Patents by Inventor Liang Kun Chang

Liang Kun Chang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Connector structure with standoff region for improved soldering and method of making the same
    Patent number: 10389051
    Abstract: A connector structure used in pin in paste soldering includes a standoff region with dimensions that provide reflow air convection on at least two sides of a surface of the connector structure during Pin In Paste (PIP) soldering. For example, the standoff region has a depth or height of approximately 0.3 mm, a length of approximately 15.1 mm, and a width of approximately 4.95 mm. The standoff region can also have a depth or height in a range of 0.3 mm to 0.5 mm. The connector structure is a single or dual port connector structure with the standoff region configured as a void or gap proximate to the connector pins, which creates a reflow air convection gate way across a surface of the connector structure during PIP soldering.
    Type: Grant
    Filed: October 20, 2017
    Date of Patent: August 20, 2019
    Assignee: ARRIS Enterprises LLC
    Inventors: Jui-Feng Lee, Liang Kun Chang
  • CONNECTOR STRUCTURE WITH STANDOFF REGION FOR IMPROVED SOLDERING AND METHOD OF MAKING THE SAME
    Publication number: 20190123463
    Abstract: A connector structure used in pin in paste soldering includes a standoff region with dimensions that provide reflow air convection on at least two sides of a surface of the connector structure during Pin In Paste (PIP) soldering. For example, the standoff region has a depth or height of approximately 0.3 mm, a length of approximately 15.1 mm, and a width of approximately 4.95 mm. The standoff region can also have a depth or height in a range of 0.3 mm to 0.5 mm. The connector structure is a single or dual port connector structure with the standoff region configured as a void or gap proximate to the connector pins, which creates a reflow air convection gate way across a surface of the connector structure during PIP soldering.
    Type: Application
    Filed: October 20, 2017
    Publication date: April 25, 2019
    Inventors: Jui-Feng Lee, Liang Kun Chang