each having a substantially U-shaped cut and a springy strip surrounded by the U-shaped cut, the spring strip having an upright top bearing flange adapted to support the storage CD, and a downward bottom supporting flange stopped at the plate and adapted to give an upward reactive force to the storage CD through the upright top flange upon pressing of the button by the user.

Abstract: A safety socket for avoiding danger of shock due to insertion of alien article into the insertion hole. The socket includes two high and two low fixing seats. Two insulative slide boards are reversely disposed on the fixing seats side by side. The lower edge of each slide board is disposed with an elliptic slot for a pin member to pass therethrough, whereby the slide boards can be limitedly left and right slided. The socket further includes two long and two short leaf springs. The short leaf springs abut against front edges of the slide boards. The long leaf springs are fixed on inner walls of a housing of the socket opposite to the short leaf springs. The long and short leaf springs are disposed with convex contact points opposite to each other. When a plug is not inserted into the socket, the slide boards are pushed by the resilient force of the short leaf springs to the center of the socket away from the long leaf springs so as to open the circuit.

Abstract: A safety socket for avoiding danger of shock due to insertion of alien article into the insertion hole. The socket is disposed with three spaced partitioning boards defining three apartments. The partitioning boards are arranged according to the direction of the arrangement of the insertion holes of the socket. Three wedge-shaped insulative slide boards are disposed on the partitioning boards, which are left and right slidable within the apartments. Three short leaf springs and three sets of leaf spring seats are respectively disposed in the apartments. A leaf spring extends from each leaf spring seat to contact with a corresponding short leaf spring. The slide board is restricted to resiliently reciprocally slide within a slot formed on the leaf spring seat.