Abstract: A touch display panel and a touch display device are provided. They include a first substrate; and a first metal layer formed on one side of the first substrate. The first metal layer includes a plurality of touch electrode lines and a plurality of pressure sensing elements. The pressure sensing elements include segments of pressure sensing lines. At each crossing region where a touch electrode line comes across a pressure sensing element, two adjacent segments of pressure sensing lines are connected through a bridge. A second metal layer is formed between the first substrate and the first metal layer. The second metal layer includes a plurality of data lines extending along a first direction. A third metal layer is formed between the second metal layer and the first substrate. The third metal layer includes a plurality of scan lines extending along a second direction which is orthogonal to the first direction.

Abstract: A semiconductor device having a substrate, a gate electrode, a source and a drain, and a buried gate dielectric layer is disclosed. The buried gate dielectric layer is disposed below said gate electrode and protrudes therefrom to said drain, thereby separating said gate electrode and said drain by a substantial distance to reduce gate induced drain leakage.

Abstract: A position sensor includes a variable capacitor assembly and a circuit board. The variable capacitor assembly includes a baseboard and a dielectric coupling element. The baseboard includes a baseboard body, a grounding electrode and two power electrodes. The grounding electrode is disposed nearby one side of the baseboard body. The two power electrodes are disposed separately near the other side of the baseboard body. The dielectric coupling element is spaced with the two power electrodes and the grounding electrode, and operable to be moved along a moving path. A covering condition is varied when the dielectric coupling element is operated to move along the moving path. When a power is alternatively applied to the power electrodes, a pair of capacitance values between the grounding electrode and the power electrodes is varied with the covering condition to accordingly determine a relative position of the coupling element along the moving path.

Abstract: A display panel and a display device are disclosed. The display includes a first substrate and a second substrate disposed opposite to the first substrate. The first substrate includes a plurality of touch electrodes arranged in an array. The second substrate includes a plurality of auxiliary touch electrodes, and a projection of each of the plurality of auxiliary touch electrodes partly overlaps with projections of two adjacent touch electrodes of the plurality of touch electrodes in a direction perpendicular to the second substrate. In the touch operation, a coupling capacitor is formed between the touch medium and the auxiliary touch electrode, another coupling capacitor is formed between the auxiliary touch electrode and the touch electrode, so that more touch electrodes are involved in each touch operation, thus reducing the difficulty of determining the touch position and the precision requirement for the touch operation.

Abstract: A flatbed scanning device of a paper feeding scanning equipment includes a device casing and a scanning module. The device casing includes a first glass plate, and a second glass plate spaced apart from the first glass plate and having a bottom surface. The scanning module is disposed in the device casing, and including a module body, a scanning assembly disposed in the module body, and at least one contact assembly disposed on the module body. When the scanning module is in an initial position, the scanning assembly is located below the first glass plate, and the at least one contact assembly abuttingly contacts the bottom surface of the second glass plate.

Abstract: A position sensor includes a variable capacitor assembly and a circuit board. The variable capacitor assembly includes a baseboard and a dielectric coupling element. The baseboard includes a baseboard body, a grounding electrode and two power electrodes. The grounding electrode is disposed nearby one side of the baseboard body. The two power electrodes are disposed separately near the other side of the baseboard body. The dielectric coupling element is spaced with the two power electrodes and the grounding electrode, and operable to be moved along a moving path. A covering condition is varied when the dielectric coupling element is operated to move along the moving path. When a power is alternatively applied to the power electrodes, a pair of capacitance values between the grounding electrode and the power electrodes is varied with the covering condition to accordingly determine a relative position of the coupling element along the moving path.

Abstract: The present disclosure provides an array substrate and a display panel. The array substrate includes: a substrate; a plurality of scan lines formed on the substrate and extending along a first direction, a plurality of data lines formed on the substrate and extending along a second direction; a plurality of pixel units are defined by the scan lines and data lines, at least four semiconductor pressure sensing units formed on the substrate. In each of the plurality of the pixel units, a thin film transistor is provided. The substrate is further provided with a plurality of connection wires thereon, for connecting the semiconductor pressure sensing units to form at least one Wheatstone bridge structure. Using the array substrate provided in the present disclosure can the defect in the related art that the structure is complicated when the touch pressure sensor is integrated.

Abstract: A touch control display panel and a touch control display apparatus are provided. The touch control display panel comprises a first substrate having a display region and a non-display region surrounding the display region, wherein the non-display region includes a plurality of sub-non-display regions, and a plurality of first pressure-sensing bridges and at least one second pressure-sensing bridge, wherein a first pressure-sensing bridge and the at least one second pressure-sensing bridge are disposed in two opposing sub-non-display regions. The first pressure-sensing bridge and the at least one second pressure-sensing bridge each includes a first strain direction and a second strain direction. The first strain direction and the second strain direction of the first pressure-sensing bridge form a first pre-determined angle ? and a second pre-determined angle ? with respect to a first border of the non-display region, respectively.

Abstract: A bonding system includes: a storage apparatus, including a chamber, wherein the chamber is configured to accommodate a first semiconductor wafer and a second semiconductor wafer transferred from a load port, and a gas is provided to the chamber to purge oxygen out of the chamber; a surface treatment station, configured to perform a surface activation upon the first and second semiconductor wafers transferred from the storage apparatus; a cleaning station, configured to remove undesirable substances from surfaces of the first and second semiconductor wafers transferred from the surface treatment station; and a pre-bonding station, configured to bond the first and second semiconductor wafers together to produce a bonded first and second semiconductor wafer pair, wherein the first and second semiconductor wafers are transferred from the cleaning station. An associated apparatus and method are also disclosed.

Abstract: A light-emitting device includes a light-emitting structure with a side surface, and a reflective layer covering the side surface. The light-emitting structure has a first light-emitting angle and a second light-emitting angle. The difference between the first light-emitting angle and the second light-emitting angle is larger than 15°.

Abstract: A flexible display panel, a flexible display device, and a fabrication method of the flexible display panel are provided. The flexible display panel comprises a stacked structure having a plurality of layers comprising a flexible substrate, a light-emitting device layer, and a polarizing layer stacked in a preset order. The flexible display panel further includes at least one upper-side resistive force-sensitive electrode disposed on a layer above a neutral plane of the stacked structure, and at least one lower-side resistive force-sensitive electrode disposed on a layer below the neutral plane.

Abstract: Methods of reducing a pattern displacement error, contrast loss, best focus shift, and/or tilt of a Bossung curve of a portion of a design layout used in a lithographic process for imaging that portion onto a substrate using a lithographic apparatus. The methods include adjusting an illumination source of the lithographic apparatus, placing one or more assist features onto, or adjusting a position and/or shape of one or more existing assist features in, the portion. Adjusting the illumination source and/or the one or more assist features may be by an optimization algorithm.

Abstract: The embodiment of the disclosure discloses a touch substrate, a touch display panel and a method for calculating touch pressure. The touch substrate comprises at least two semiconductor pressure sensors, a bias voltage applying circuit and a voltage detecting circuit, wherein the bias voltage applying circuit is used for applying bias voltage to each semiconductor pressure sensor; the voltage detecting circuit is used for acquiring strain voltages of each semiconductor pressure sensor. A first straight line connecting the first connecting terminal and the second connecting terminal intersects a second straight line connecting the third connecting terminal and the fourth connecting terminal. According to the technical scheme of the disclosure, the semiconductor pressure sensors can be integrated inside the touch display panel.

Abstract: A method for manufacturing a semiconductor device and a device manufactured using the same are provided. According to a method approach of the embodiment, a substrate having at least a first area with a plurality of polysilicon gates and a second area adjacent to the first area is provided. A contact etch stop layer (CESL) over the polysilicon gates of the first area is formed, and the CESL extends to the second area. Then, a dielectric layer is formed on the CESL, and a nitride layer is formed on the dielectric layer. The nitride layer is patterned to expose the dielectric layer in the first area and to form a pattern of dummy nitrides on the dielectric layer in the second area.

Abstract: A touch screen is provided. The touch screen includes a first strain sensor located in a first region, a second strain sensor located in a second region, a first power supply and a first voltage detector. The first region is surrounded by the second region, the first power supply is configured to provide an operating voltage to the first strain sensor and the second strain sensor. The first voltage detector is configured to detect a voltage of a common terminal of the first strain sensor and the second strain sensor, and one terminal of the first voltage detector is connected to a first preset voltage, and the other terminal of the first voltage detector is electrically connected to the common terminal of the first strain sensor and the second strain sensor.

Abstract: A method for using a carbon nanotube film supporting structure includes: providing a carbon nanotube film structure and a carbon nanotube film supporting structure, the carbon nanotube film supporting structure comprises a substrate and a plurality of protruding structures, the substrate having a surface defining a support region, the plurality of protruding structures distributed on support region, a ratio of a sum of a plurality of surface areas, defined by the top of the plurality of protruding structures, to an area of the support region, is less than or equal to 20%; and placing the carbon nanotube film structure on the support region of the carbon nanotube film supporting structure.

Abstract: A rotary variable resistor includes a resistance circuit module, a fixation frame, a brush assembly and a rotor shaft. The resistance circuit module has a circuit board, an output circuit, three input circuits and a resistance ring. The output circuit includes a brush contact port having an annular brush contact area and an output port extending out from the brush contact port. Each input circuit has a resistor contact end and an input port. The three resistor contact ends are evenly annularly separated. The resistance ring co-axially and annularly spaced to the brush contact port contacts the resistor contact ends. The fixation frame is fixedly mounted on the resistance circuit module. The brush assembly rotatably restrained by the fixation frame bridges the annular brush contact area and the resistance ring. The rotor shaft for driving the brush assembly is connected with the brush assembly.

Abstract: The present invention discloses a method of treating cancer and/or multidrug-resistant cancer, comprising administering an effective amount of hernandezine or thalidezine. A pharmaceutical composition comprising hernandezine or thalidezine admixed with a pharmaceutical carrier for treating cancers and/or multidrug-resistant cancer is also disclosed.

Abstract: A method of fabricating a gate cap layer includes providing a substrate with an interlayer dielectric disposed thereon, wherein a recess is disposed in the interlayer dielectric and a metal gate fills in a lower portion of the recess. Later, a cap material layer is formed to cover the interlayer dielectric and fill in an upper portion of the recess. After that, a first sacrifice layer and a second sacrifice layer are formed in sequence to cover the cap material layer. The first sacrifice layer has a composition different from a composition of the cap material layer. The second sacrifice layer has a composition the same as the composition of the cap material layer. Next, a chemical mechanical polishing process is preformed to remove the second sacrifice layer, the first sacrifice layer and the cap material layer above a top surface of the interlayer dielectric.

Abstract: A method of manufacturing a semiconductor structure is provided. First, a preliminary structure is provided. The preliminary structure has a first region and a second region, and the preliminary structure comprises a plurality of features in the first region. Then, a first polish stop layer is formed on the preliminary structure. The first polish stop layer comprises a concave portion in the second region, and the concave portion defines an opening. A first overlying layer is formed on the first polish stop layer. Thereafter, a second polish stop layer is formed on the first overlying layer. The second polish stop layer has a graduated change in composition. The second polish stop layer comprises a concave portion at least partially formed in the opening. A second overlying layer is formed on the second polish stop layer.