Abstract: The present disclosure provides an oxide-confined semiconductor laser having high aluminum content and a fabricating method. The semiconductor laser includes: an N-side metal electrode, an N-type GaAs substrate, an N-type confinement layer, an N-type waveguide layer, an active region, a P-type waveguide layer, a P-type confinement layer, a P-type high aluminum content layer, a P-type contact layer, and a P-side metal electrode. The P-type high aluminum content layer and the P-type contact layer are etched to form a ridge structure. The P-type high aluminum content layer is oxidized to form an oxidation confinement layer. The oxidation confinement layer is between an upper surface of the P-type confinement layer and a lower surface of the P-type contact layer, and covers both sides of the ridge structure, so as to form a current injection channel below the ridge structure and an electrical isolation on the both sides of the ridge structure.

Abstract: Methods for managing a connection pool for cloud-based applications accessing databases are provided. Aspects include establishing a plurality of connections to one or more databases, receiving connection requests from a plurality of cloud-based applications to access the one or more databases, and allocating the connection requests to among the plurality of connections, where the allocation is determined based at least in part on one or more connection pool parameters. Aspects also include monitoring a usage of the plurality of connections by the plurality of applications and updating the one or more connection pool parameters based on an analysis of the usage of the plurality of connections by the plurality of applications.

Abstract: A power drive circuit, includes: a battery pack, a first switch, a voltage adjustment circuit, a first bridge-arm conversion circuit, and a second bridge-arm conversion circuit. A first end of the voltage adjustment circuit is connected to a first end of the battery pack, and a second end of the voltage adjustment circuit is connected to a second end of the battery pack. The first switch is connected to the first end of the battery pack and a third end of the voltage adjustment circuit, and the first bridge-arm conversion circuit and the second bridge-arm conversion circuit are connected in parallel between the second end and the third end of the voltage adjustment circuit. The first bridge-arm conversion circuit is configured to connect to a first electric motor of a vehicle, and the second bridge-arm conversion circuit is configured to connect to a second electric motor of the vehicle.

Abstract: A 3D-configured production structure of rubber products based on an intelligent manufacturing unit and a production method thereof. The structure includes a stereoscopic production warehouse used to store a mobile intelligent manufacturing unit and an ex-warehouse delivery system used to deliver the mobile intelligent manufacturing unit. The mobile intelligent manufacturing unit includes a unit functional assembly, a molding vulcanization apparatus, a blank feeder, a material-delivering apparatus, a product-collecting apparatus and a reclaimer. The molding vulcanization apparatus includes a upper heat plate, a upper mold, a lower mold, a lower heat plate and a support post. The upper mold and the lower mold are arranged on the inner sides of the upper heat plate and the lower heat plate, respectively. The upper heat plate is fixed on one end of the support post, and the lower heat plate is arranged through the support post.

Abstract: The invention presents a power meter assembly devised for comprehensive measurement of electrical parameters within power distribution systems. This assembly integrates a primary power meter, housed within a first housing, with an extension module encased in a secondary housing to expand its functionality. The design prioritizes precision, incorporating features like strategically positioned engagement apertures, access holes, and cylindrical protrusions for exact alignment during module assembly. Central to the assembly's innovative mechanism is a dynamic locking system situated on the lateral aspect of the extension module. This system combines transverse and longitudinal displacement elements, both furnished with actuators, and a mechanical locking element. The unique interplay between these components allows for swift pre-engagement configurations, culminating in a robust and secure locked state after actuation.

Abstract: A culture medium for hepatoma organoid culture, comprising an MST1/2 kinase inhibitor, at least one cell culture additive selected from N2 and B27, a hepatocyte growth factor, an ITS cell culture additive, Y27632, dexamethasone, Neuregulin-1, insulin, an epidermal cell growth factor, GlutaMAX, and non-essential amino acids. The application further relates to a hepatoma organoid culture method and an application thereof. By using the culture medium for hepatoma organoid, effective and rapid expansion of the hepatoma organoid can be achieved, and the organoid obtained by such expansion maintains the pathological characteristics of a patient, improves the culture success rate and the expansion rate of the hepatoma organoid, and provides a research basis for individualized treatment of the patient.

Abstract: An aluminum alloy for high pressure die casting of ultra-large vehicle body structures. The aluminum alloy includes about 4.00 to about 12.00 weight percent silicon (Si); about 0.20 weight percent maximum (Max) copper (Cu); about 0.40 weight percent Max magnesium (Mg); about 0.20 to about 0.60 weight percent iron (Fe); about 1.00 weight percent Max manganese (Mn); about 0.50 weight percent Max zinc (Zn); about 0.02 weight percent Max strontium (Sr); about 0.50 weight percent Max cerium (Ce); about 0.01 weight Max percent boron (B); and a remaining weight percent aluminum (Al). The aluminum alloy provides an as-cast yield strength of greater than 130 Megapascals (MPa), ultimate tensile strength of greater than 260 MPa, and elongation of greater than 6% without the need for heat treatment.

Abstract: A positive electrode active material, where a surface region of the positive electrode active material includes a specific content of element aluminum. The positive electrode material of this application helps to improve the impedance, cycling performance, and high-temperature storage performance of electrochemical apparatuses under high-voltage operating conditions.

Abstract: A platinum-palladium alloy catalyst, and a phosphoric acid or a phosphonated ionomer contacting the platinum-palladium alloy catalyst in a fuel cell. Phosphoric acid fuel cells (PAFCs, with phosphoric-acid-saturated silicon carbide matrix) employing the platinum-palladium alloy catalyst, and, a phosphoric acid or a phosphonated ionomer contacting the platinum-palladium alloy catalyst are disclosed. High-temperature polymer electrolyte membrane fuel cells (HT-PEMFCs, with phosphoric-acid-contained polymer matrix) employing the platinum-palladium alloy catalyst, and a phosphoric acid or a phosphonated ionomer contacting the platinum-palladium alloy catalyst are also disclosed.

Abstract: Described are a system, method, and computer program product for dynamic node classification in temporal-based machine learning classification models. The method includes receiving graph data of a discrete time dynamic graph including graph snapshots, and node classifications associated with all nodes in the discrete time dynamic graph. The method includes converting the discrete time dynamic graph to a time-augmented spatio-temporal graph and generating an adjacency matrix based on a temporal walk of the time-augmented spatio-temporal graph. The method includes generating an adaptive information transition matrix based on the adjacency matrix and determining feature vectors based on the nodes and the node attribute matrix of each graph snapshot.

Abstract: Embodiments of this application provide a target service execution method and an electronic device. The method includes: receiving a first broadcast signal from a first device, where the first broadcast signal carries an identifier of the first device; starting a target application in an electronic device based on the identifier of the first device; and when receiving a second broadcast signal from a second device, establishing a communication connection between the target application and the second device based on an identifier of the second device that is carried in the second broadcast signal, to execute a target service corresponding to the target application. The foregoing method can improve a success rate of establishing a connection between the electronic device and the second device.

Abstract: The present disclosure provides a medical image segmentation method. The medical image segmentation method includes acquiring a to-be-processed medical image set, the to-be-processed medical image set including a plurality of to-be-processed medical images corresponding to different time points, processing the to-be-processed medical image set in a time dimension according to the to-be-processed medical images and the time points corresponding to the to-be-processed medical images to obtain a temporal dynamic image, and extracting a target region feature from the temporal dynamic image by using a medical image segmentation model, to acquire a target region.

Abstract: Integrated optical waveguides, direct-bonded waveguide interface joints, optical routing and interconnects are provided. An example optical interconnect joins first and second optical conduits. A first direct oxide bond at room temperature joins outer claddings of the two optical conduits and a second direct bond joins the inner light-transmitting cores of the two conduits at an annealing temperature. The two low-temperature bonds allow photonics to coexist in an integrated circuit or microelectronics package without conventional high-temperatures detrimental to microelectronics. Direct-bonded square, rectangular, polygonal, and noncircular optical interfaces provide better matching with rectangular waveguides and better performance. Direct oxide-bonding processes can be applied to create running waveguides, photonic wires, and optical routing in an integrated circuit package or in chip-to-chip optical communications without need for conventional optical couplers.

Abstract: Semiconductor devices and methods are disclosed herein. In one example, a disclosed semiconductor device includes: an insulation layer, a first electrode with sidewalls and a bottom surface in contact with the insulation layer; a second electrode with sidewalls and a bottom surface in contact with the insulation layer; and an insulator formed between the first electrode and the second electrode. The insulator is coupled to a sidewall of the first electrode and coupled to a sidewall of the second electrode.

Abstract: Methods, systems, and apparatus, including computer programs encoded on a computer storage medium, for distributing digital contents to client devices are described. The system obtains, for each user in a set of users, user attribute data and, for a subset of the users, consent data for controlling usage of the user attribute data. The system partitions, based at least on the consent data for the subset of users, the set of users into a first group of users and a second group of users. The system generates a respective training dataset based on the data for each group of user, and uses the datasets to train a machine learning model configured to predict information about one or more users. In particular, the system applies differential privacy to the second training dataset without applying differential privacy to the first training dataset during training.

Abstract: Methods, systems, and computer program products are provided for coordinated analysis of output scores and input features of machine learning models in different environments. An example method includes receiving a plurality of first data records and a plurality of second data records. A first plot is generated based on a first score generated by a machine learning model for each first data record and a second score generated by the machine learning model for each second data record. The first plot is displayed. A plurality of second plots associated with at least a subset of the plurality of features are generated. Each respective second plot is generated based on a respective first field associated with a respective feature from the first data records and a respective second field associated with the respective feature from the second data records. The second plots are displayed.

Abstract: This invention presents a method for detecting circuit anomalies in a current transformer. The method is executed by a module integrated into an intelligent electronic device. The process involves a multi-step analysis that starts with comparing the frequency of a detected current signal from the transformer's secondary winding with the frequency of a detected voltage signal from a primary conductor. If the frequency difference exceeds a predetermined threshold, the method advances to assess the magnitude of the detected current signal. If this magnitude falls below another predetermined threshold, the method proceeds to analyze the Total Harmonic Distortion (THD) of the current signal. Depending on whether the THD is above or below a set threshold, the method determines the presence of either an open or a short circuit within the current transformer. This approach provides a reliable and accurate means for identifying circuit anomalies, enhancing the safety of electrical systems.

Abstract: Direct-bonded LED arrays and applications are provided. An example process fabricates a LED structure that includes coplanar electrical contacts for p-type and n-type semiconductors of the LED structure on a flat bonding interface surface of the LED structure. The coplanar electrical contacts of the flat bonding interface surface are direct-bonded to electrical contacts of a driver circuit for the LED structure. In a wafer-level process, micro-LED structures are fabricated on a first wafer, including coplanar electrical contacts for p-type and n-type semiconductors of the LED structures on the flat bonding interface surfaces of the wafer. At least the coplanar electrical contacts of the flat bonding interface are direct-bonded to electrical contacts of CMOS driver circuits on a second wafer.