Patents by Inventor Liang Liang
Liang Liang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20100147495Abstract: A heat dissipation apparatus includes a heat sink configured to contact a heat source, and a fan mounted to the heat sink. The heat sink includes a base with a bottom surface for contacting the heat source, and a plurality of radial fins angling upwardly from a top surface of the base to form a truncated conical space in the middle of the heat sink. A cross section area of the truncated conical space gradually increases from the top surface of the base to top of the fins.Type: ApplicationFiled: June 16, 2009Publication date: June 17, 2010Applicants: HONG FU JIN PRECISION INDUSTRY(Shenzhen) CO., LTD., HON HAI PRECISION INDUSTRY CO., LTD.Inventors: Liang-Liang Cao, Zhong-Yong Du, Yang Li, Lei Guo
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Patent number: 7737439Abstract: A semiconductor component having test pads and a method and apparatus for testing the same is described. In an example, an un-bumped substrate is obtained having a pattern of bond pads configured to support bumped contacts and a plurality of test pads. Each of the plurality of test pads is in electrical communication with a respective one of the bond pads. The substrate is tested using the plurality of test pads. In another example, a substrate is fabricated having a pattern of bond pads configured to support bumped contacts and a plurality of test pads. Each of the plurality of test pads is in electrical communication with a respective one of the bond pads. The substrate is tested using the plurality of test pads. An insulating layer is formed over the plurality of test pads.Type: GrantFiled: May 17, 2007Date of Patent: June 15, 2010Assignee: XILINX, Inc.Inventors: Mohsen Hossein Mardi, Jae Cho, Xin X. Wu, Chih-Chung Wu, Shih-Liang Liang, Sanjiv Stokes, Hassan K. Bazargan
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Publication number: 20100134971Abstract: A heat dissipation apparatus includes a heat sink configured to contact a heat source, and a fan mounted on the heat sink configured to generate airflow through the heat dissipation apparatus. The fan includes a plurality of fan blades, and a motor configured for rotating the fan. The motor is located a distance from the fan blades.Type: ApplicationFiled: June 8, 2009Publication date: June 3, 2010Applicants: HONG FU JIN PRECISION INDUSTRY (ShenZhen) CO., LTD., HON HAI PRECISION INDUSTRY CO., LTD.Inventors: Liang-Liang CAO, Yu-Hsu LIN, Zhi-Ping WU, Yang LI, Lei GUO
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Publication number: 20100097754Abstract: A computer enclosure includes a chassis with a plurality of heat generating components installed therein and an airflow guide structure. The airflow guide structure includes a fan and a duct attached to the fan. A pair of airflow outlets aligned with the fan is defined in the duct. The duct includes a plurality of pivot panels pivotally attached at airflow outlets. The pivot panels are configured to guide airflow from the fan to different positions of heat generating components in the chassis.Type: ApplicationFiled: December 22, 2008Publication date: April 22, 2010Applicants: HONG FU JIN PRECISION INDUSTRY (ShenZhen) CO., LTD., HON HAI PRECISION INDUSTRY CO., LTD.Inventors: YANG LI, YU-HSU LIN, JENG-DA WU, LEI GUO, LIANG-LIANG CAO, LIANG-QING SHAN
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Publication number: 20100020878Abstract: A system and method that computes a threshold based on an average sum of absolute residual (SAR) values and a standard deviation, each SAR corresponding to the sum of absolute values of the residual signal of a non-intra encoded macroblock in a frame of a first video stream encoded according to a first video specification, decodes the macroblocks of the frame, compares a SAR of one of the macroblocks to the threshold, the one of the macroblocks having a first motion vector; and provides the first motion vector for encoding the one of the macroblocks according to a second video specification if the SAR of the one of the macroblocks is less than the threshold.Type: ApplicationFiled: July 25, 2008Publication date: January 28, 2010Inventors: Liang Liang, Norman Cheng, Arturo A. Rodriguez
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Publication number: 20100014244Abstract: A heat sink for dissipating heat from a heat source, includes a base configured to connect with a heat source, and a plurality of fins positioned on the base. A cutout is defined within the plurality of parallel fins.Type: ApplicationFiled: September 30, 2008Publication date: January 21, 2010Applicants: HONG FU JIN PRECISION INDUSTRY (ShenZhen) CO., LTD, HON HAI PRECISION INDUSTRY CO., LTD.Inventors: LIANG-LIANG CAO, YU-HSU LIN, JENG-DA WU, CHIH-HANG CHAO, YANG LI, LEI GUO
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Publication number: 20090213549Abstract: A heat sink assembly includes a printed circuit board, an electronic component mounted on the printed circuit board, and a heat sink mounted on the printed circuit board for dissipating heat from the electronic component. The printed circuit board includes a heat-conduction layer. The heat sink includes a base configured to contact the heat-conduction layer, and a main body extending upward from the base configured to contact the electronic component. The cross section of the base is larger than the cross section of the main body. A plurality of fins extends from the main body.Type: ApplicationFiled: September 15, 2008Publication date: August 27, 2009Applicants: HONG FU JIN PRECISION INDUSTRY (ShenZhen) CO., LTD., HON HAI PRECISION INDUSTRY CO., LTD.Inventors: LEI GUO, YU-HSU LIN, JENG-DA WU, CHIH-HANG CHAO, YANG LI, LIANG-LIANG CAO
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Publication number: 20090190309Abstract: An electronic apparatus includes an enclosure (30), a circuit board (40), a fan module (20), and an air guiding element (10) mounted in the enclosure. The circuit board includes at least one heat generating component (41) thereon. The fan module has a fan (22) and an output opening (213) corresponding to the fan. The air guiding element comprises a resisting panel (11) and a guiding panel (12) comprises a free end that extends toward the output opening of the fan module. The at least one heat generating component and the output opening are on the same side of the resisting panel. The guiding panel defines a free end (127) and a connecting end (125) connecting the resisting panel. A plane defined by the ends of the guiding panel is aligned at an angle larger than 90 degrees relative to the resisting panel.Type: ApplicationFiled: June 12, 2008Publication date: July 30, 2009Applicants: HONG FU JIN PRECISION INDUSTRy (shenZhen) CO., LTD., HON HAI PRECISION INDUSTRY CO., LTD.Inventors: LIANG-QING SHAN, YANG LI, YU-HSU LIN, JENG-DA WU, LIANG-LIANG CAO, LEI GUO
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Publication number: 20090168330Abstract: An electronic device includes an enclosure (30), a circuit board (40), and an airflow guiding duct (10). The enclosure includes a bottom wall (31) and a rear wall (32) perpendicular to the bottom wall. The circuit board is mounted on the bottom wall of the enclosure. The circuit board includes a first heat generating element (41) and a second heat generating element (42) near to the first heat generating element. The airflow guiding duct includes two side panels (11) and a connecting panel (13) connecting a pair of side edges (112) of the two side panels. A first opening (17) is defined by a lower edge (131) of the connecting panel and lower edges (111) of the two side panels and corresponding to the first heat generating element. The lower edges of the two side panels and the lower of the connecting panel are in the same plane. The first opening is a predetermined distance from the circuit board and the airflow guiding duct is capable of allowing air flow from different directions.Type: ApplicationFiled: May 12, 2008Publication date: July 2, 2009Applicants: HONG FU JIN PRECISION INDUSTRY (ShenZhen) CO., LTD., HON HAI PRECISION INDUSTRY CO., LTD.Inventors: YANG LI, YU-HSU LIN, JENG-DA WU, LEI GUO, LIANG-LIANG CAO
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Publication number: 20090166062Abstract: A printed circuit board assembly includes a printed circuit board, a carrier, a semiconductor chip mounted on the carrier, a plurality of tin balls soldered between the printed circuit board and the carrier for transmitting signals, and a heat sink glued to the semiconductor chip to dissipate heat. A pressing portion is formed on the bottom of the heat sink and does not make contact with the semiconductor chip. The pressing portion contacts with the periphery of the carrier to reinforce the tin balls located between the printed circuit board and the carrier.Type: ApplicationFiled: May 10, 2008Publication date: July 2, 2009Applicants: HONG FU JIN PRECISION INDUSTRY (ShenZhen) CO., LTD., HON HAI PRECISION INDUSTRY CO., LTD.Inventors: ZHI-PING WU, JENG-DA WU, YU-HSU LIN, CHIH-HANG CHAO, LIANG-LIANG CAO
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Publication number: 20090143290Abstract: The invention has disclosed a new tumor suppressor protein HCRP1, the polynucleotide sequences encoding this polypeptides, and methods for production of the polypeptide using the recombinant technology. The tumor suppression protein, HCRP1, is obtained through the positional candidate cloning strategy. It locates in 8p22 region of human chromosome. The full length cDNA for HCRP1 is 1917bp, which encodes a protein of 397 amino acids. When introduced into liver cancer cells, HCRP1 can inhibit the malignant transformation of liver cancer cells.Type: ApplicationFiled: July 10, 2008Publication date: June 4, 2009Applicant: SHANGHAI INSTITUTES FOR BIOLOGICAL SCIENCESInventors: Mujun Zhao, Zhenhua Xu, Liang Liang, Zaiping Li
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Patent number: 7518878Abstract: A computer enclosure includes a chassis, a side plate, and a securing member. The chassis includes a rear plate defining a sliding groove therein. The side plate is attached to a side of the chassis. At least one fixing post extends perpendicularly from an inner surface of the side plate located near a rear side. The securing member is movably mounted in the sliding groove. The securing member includes an operating portion exposed outside of the chassis through the sliding groove, and a clamping portion located in the chassis. When the securing member is moved along the sliding groove, the clamping portion is moved with the securing member to engage with or disengage from the at least one fixing post of the side plate. Thus, the side plate is attached to or removed from the chassis.Type: GrantFiled: December 29, 2007Date of Patent: April 14, 2009Assignees: Hon Fu Jin Precision Industry (ShenZhen) Co., Ltd., Hon Hai Precision Industry Co., Ltd.Inventors: Chang-Chun Liu, Liang-Liang Qiu
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Patent number: 7446758Abstract: This invention provides an input device applying to a computer or a mobile telephone, including: glove unit, keys unit, detection unit, coding unit, MPU unit, communication unit, display unit, and power unit. The glove unit is the carrier of the other unit. The detection unit detects the key-press information, the coding unit codes the key-press information and transfers the code to the communication unit, and the communication unit will transfer the information to the computer or the mobile telephone. The MPU watches the work of all the unit and displays correlative information by the display unit, The power unit supply supplies the device electricity, This invention provides a method of constructing the computer network using the device and a fast input method matching the device. This invention provides users the convenience of operating computes and mobile telephones in movement. This device is taken easily, and it has high efficiency and very good reliability.Type: GrantFiled: July 29, 2004Date of Patent: November 4, 2008Inventor: Liang Liang
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Publication number: 20080147782Abstract: A system (100) for managing fixture calibration report includes a database (40) and a server (30). The database stores basic information reports and measurement reports of fixtures. The server is connected to the database and includes a calibration report generating module (301) configured to acquire relational data from the measurement reports, calculate and estimate the relational data acquired from the measurement report in order to generate a calibration report for each fixture, and an information transfer module (307) configured to obtain an electronic information account from the basic information reports. The calibration report generating module (301) is further configured for sending the calibration reports to the obtained electronic information account. A method for managing fixture calibration reports is also provided.Type: ApplicationFiled: August 1, 2007Publication date: June 19, 2008Applicants: SHENZHEN FUTAIHONG PRECISION INDUSTRY CO., LTD., SUTECH TRADING LIMITEDInventors: LEI LI, PING CHEN, LIANG-LIANG SONG, LI-SHA CHEN, HAN-YING CHEN, CHUN-YING WANG
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Publication number: 20080141152Abstract: A system (100) for managing electronic documents associated with respective products (i.e., product documentation) includes a database (40) and a server (30). The database selectively stores the electronic documents. The server is electronically connected to the database and includes a loading module (301) and a processing module (302). The loading module transmits selected electronic documents to the database. The processing module includes an inquiry module (3021) configured for locating/determining related documents in the database according to a keyword; a path-generating module (3022) configured for generating path links indicating locations of the located related documents; and a maintenance module (3023) for automatically deleting selectably chosen electronic documents in the database.Type: ApplicationFiled: June 19, 2007Publication date: June 12, 2008Applicants: SHENZHEN FUTAIHONG PRECISION INDUSTRIAL CO.,LTD., SUTECH TRADING LIMITEDInventors: LEI LI, PING CHEN, LI-SHA CHEN, LIANG-LIANG SONG, HAN-YING CHEN, CHEN-JING CAO
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Publication number: 20070235001Abstract: This invention provides a rotary engine and the type engine design method. This engine mainly has two nested rotors and a cylinder body. This invention publicizes in detail about the rotary engine movement principle and the work mechanism. This type engine can the automatic control compression ratio, the running rate be high, Structure simple and so on many kinds of merits.Type: ApplicationFiled: June 15, 2005Publication date: October 11, 2007Inventor: Liang Liang
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Publication number: 20070221920Abstract: A semiconductor component having test pads and a method and apparatus for testing the same is described. In an example, an un-bumped substrate is obtained having a pattern of bond pads configured to support bumped contacts and a plurality of test pads. Each of the plurality of test pads is in electrical communication with a respective one of the bond pads. The substrate is tested using the plurality of test pads. In another example, a substrate is fabricated having a pattern of bond pads configured to support bumped contacts and a plurality of test pads. Each of the plurality of test pads is in electrical communication with a respective one of the bond pads. The substrate is tested using the plurality of test pads. An insulating layer is formed over the plurality of test pads.Type: ApplicationFiled: May 17, 2007Publication date: September 27, 2007Applicant: Xilinx, Inc.Inventors: Mohsen Mardi, Jae Cho, Xin Wu, Chih-Chung Wu, Shih-Liang Liang, Sanjiv Stokes, Hassan Bazargan
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Publication number: 20070218573Abstract: A semiconductor component having test pads and a method and apparatus for testing the same is described. In an example, an un-bumped substrate is obtained having a pattern of bond pads configured to support bumped contacts and a plurality of test pads. Each of the plurality of test pads is in electrical communication with a respective one of the bond pads. The substrate is tested using the plurality of test pads. In another example, a substrate is fabricated having a pattern of bond pads configured to support bumped contacts and a plurality of test pads. Each of the plurality of test pads is in electrical communication with a respective one of the bond pads. The substrate is tested using the plurality of test pads. An insulating layer is formed over the plurality of test pads.Type: ApplicationFiled: May 17, 2007Publication date: September 20, 2007Applicant: Xilinx, Inc.Inventors: Mohsen Mardi, Jae Cho, Xin Wu, Chih-Chung Wu, Shih-Liang Liang, Sanjiv Stokes, Hassan Bazargan
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Publication number: 20070191002Abstract: A cell phone peripheral device comprises a communication unit, for short-distance wireless communicating between said cell phone peripheral device and the cell phone; a processing unit, for receiving information from said communication unit, processing the information to obtain and analyze data information; a display unit, for receiving and displaying said data information. A method for a cell phone perpheral device communicating with a cell phone comprises receiving information from the cell phone by way of short-distance wireless communication; processing the information to obtain and analyze data information; and displaying, by the cell phone peripheral device, the data information.Type: ApplicationFiled: January 22, 2007Publication date: August 16, 2007Inventors: Jinchun GE, Liang LIANG
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Patent number: 7235412Abstract: A semiconductor component having test pads and a method and apparatus for testing the same is described. In an example, an un-bumped substrate is obtained having a pattern of bond pads configured to support bumped contacts and a plurality of test pads. Each of the plurality of test pads is in electrical communication with a respective one of the bond pads. The substrate is tested using the plurality of test pads. In another example, a substrate is fabricated having a pattern of bond pads configured to support bumped contacts and a plurality of test pads. Each of the plurality of test pads is in electrical communication with a respective one of the bond pads. The substrate is tested using the plurality of test pads. An insulating layer is formed over the plurality of test pads.Type: GrantFiled: May 11, 2004Date of Patent: June 26, 2007Assignee: XILINX, Inc.Inventors: Mohsen Hossein Mardi, Jae Cho, Xin X. Wu, Chih-Chung Wu, Shih-Liang Liang, Sanjiv Stokes, Hassan K. Bazargan