Abstract: Pointing device providing security means are disclosed. A pointing device is designed to be able to read or write various cards (e.g., tags, IC or magnetic cards, etc.) and communicate securely with a host device. In one embodiment, the pointing device includes a card detector that communicates with a card, and a security engine configured to automatically establish a secured communication channel with a host device when a software module is activated in the host device such that data exchanged between the card and the host device is secured.

Abstract: An integrated circuit is packaged using a package substrate that has a bottom side with a regular array of connection points and a top side with the integrated circuit on it. Vias in the package substrate provide electrical connection between the top and bottom sides. The vias have a via capture pad to which a wire may be wire bonded so that the wires from the IC to the substrate top side directly contact the vias at their capture pads without the need for traces from a top side bond pad to a via. The via capture pad is shaped to include at least one sharp edge to improve the ability of a wirebonder with pattern recognition software to locate the capture pad and place the wire.

Abstract: A system, method and related software architecture are disclosed as a platform for developing and deploying RFID-enabled software applications. The platform is a framework between these applications and their connected physical RFID devices. The runtime version of this platform can be thought of as a logical RFID device. The platform allows RFID-enabled applications securely communicate with physical RFID devices to monitor their status and to access their tag data. The platform includes externalized APIs for accessing tag data, an event manager to alert applications of events coming from RFID devices and tags, data manager to filter and reconcile data returned from physical RFID readers before relaying them to applications, device manager to monitor the RFID device status for network management, and secured communication channels with data encryption.

Abstract: An integrated circuit is packaged using a package substrate that has a bottom side with a regular array of connection points and a top side with the integrated circuit on it. Vias in the package substrate provide electrical connection between the top and bottom sides. The vias have a via capture pad to which a wire may be wire bonded so that the wires from the IC to the substrate top side directly contact the vias at their capture pads without the need for traces from a top side bond pad to a via. The via capture pad is shaped to include at least one sharp edge to improve the ability of a wirebonder with pattern recognition software to locate the capture pad and place the wire.