Abstract: A heat dissipation device adapted to dissipate heat of a heat source in an electronic system. The heat dissipation device includes a thermally conductive plastic shell and a fluid. The thermally conductive plastic shell has at least one sealed accommodation space. The fluid completely fills the at least one sealed accommodation space of the thermally conductive plastic shell.

Abstract: A memory storage system is provided according to an exemplary embodiment of the disclosure. The memory storage system includes a host system and a memory storage device. In a first handshake operation, the memory storage device transmits first encrypted information corresponding to first authentication information to the host system, and the host system transmits second encrypted information corresponding to the first authentication information to the memory storage device. In a second handshake operation, the memory storage device transmits third encrypted information corresponding to second authentication information to the host system, and the host system transmits fourth encrypted information corresponding to third authentication information to the memory storage device based on the third encrypted information. The third authentication information is configured to encrypt data transmitted between the host system and the memory storage device in a developer command transmission stage.

Abstract: A memory storage system is provided according to an exemplary embodiment of the disclosure. The memory storage system includes a host system and a memory storage device. In a first handshake operation, the memory storage device transmits first encrypted information corresponding to first authentication information to the host system, and the host system transmits second encrypted information corresponding to the first authentication information to the memory storage device. In a second handshake operation, the memory storage device transmits third encrypted information corresponding to second authentication information to the host system, and the host system transmits fourth encrypted information corresponding to third authentication information to the memory storage device based on the third encrypted information. The third authentication information is configured to encrypt data transmitted between the host system and the memory storage device in a developer command transmission stage.

Abstract: A light source module includes a shell, a fixed ring, an optical element, a first cover and a light-emitting element. The shell is formed as a tubular shape. The fixed ring, the optical element and the light-emitting element are all received in an inside of the shell, and the first cover is disposed at an end of the shell. In addition, the shell has a first stop part disposed in the inside of the shell, the optical element is disposed between the first stop part and the fixed ring, and the optical element is leant against the first stop part and the fixed ring. The light-emitting element is disposed between the fixed ring and the first cover, and is leant against the fixed ring and the first cover. A projection device using the source light module is also provided.

Abstract: A light source module includes a shell, a fixed ring, an optical element, a first cover and a light-emitting element. The shell is formed as a tubular shape. The fixed ring, the optical element and the light-emitting element are all received in an inside of the shell, and the first cover is disposed at an end of the shell. In addition, the shell has a first stop part disposed in the inside of the shell, the optical element is disposed between the first stop part and the fixed ring, and the optical element is leant against the first stop part and the fixed ring. The light-emitting element is disposed between the fixed ring and the first cover, and is leant against the fixed ring and the first cover. A projection device using the source light module is also provided.

Abstract: An antenna module including a casing, a USB connecting end, an antenna, a key and a moving component is provided. The casing has a terminal end opposite to the USB connecting end and a hole located at the terminal end. The antenna is disposed in the casing near the terminal end. The key disposed in the casing has an enabling portion for enabling the key when being touched. The moving component disposed in the casing includes a contacting member and an actuating member. The contacting member has first and second ends and a pivotal portion. The pivotal portion is pivotally connected to the casing between the first and second ends. The actuating member exposed from the hole is for moving toward the USB connecting end. The first end is driven by the actuating member, so that the second end is rotated around the pivotal portion to touch the enabling portion.

Abstract: A data transmission base is used to transmit data for a data transmission device. The data transmission device has a data transmission body and a cover. The data transmission body has a first transmission interface. The data transmission base includes a transmission connection body and a cover connection body. The transmission connection body has a second transmission interface for connecting the first transmission interface. The cover connection body, which is connected to the transmission connection body, is used for connecting the cover.

Abstract: A fixing heat dissipating unit that is disposed in an electronic device is connected to a substrate and a heat source. The fixing heat dissipating unit includes a fixing element and a heat conducting element. The fixing element is connected to the substrate to hold the substrate in the electronic device. The heat conducting element is respectively connected to the heat source and the fixing element. The heat source is a part of the electronic device and the fixing element is integrated with the heat conducting element as a single component. An electronic device having the fixing heat dissipating unit is also disclosed.

Abstract: An antenna module including a casing, a USB connecting end, an antenna, a key and a moving component is provided. The casing has a terminal end opposite to the USB connecting end and a hole located at the terminal end. The antenna is disposed in the casing near the terminal end. The key disposed in the casing has an enabling portion for enabling the key when being touched. The moving component disposed in the casing includes a contacting member and an actuating member. The contacting member has first and second ends and a pivotal portion. The pivotal portion is pivotally connected to the casing between the first and second ends. The actuating member exposed from the hole is for moving toward the USB connecting end. The first end is driven by the actuating member, so that the second end is rotated around the pivotal portion to touch the enabling portion.

Abstract: A data transmission base is used to transmit data for a data transmission device. The data transmission device has a data transmission body and a cover. The data transmission body has a first transmission interface. The data transmission base includes a transmission connection body and a cover connection body. The transmission connection body has a second transmission interface for connecting the first transmission interface. The cover connection body, which is connected to the transmission connection body, is used for connecting the cover.

Abstract: A fixing heat dissipating unit that is disposed in an electronic device is connected to a substrate and a heat source. The fixing heat dissipating unit includes a fixing element and a heat conducting element. The fixing element is connected to the substrate to hold the substrate in the electronic device. The heat conducting element is respectively connected to the heat source and the fixing element. The heat source is a part of the electronic device and the fixing element is integrated with the heat conducting element as a single component. An electronic device having the fixing heat dissipating unit is also disclosed.

Abstract: A CMOS transistor device including a tensile-stressed NMOS transistor and a PMOS transistor is disclosed. The NMOS transistor includes a gate, a gate oxide layer between the gate and semiconductor substrate, a silicon oxide offset spacer on sidewalls of the gate, N type lightly doped source/drain implanted into the semiconductor substrate next to the silicon oxide offset spacer, N type heavily doped source/drain implanted into the semiconductor substrate next to the N type lightly doped source/drain, and tensile-stressed silicon nitride layer covering the gate, the N type lightly doped source/drain, and the N type heavily doped source/drain.

Abstract: The invention is directed to a method for manufacturing a semiconductor device. The method comprises steps of forming a gate dielectric layer, a polysilicon layer and a patterned cap layer over a substrate sequentially and patterning the polysilicon layer to be a polysilicon gate by using the patterned cap layer as a mask. A plurality of lightly doped drain (LDD) regions are formed in the substrate aside the polysilicon gate, wherein a channel region is formed between the LDD regions in the substrate. A spacer is formed on the sidewall of the polysilicon gate and a source/drain region is formed in the substrate adjacent to the spacer. The patterned cap layer is removed and the spacer is removed. A metal silicidation process is performed for transforming the polysilicon gate into a metal silicide gate and forming a metal silicide layer at a surface of the source/drain region.

Abstract: A CMOS transistor device including a tensile-stressed NMOS transistor and a PMOS transistor is disclosed. The NMOS transistor includes a gate, a gate oxide layer between the gate and semiconductor substrate, a silicon oxide offset spacer on sidewalls of the gate, N type lightly doped source/drain implanted into the semiconductor substrate next to the silicon oxide offset spacer, N type heavily doped source/drain implanted into the semiconductor substrate next to the N type lightly doped source/drain, and tensile-stressed silicon nitride layer covering the gate, the N type lightly doped source/drain, and the N type heavily doped source/drain.