Abstract: A three-dimensional scanning system includes a projection light source, an image capturing apparatus, and a signal processing apparatus. The projection light source is configured to project a two-dimensional light to a target, where the two-dimensional light has a spatial frequency. The image capturing apparatus captures an image of the target illuminated with the two-dimensional light. The signal processing apparatus is coupled to the projection light source and the image capturing apparatus, to analyze a definition of the image of the two-dimensional light, where if the definition of the image of the two-dimensional light is lower than a requirement standard, the spatial frequency of the two-dimensional light is reduced.

Abstract: An apparatus for three-dimensional shape measurement is provided, including a projection device, an image capture device, and an image processing device. The projection device sequentially projects a plurality of structured light beams on a scene during a first projection period and a second projection period. The mean level of the structured light beams during the first projection period is the same as the mean level of the structured light beams during the second projection period, and the frequency of the structured light beams during the first projection period is different from the frequency of the structured light beams during the second projection period. The image capture device captures an image of the scene within the projection time of each of the structured light beams. The image processing device obtains a three-dimensional shape of a to-be-measured object in the scene according to the images.

Abstract: An apparatus for three-dimensional shape measurement is provided, including a projection device, an image capture device, and an image processing device. The projection device sequentially projects a plurality of structured light beams on a scene during a first projection period and a second projection period. The mean level of the structured light beams during the first projection period is the same as the mean level of the structured light beams during the second projection period, and the frequency of the structured light beams during the first projection period is different from the frequency of the structured light beams during the second projection period. The image capture device captures an image of the scene within the projection time of each of the structured light beams. The image processing device obtains a three-dimensional shape of a to-be-measured object in the scene according to the images.

Abstract: A three-dimensional scanning system includes a projection light source, an image capturing apparatus, and a signal processing apparatus. The projection light source is configured to project a two-dimensional light to a target, where the two-dimensional light has a spatial frequency. The image capturing apparatus captures an image of the target illuminated with the two-dimensional light. The signal processing apparatus is coupled to the projection light source and the image capturing apparatus, to analyze a definition of the image of the two-dimensional light, where if the definition of the image of the two-dimensional light is lower than a requirement standard, the spatial frequency of the two-dimensional light is reduced.

Abstract: An optical inspection system includes a first optical module and a second optical module. The first optical module includes a first light source having a first optical axis and a first image capturing unit having a first image capturing axis. The first optical axis and the first image capturing axis are symmetric relative a normal line of an inspection plane. A first angle is formed between the first optical axis and the first image capturing axis. The second optical module includes a second light source having a second optical axis and a second image capturing unit having a second image capturing axis. The second optical axis and the second image capturing axis are symmetric relative to the normal line. A second angle is formed between the second optical axis and the second image capturing axis and is different from the first angle.

Abstract: An inspection method is provided herein. The inspection method is adapted for an inspection device. The inspection method includes: optically scanning an examining target for generating a scanned image; reconstructing the scanned image for a reconstructed volume; adjusting a slicing direction associated with the examining target for slicing the reconstructed volume into a sliced image; inspecting the sliced image for analyzing one or more features of the examining target; and outputting an inspection result of the examining target.

Abstract: An optical system includes an optical apparatus. The optical apparatus is for projecting a first projection image to a plane or detecting a first detected image of the plane. The optical apparatus includes a first image device, and a lens group. The first image device has an image surface having an image center. The lens group is disposed between the first image device and the plane and has a lens axis surface and an optic center. The optic center and the image center form a connection line. The plane has a tangent surface to an intersecting point of the connection line. The lens axis surface, the tangent surface, and an extension surface of the image surface substantially intersect at a straight line.

Abstract: An inspection method is provided herein. The inspection method is adapted for an inspection device. The inspection method includes: optically scanning an examining target for generating a scanned image; reconstructing the scanned image for a reconstructed volume; adjusting a slicing direction associated with the examining target for slicing the reconstructed volume into a sliced image; inspecting the sliced image for analyzing one or more features of the examining target; and outputting an inspection result of the examining target.

Abstract: An optical system includes at least one optical apparatus. The optical apparatus includes a first light source, a second light source, and a dynamic switch. The first light source is configured for providing a first light beam. The second light source is configured for providing a second light beam. The dynamic switch includes a plurality of mirrors arranged in an array manner. Each of the mirrors has a first tilt angle and a second tilt angle. The first light beam and the second light beam impinge on the dynamic switch from different directions. The dynamic switch reflects the first light beam to a desired position when the mirrors are at the first tilt angles, and reflects the second light beam to the desired position when the mirrors are at the second tilt angles.

Abstract: A board-warping measuring method is configured to measure a device under test. The device under test is disposed on a measuring carrier. The board-warping measuring method includes: projecting a pattern onto the device under test, wherein the pattern includes plural reference points; capturing a measurement image by an image-capturing module when the pattern is projected onto the device under test, wherein the measurement image includes plural measurement points respectively corresponding to the reference points; calculating a position of each of the measurement points in the measurement image by utilizing a transfer function corresponding to each of the reference points to obtain position heights of the device under test corresponding to the measurement points; and compensating for board warping of the device under test based on the position heights of the device under test corresponding to the measurement points.

Abstract: A three-dimensional measurement system includes a measurement platform, a projection module, an image-capturing module, and a control unit. The measurement platform carries a test object. The projection module includes a light-emitting unit, a light-shielding rotary disc, a grating unit, and an optical-reflective ring structure. The light-emitting unit generates a light beam. An aperture formed in the light-shielding rotary disc is located at different rotational positions time-sequentially while the light-shielding rotary disc rotates, and the light beam passes through the aperture to form light beam segments. The grating unit transforms the light beam segments into stripe-patterned structure-light beams. The optical-reflective ring structure reflects the stripe-patterned structure-light beams onto the test object. The image-capturing module captures stripe-patterned images formed after reflection of the stripe-patterned structure-light beams from the test object.

Abstract: A measuring system for a 3D object includes a base, a horizontal scanning device disposed on the base, a first light emitting device, a second light emitting device, an image capture device, and a control device. The first light emitting device, the second light emitting device, and the image capture device are connected to the horizontal scanning device. The control device controls the horizontal scanning device to cause planar motion relative to the base. With the control of the control device, the first light emitting device and the second light emitting device alternate in projecting a light source onto a 3D object. The image capture device includes a double-sided telecentric lens to capture a plurality of images of the 3D object when the light source is projected onto the 3D object.

Abstract: A board-warping measuring method is configured to measure a device under test. The device under test is disposed on a measuring carrier. The board-warping measuring method includes: projecting a pattern onto the device under test, wherein the pattern includes plural reference points; capturing a measurement image by an image-capturing module when the pattern is projected onto the device under test, wherein the measurement image includes plural measurement points respectively corresponding to the reference points; calculating a position of each of the measurement points in the measurement image by utilizing a transfer function corresponding to each of the reference points to obtain position heights of the device under test corresponding to the measurement points; and compensating for board warping of the device under test based on the position heights of the device under test corresponding to the measurement points.

Abstract: An optical system includes an optical apparatus. The optical apparatus is for projecting a first projection image to a plane or detecting a first detected image of the plane. The optical apparatus includes a first image device, and a lens group. The first image device has an image surface having an image center. The lens group is disposed between the first image device and the plane and has a lens axis surface and an optic center. The optic center and the image center form a connection line. The plane has a tangent surface to an intersecting point of the connection line. The lens axis surface, the tangent surface, and an extension surface of the image surface substantially intersect at a straight line.

Abstract: An optical system includes at least one optical apparatus. The optical apparatus includes a first light source, a second light source, and a dynamic switch. The first light source is configured for providing a first light beam. The second light source is configured for providing a second light beam. The dynamic switch includes a plurality of mirrors arranged in an array manner. Each of the mirrors has a first tilt angle and a second tilt angle. The first light beam and the second light beam impinge on the dynamic switch from different directions. The dynamic switch reflects the first light beam to a desired position when the mirrors are at the first tilt angles, and reflects the second light beam to the desired position when the mirrors are at the second tilt angles.

Abstract: An optical inspection system includes a first optical module and a second optical module. The first optical module includes a first light source having a first optical axis and a first image capturing unit having a first image capturing axis. The first optical axis and the first image capturing axis are symmetric relative a normal line of an inspection plane. A first angle is formed between the first optical axis and the first image capturing axis. The second optical module includes a second light source having a second optical axis and a second image capturing unit having a second image capturing axis. The second optical axis and the second image capturing axis are symmetric relative to the normal line. A second angle is formed between the second optical axis and the second image capturing axis and is different from the first angle.

Abstract: A three-dimensional image measuring apparatus includes a measurement platform, a movable optical head, a three-dimensional calculator module, a moving module and a calibration controlling module. The movable optical head includes a beam splitter unit, a projecting module, an image-capturing module and an indicator module. The measurement platform supports an object under measurement. The projecting module generates a structure light of parallel sinusoid strips pattern to the object under measurement. The image-capturing module includes image-capturing units facing the object under measurement from different directions or angles. Each image-capturing unit is configured to capture a reflection image which is formed from the structure light of parallel sinusoid strips pattern reflected by the object under measurement. The indicator module projects an alignment beam onto the object under measurement for forming an alignment mark.

Abstract: A three-dimensional image measuring apparatus includes a measurement platform, a movable optical head, a three-dimensional calculator module, a moving module and a calibration controlling module. The movable optical head includes a beam splitter unit, a projecting module, an image-capturing module and an indicator module. The measurement platform supports an object under measurement. The projecting module generates a structure light of parallel sinusoid strips pattern to the object under measurement. The image-capturing module includes image-capturing units facing the object under measurement from different directions or angles. Each image-capturing unit is configured to capture a reflection image which is formed from the structure light of parallel sinusoid strips pattern reflected by the object under measurement. The indicator module projects an alignment beam onto the object under measurement for forming an alignment mark.

Abstract: A three-dimensional measurement system includes a measurement platform, a projection module, an image-capturing module, and a control unit. The measurement platform carries a test object. The projection module includes a light-emitting unit, a light-shielding rotary disc, a grating unit, and an optical-reflective ring structure. The light-emitting unit generates a light beam. An aperture formed in the light-shielding rotary disc is located at different rotational positions time-sequentially while the light-shielding rotary disc rotates, and the light beam passes through the aperture to form light beam segments. The grating unit transforms the light beam segments into stripe-patterned structure-light beams. The optical-reflective ring structure reflects the stripe-patterned structure-light beams onto the test object. The image-capturing module captures stripe-patterned images formed after reflection of the stripe-patterned structure-light beams from the test object.

Abstract: A three-dimensional measurement system includes a measurement carrier, first and second projection modules, an image-capturing module, and a control unit. The measurement carrier carries a test object on a measurement plane. The first projection module projects a first patterned structure light onto the test object along a first optical axis that forms a first incident angle relative to the measurement plane, and the second projection module projects a second patterned structure light onto the test object along a second optical axis that forms a second incident angle different from the first incident angle. The image-capturing module captures first and second patterned images formed after reflection of the first and second patterned structure lights from the test object. The control unit controls the first and second projection modules, and measures a three-dimensional shape of the test object according to the first and second patterned images.