Patents by Inventor Liang Liang

Liang Liang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20100147495
    Abstract: A heat dissipation apparatus includes a heat sink configured to contact a heat source, and a fan mounted to the heat sink. The heat sink includes a base with a bottom surface for contacting the heat source, and a plurality of radial fins angling upwardly from a top surface of the base to form a truncated conical space in the middle of the heat sink. A cross section area of the truncated conical space gradually increases from the top surface of the base to top of the fins.
    Type: Application
    Filed: June 16, 2009
    Publication date: June 17, 2010
    Applicants: HONG FU JIN PRECISION INDUSTRY(Shenzhen) CO., LTD., HON HAI PRECISION INDUSTRY CO., LTD.
    Inventors: Liang-Liang Cao, Zhong-Yong Du, Yang Li, Lei Guo
  • Patent number: 7737439
    Abstract: A semiconductor component having test pads and a method and apparatus for testing the same is described. In an example, an un-bumped substrate is obtained having a pattern of bond pads configured to support bumped contacts and a plurality of test pads. Each of the plurality of test pads is in electrical communication with a respective one of the bond pads. The substrate is tested using the plurality of test pads. In another example, a substrate is fabricated having a pattern of bond pads configured to support bumped contacts and a plurality of test pads. Each of the plurality of test pads is in electrical communication with a respective one of the bond pads. The substrate is tested using the plurality of test pads. An insulating layer is formed over the plurality of test pads.
    Type: Grant
    Filed: May 17, 2007
    Date of Patent: June 15, 2010
    Assignee: XILINX, Inc.
    Inventors: Mohsen Hossein Mardi, Jae Cho, Xin X. Wu, Chih-Chung Wu, Shih-Liang Liang, Sanjiv Stokes, Hassan K. Bazargan
  • Publication number: 20100134971
    Abstract: A heat dissipation apparatus includes a heat sink configured to contact a heat source, and a fan mounted on the heat sink configured to generate airflow through the heat dissipation apparatus. The fan includes a plurality of fan blades, and a motor configured for rotating the fan. The motor is located a distance from the fan blades.
    Type: Application
    Filed: June 8, 2009
    Publication date: June 3, 2010
    Applicants: HONG FU JIN PRECISION INDUSTRY (ShenZhen) CO., LTD., HON HAI PRECISION INDUSTRY CO., LTD.
    Inventors: Liang-Liang CAO, Yu-Hsu LIN, Zhi-Ping WU, Yang LI, Lei GUO
  • Publication number: 20100097754
    Abstract: A computer enclosure includes a chassis with a plurality of heat generating components installed therein and an airflow guide structure. The airflow guide structure includes a fan and a duct attached to the fan. A pair of airflow outlets aligned with the fan is defined in the duct. The duct includes a plurality of pivot panels pivotally attached at airflow outlets. The pivot panels are configured to guide airflow from the fan to different positions of heat generating components in the chassis.
    Type: Application
    Filed: December 22, 2008
    Publication date: April 22, 2010
    Applicants: HONG FU JIN PRECISION INDUSTRY (ShenZhen) CO., LTD., HON HAI PRECISION INDUSTRY CO., LTD.
    Inventors: YANG LI, YU-HSU LIN, JENG-DA WU, LEI GUO, LIANG-LIANG CAO, LIANG-QING SHAN
  • Publication number: 20100020878
    Abstract: A system and method that computes a threshold based on an average sum of absolute residual (SAR) values and a standard deviation, each SAR corresponding to the sum of absolute values of the residual signal of a non-intra encoded macroblock in a frame of a first video stream encoded according to a first video specification, decodes the macroblocks of the frame, compares a SAR of one of the macroblocks to the threshold, the one of the macroblocks having a first motion vector; and provides the first motion vector for encoding the one of the macroblocks according to a second video specification if the SAR of the one of the macroblocks is less than the threshold.
    Type: Application
    Filed: July 25, 2008
    Publication date: January 28, 2010
    Inventors: Liang Liang, Norman Cheng, Arturo A. Rodriguez
  • Publication number: 20100014244
    Abstract: A heat sink for dissipating heat from a heat source, includes a base configured to connect with a heat source, and a plurality of fins positioned on the base. A cutout is defined within the plurality of parallel fins.
    Type: Application
    Filed: September 30, 2008
    Publication date: January 21, 2010
    Applicants: HONG FU JIN PRECISION INDUSTRY (ShenZhen) CO., LTD, HON HAI PRECISION INDUSTRY CO., LTD.
    Inventors: LIANG-LIANG CAO, YU-HSU LIN, JENG-DA WU, CHIH-HANG CHAO, YANG LI, LEI GUO
  • Publication number: 20090213549
    Abstract: A heat sink assembly includes a printed circuit board, an electronic component mounted on the printed circuit board, and a heat sink mounted on the printed circuit board for dissipating heat from the electronic component. The printed circuit board includes a heat-conduction layer. The heat sink includes a base configured to contact the heat-conduction layer, and a main body extending upward from the base configured to contact the electronic component. The cross section of the base is larger than the cross section of the main body. A plurality of fins extends from the main body.
    Type: Application
    Filed: September 15, 2008
    Publication date: August 27, 2009
    Applicants: HONG FU JIN PRECISION INDUSTRY (ShenZhen) CO., LTD., HON HAI PRECISION INDUSTRY CO., LTD.
    Inventors: LEI GUO, YU-HSU LIN, JENG-DA WU, CHIH-HANG CHAO, YANG LI, LIANG-LIANG CAO
  • Publication number: 20090190309
    Abstract: An electronic apparatus includes an enclosure (30), a circuit board (40), a fan module (20), and an air guiding element (10) mounted in the enclosure. The circuit board includes at least one heat generating component (41) thereon. The fan module has a fan (22) and an output opening (213) corresponding to the fan. The air guiding element comprises a resisting panel (11) and a guiding panel (12) comprises a free end that extends toward the output opening of the fan module. The at least one heat generating component and the output opening are on the same side of the resisting panel. The guiding panel defines a free end (127) and a connecting end (125) connecting the resisting panel. A plane defined by the ends of the guiding panel is aligned at an angle larger than 90 degrees relative to the resisting panel.
    Type: Application
    Filed: June 12, 2008
    Publication date: July 30, 2009
    Applicants: HONG FU JIN PRECISION INDUSTRy (shenZhen) CO., LTD., HON HAI PRECISION INDUSTRY CO., LTD.
    Inventors: LIANG-QING SHAN, YANG LI, YU-HSU LIN, JENG-DA WU, LIANG-LIANG CAO, LEI GUO
  • Publication number: 20090168330
    Abstract: An electronic device includes an enclosure (30), a circuit board (40), and an airflow guiding duct (10). The enclosure includes a bottom wall (31) and a rear wall (32) perpendicular to the bottom wall. The circuit board is mounted on the bottom wall of the enclosure. The circuit board includes a first heat generating element (41) and a second heat generating element (42) near to the first heat generating element. The airflow guiding duct includes two side panels (11) and a connecting panel (13) connecting a pair of side edges (112) of the two side panels. A first opening (17) is defined by a lower edge (131) of the connecting panel and lower edges (111) of the two side panels and corresponding to the first heat generating element. The lower edges of the two side panels and the lower of the connecting panel are in the same plane. The first opening is a predetermined distance from the circuit board and the airflow guiding duct is capable of allowing air flow from different directions.
    Type: Application
    Filed: May 12, 2008
    Publication date: July 2, 2009
    Applicants: HONG FU JIN PRECISION INDUSTRY (ShenZhen) CO., LTD., HON HAI PRECISION INDUSTRY CO., LTD.
    Inventors: YANG LI, YU-HSU LIN, JENG-DA WU, LEI GUO, LIANG-LIANG CAO
  • Publication number: 20090166062
    Abstract: A printed circuit board assembly includes a printed circuit board, a carrier, a semiconductor chip mounted on the carrier, a plurality of tin balls soldered between the printed circuit board and the carrier for transmitting signals, and a heat sink glued to the semiconductor chip to dissipate heat. A pressing portion is formed on the bottom of the heat sink and does not make contact with the semiconductor chip. The pressing portion contacts with the periphery of the carrier to reinforce the tin balls located between the printed circuit board and the carrier.
    Type: Application
    Filed: May 10, 2008
    Publication date: July 2, 2009
    Applicants: HONG FU JIN PRECISION INDUSTRY (ShenZhen) CO., LTD., HON HAI PRECISION INDUSTRY CO., LTD.
    Inventors: ZHI-PING WU, JENG-DA WU, YU-HSU LIN, CHIH-HANG CHAO, LIANG-LIANG CAO
  • Publication number: 20090143290
    Abstract: The invention has disclosed a new tumor suppressor protein HCRP1, the polynucleotide sequences encoding this polypeptides, and methods for production of the polypeptide using the recombinant technology. The tumor suppression protein, HCRP1, is obtained through the positional candidate cloning strategy. It locates in 8p22 region of human chromosome. The full length cDNA for HCRP1 is 1917bp, which encodes a protein of 397 amino acids. When introduced into liver cancer cells, HCRP1 can inhibit the malignant transformation of liver cancer cells.
    Type: Application
    Filed: July 10, 2008
    Publication date: June 4, 2009
    Applicant: SHANGHAI INSTITUTES FOR BIOLOGICAL SCIENCES
    Inventors: Mujun Zhao, Zhenhua Xu, Liang Liang, Zaiping Li
  • Patent number: 7518878
    Abstract: A computer enclosure includes a chassis, a side plate, and a securing member. The chassis includes a rear plate defining a sliding groove therein. The side plate is attached to a side of the chassis. At least one fixing post extends perpendicularly from an inner surface of the side plate located near a rear side. The securing member is movably mounted in the sliding groove. The securing member includes an operating portion exposed outside of the chassis through the sliding groove, and a clamping portion located in the chassis. When the securing member is moved along the sliding groove, the clamping portion is moved with the securing member to engage with or disengage from the at least one fixing post of the side plate. Thus, the side plate is attached to or removed from the chassis.
    Type: Grant
    Filed: December 29, 2007
    Date of Patent: April 14, 2009
    Assignees: Hon Fu Jin Precision Industry (ShenZhen) Co., Ltd., Hon Hai Precision Industry Co., Ltd.
    Inventors: Chang-Chun Liu, Liang-Liang Qiu
  • Patent number: 7446758
    Abstract: This invention provides an input device applying to a computer or a mobile telephone, including: glove unit, keys unit, detection unit, coding unit, MPU unit, communication unit, display unit, and power unit. The glove unit is the carrier of the other unit. The detection unit detects the key-press information, the coding unit codes the key-press information and transfers the code to the communication unit, and the communication unit will transfer the information to the computer or the mobile telephone. The MPU watches the work of all the unit and displays correlative information by the display unit, The power unit supply supplies the device electricity, This invention provides a method of constructing the computer network using the device and a fast input method matching the device. This invention provides users the convenience of operating computes and mobile telephones in movement. This device is taken easily, and it has high efficiency and very good reliability.
    Type: Grant
    Filed: July 29, 2004
    Date of Patent: November 4, 2008
    Inventor: Liang Liang
  • Publication number: 20080147782
    Abstract: A system (100) for managing fixture calibration report includes a database (40) and a server (30). The database stores basic information reports and measurement reports of fixtures. The server is connected to the database and includes a calibration report generating module (301) configured to acquire relational data from the measurement reports, calculate and estimate the relational data acquired from the measurement report in order to generate a calibration report for each fixture, and an information transfer module (307) configured to obtain an electronic information account from the basic information reports. The calibration report generating module (301) is further configured for sending the calibration reports to the obtained electronic information account. A method for managing fixture calibration reports is also provided.
    Type: Application
    Filed: August 1, 2007
    Publication date: June 19, 2008
    Applicants: SHENZHEN FUTAIHONG PRECISION INDUSTRY CO., LTD., SUTECH TRADING LIMITED
    Inventors: LEI LI, PING CHEN, LIANG-LIANG SONG, LI-SHA CHEN, HAN-YING CHEN, CHUN-YING WANG
  • Publication number: 20080141152
    Abstract: A system (100) for managing electronic documents associated with respective products (i.e., product documentation) includes a database (40) and a server (30). The database selectively stores the electronic documents. The server is electronically connected to the database and includes a loading module (301) and a processing module (302). The loading module transmits selected electronic documents to the database. The processing module includes an inquiry module (3021) configured for locating/determining related documents in the database according to a keyword; a path-generating module (3022) configured for generating path links indicating locations of the located related documents; and a maintenance module (3023) for automatically deleting selectably chosen electronic documents in the database.
    Type: Application
    Filed: June 19, 2007
    Publication date: June 12, 2008
    Applicants: SHENZHEN FUTAIHONG PRECISION INDUSTRIAL CO.,LTD., SUTECH TRADING LIMITED
    Inventors: LEI LI, PING CHEN, LI-SHA CHEN, LIANG-LIANG SONG, HAN-YING CHEN, CHEN-JING CAO
  • Publication number: 20070235001
    Abstract: This invention provides a rotary engine and the type engine design method. This engine mainly has two nested rotors and a cylinder body. This invention publicizes in detail about the rotary engine movement principle and the work mechanism. This type engine can the automatic control compression ratio, the running rate be high, Structure simple and so on many kinds of merits.
    Type: Application
    Filed: June 15, 2005
    Publication date: October 11, 2007
    Inventor: Liang Liang
  • Publication number: 20070221920
    Abstract: A semiconductor component having test pads and a method and apparatus for testing the same is described. In an example, an un-bumped substrate is obtained having a pattern of bond pads configured to support bumped contacts and a plurality of test pads. Each of the plurality of test pads is in electrical communication with a respective one of the bond pads. The substrate is tested using the plurality of test pads. In another example, a substrate is fabricated having a pattern of bond pads configured to support bumped contacts and a plurality of test pads. Each of the plurality of test pads is in electrical communication with a respective one of the bond pads. The substrate is tested using the plurality of test pads. An insulating layer is formed over the plurality of test pads.
    Type: Application
    Filed: May 17, 2007
    Publication date: September 27, 2007
    Applicant: Xilinx, Inc.
    Inventors: Mohsen Mardi, Jae Cho, Xin Wu, Chih-Chung Wu, Shih-Liang Liang, Sanjiv Stokes, Hassan Bazargan
  • Publication number: 20070218573
    Abstract: A semiconductor component having test pads and a method and apparatus for testing the same is described. In an example, an un-bumped substrate is obtained having a pattern of bond pads configured to support bumped contacts and a plurality of test pads. Each of the plurality of test pads is in electrical communication with a respective one of the bond pads. The substrate is tested using the plurality of test pads. In another example, a substrate is fabricated having a pattern of bond pads configured to support bumped contacts and a plurality of test pads. Each of the plurality of test pads is in electrical communication with a respective one of the bond pads. The substrate is tested using the plurality of test pads. An insulating layer is formed over the plurality of test pads.
    Type: Application
    Filed: May 17, 2007
    Publication date: September 20, 2007
    Applicant: Xilinx, Inc.
    Inventors: Mohsen Mardi, Jae Cho, Xin Wu, Chih-Chung Wu, Shih-Liang Liang, Sanjiv Stokes, Hassan Bazargan
  • Publication number: 20070191002
    Abstract: A cell phone peripheral device comprises a communication unit, for short-distance wireless communicating between said cell phone peripheral device and the cell phone; a processing unit, for receiving information from said communication unit, processing the information to obtain and analyze data information; a display unit, for receiving and displaying said data information. A method for a cell phone perpheral device communicating with a cell phone comprises receiving information from the cell phone by way of short-distance wireless communication; processing the information to obtain and analyze data information; and displaying, by the cell phone peripheral device, the data information.
    Type: Application
    Filed: January 22, 2007
    Publication date: August 16, 2007
    Inventors: Jinchun GE, Liang LIANG
  • Patent number: 7235412
    Abstract: A semiconductor component having test pads and a method and apparatus for testing the same is described. In an example, an un-bumped substrate is obtained having a pattern of bond pads configured to support bumped contacts and a plurality of test pads. Each of the plurality of test pads is in electrical communication with a respective one of the bond pads. The substrate is tested using the plurality of test pads. In another example, a substrate is fabricated having a pattern of bond pads configured to support bumped contacts and a plurality of test pads. Each of the plurality of test pads is in electrical communication with a respective one of the bond pads. The substrate is tested using the plurality of test pads. An insulating layer is formed over the plurality of test pads.
    Type: Grant
    Filed: May 11, 2004
    Date of Patent: June 26, 2007
    Assignee: XILINX, Inc.
    Inventors: Mohsen Hossein Mardi, Jae Cho, Xin X. Wu, Chih-Chung Wu, Shih-Liang Liang, Sanjiv Stokes, Hassan K. Bazargan