Abstract: Provided are an array substrate and an electronic apparatus. The array substrate includes: a base substrate; a first conductive layer on the base substrate, where the first conductive layer includes a plurality of pads, each pad includes a first metal layer, a material of the first metal layer includes Cu, a content of the Cu is greater than or equal to 99%, and a thickness of the first metal layer is greater than 2 ?m; and an electronic element disposed on a side of the first conductive layer facing away from the base substrate, where the electronic element includes an electronic element body and a plurality of pins disposed on a side of the electronic element body facing the base substrate, and the pins are connected with the pads.

Abstract: An autonomous mobile robot checking system comprises a transmission line, an unmanned aerial vehicle and an autonomous mobile device. The unmanned aerial vehicle is used for sensing stacked goods to generate sensing information. The autonomous mobile device is used for receiving the sensing information through the transmission line, and supplying power to the unmanned aerial vehicle through the transmission line to enable the unmanned aerial vehicle to sense the stacked goods. The autonomous mobile device provides a checking result for the stacked goods based on the sensing information.

Abstract: A display may include an array of pixels such as light-emitting diode pixels. The pixels may include multiple circuitry decks that each include one or more circuit components such as transistors, capacitors, and/or resistors. The circuitry decks may be vertically stacked. Each circuitry deck may include a planarization layer formed from a siloxane material that conforms to underlying components and provides a planar upper surface. In this way, circuitry components may be vertically stacked to mitigate the size of each pixel footprint. The circuitry components may include capacitors that include both a high-k dielectric layer and a low-k dielectric layer. The display pixel may include a via with a width of less than 1 micron.

Abstract: The present disclosure provides for multi-specific antibodies and antigen-binding fragments thereof that bind to human MUC1 and CD16A, pharmaceutical compositions comprising said antibodies, and use of the antibodies or the compositions for treating a disease, such as cancer.

Abstract: A light-emitting substrate includes: a substrate, a reflective layer, a reflective sheet, and a plurality of light-emitting devices. The reflective layer is located on a side of the substrate, and the reflective layer has a plurality of annular patterns arranged at intervals. The reflective sheet is located on a side of the reflective layer away from the substrate, and the reflective sheet has a plurality of first openings. An annular pattern is exposed by a corresponding first opening; and in a direction perpendicular to a plane where the substrate is located, an outer sidewall of the annular pattern surrounds the corresponding first opening, and an inner sidewall of the annular pattern is located in the corresponding first opening. A light-emitting device is located in an inner sidewall of one of the annular patterns.

Abstract: A backplane includes a substrate, a circuit structure layer, a reflective layer, a plurality of electronic devices and a plurality of encapsulation portions. Each encapsulation portion covers an electronic device in the plurality of electronic devices. At least one first conductive line includes at least one of a first linear extending portion, a second linear extending portion and a third linear extending portion. Orthographic projections of the first linear extending portion, the second linear extending portion, the third linear extending portion and an encapsulation portion in the plurality of encapsulation portions on the substrate are respectively a first orthographic projection, a second orthographic projection, a third orthographic projection and a fourth orthographic projection.

Abstract: A resin composition includes 100 parts by weight of hydrocarbon resin polymers and 0.01 to 50 parts by weight of divinyl aromatic compound. A substrate structure includes a resin layer and a conductive layer disposed on the resin layer, wherein the resin layer is formed from the resin composition. A manufacturing method of the resin composition includes the following steps: providing a mixture, wherein the mixture includes a monovinyl aromatic compound and a divinyl aromatic compound, and optionally includes a bridged ring compound; polymerizing the mixture to form a crude composition; and purifying the crude composition to prepare the resin composition.

Abstract: A method of determining interaction information, an electronic device and a storage medium are provided, which relates to a field of artificial intelligence technology, in particular to a large model, a generative model, an NLP, an intelligent search and other fields. An implementation is to determine a plurality of questioning dimensions according to query information of a subject and historical query information, where each questioning dimension includes a dimension name and a plurality of options; determine a target questioning dimension from the plurality of questioning dimensions according to evaluation values of the plurality of questioning dimensions and whether semantic information of the plurality of questioning dimensions are consistent with semantic information of a query result associated with the query information; and determine the interaction information according to the dimension name and the plurality of options in the target questioning dimension.

Abstract: The present disclosure relates to lamp unit, lamp system and method for mounting the lamp system. The lamp unit includes: a lamp panel having a cavity formed by a light-emitting surface and a back surface, is provided with light-emitting elements and a plurality of electrical contact points that are electrically connected to the light-emitting elements, and a plurality of openings to expose the electrical contact points; and a mounting unit configured to be detachably mounted on a back surface center portion of the back surface and used for mounting the lamp unit on a predetermined position, and the mounting unit is provided with a plurality of connection positions for forming an electrical connection with another lamp unit. By means of the above manner, the operation of mounting a connector on the lamp unit is easier.

Abstract: A method for traceability calibration of calibration device of rock chiseling specific power tester includes static calibration and dynamic calibration. Static calibration includes: placing impact indicator sensor of calibration device on static calibration stage; installing standard weight holder on adapter head of impact indicator sensor; adding a standard weight to standard weight holder several times; and calculating static coefficient k. Dynamic calibration includes: placing impact indicator sensor on dynamic calibration stage; resetting dynamic calibration coefficients a and b of calibration device; recording standard impact energy W0 of dynamic standard hammer and measured indication value W of impact indicator sensor to obtain standard deviation S=W?W0; and calculating dynamic coefficients a and b. Rock chiseling specific power magnitude is effectively traced to equal mass standard of standard weights. A new traceability method and system for specific power magnitude is constructed.

Abstract: The present invention provides a method of treating targeted abnormal cells that are resistant, refractory, insensitive, non-responsive, or inadequately responsive to an ingredient, as well as cytotoxic cells used therein, comprising administering an effective amount of the ingredient-complexed cytotoxic cells to a subject with the disease.

Abstract: The present application provides a light emitting panel, a preparation method thereof, and a light emitting apparatus, which relate to the field of display technology. The light emitting panel includes a base; a reflective layer located on a side of the base, the reflective layer includes a plurality of grooves arranged in an array; a plurality of devices located in the grooves and electrically connected to the base; a first optical film located on a side of the reflective layer facing away from the base, the orthographic projection of the first optical film on the base covers the orthographic projection of the reflective layer on the base, and at least partial areas of the reflective layer are in direct contact with the first optical film.

Abstract: A display module and an electronic device are provided. The display module includes a display film layer, a heat dissipation film layer, a support plate and an elastic thermal conductive sheet. The display film layer and the heat dissipation film layer include a flat area and bending areas, and an angle exists between a tangent of a curved surface formed by the bending areas and a plane where the flat area is located. The display film layer is stacked on a first surface of the heat dissipation film layer. The support plate is connected to a position where the flat area of a second surface of the heat dissipation film layer is located, and the elastic thermal conductive sheet is connected to a position where the bending areas of the second surface of the heat dissipation film layer are located. The first surface and the second surface are opposite surfaces.

Abstract: A semiconductor package includes a first layer including a semiconductor die and a shunt embedded within a first dielectric substrate layer, and metal pillars extending therethrough. The semiconductor package further includes a second layer stacked on the first layer, the second layer including a metal trace patterned on the first dielectric substrate layer, and a second dielectric substrate layer over the metal trace. The metal trace electrically connects a first portion of the shunt to a first metal pillar of the metal pillars and electrically connects a second portion of the shunt to a second metal pillar of the metal pillars. The semiconductor package further includes a base layer opposite the second layer relative the first layer, the base layer forming exposed electrical contact pads for the semiconductor package, the electrical contact pads providing electrical connections to the shunt, the metal pillars, and the semiconductor die.

Abstract: A light-emitting substrate includes a back plate, light-emitting regions arranged in an array and a bonding electrode group. The light-emitting regions are disposed on the back plate, and each light-emitting region is provided with at least one light-emitting group therein. The bonding electrode group is disposed on the back plate and includes a first bonding electrode and remaining bonding electrodes. A second power supply voltage terminal of a light-emitting group is electrically connected to a feedback signal line included in the light-emitting substrate, and the first bonding electrode is electrically connected to the feedback signal line. An impedance between the first bonding electrode and an adjacent one of the remaining bonding electrodes is larger then an impedance between two adjacent and consecutive ones of the remaining bonding electrodes.

Abstract: A system, apparatus, method, and non-transitory computer readable medium for performing improved and/or optimal sensor placement may include a computing device caused to, receive a plurality of fault conditions and an initial sensor suite associated with at least one object to be simulated, the initial sensor suite including a plurality of candidate physical sensors for the at least one object, perform failure mode analysis of the initial sensor suite, the performing the failure mode analysis including generating at least one dependency-matrix (D-matrix) based on the plurality of fault conditions and the plurality of candidate physical sensors, and generate a recommended sensor suite associated with the at least one object based on results of the failure mode analysis, the recommended sensor suite including at least one recommended sensor, the at least one recommended sensor being a subset of the plurality of candidate physical sensors.

Abstract: A method for manufacturing a busbar (1), in particular a laminated busbar (1), configured for mounting an electronic component, in particular a passive electronic component such as a capacitor, on the busbar (1), comprising: providing a first conductive layer (11) made from aluminum, providing a first connector element (15) for connecting the first conductive layer (11) and the electronic component, wherein the first connector element (15) is at least partially covered with nickel and/or tin, and creating an bond between the first conductive layer (11) and the first connector element (15) by laser welding.

Abstract: A method for forming a busbar (1) having a contact element (20) comprising: —providing a first conductive section (11) made from aluminum, —providing a second conductive section (12) made from aluminum, wherein the second conductive section (12) is connected to the contact element (20), the contact element (20) being made from a material different from aluminum, preferably from copper, and wherein the second conductive section (12) is at least partially covered with nickel and/or tin and—creating a laser welding bond, in particular a laser welding scam (10), between the first conductive section (11) and the second conductive section (12), by laser welding and—creating a bond between the second conductive section and the contact element, preferably by soldering.