Patents by Inventor Liang-Yao Chang

Liang-Yao Chang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7655870
    Abstract: An exemplary printed circuit board includes a power plane, and a ground plane. The power plane includes two power modules, and an insulating medium for insulating the two power modules from each other. The ground plane is insulated from the power plane, a plurality of slots is defined in the ground plane and located close to facing edges of the two power modules, and the slots are arranged in rows along the facing edges of the two power modules.
    Type: Grant
    Filed: July 30, 2007
    Date of Patent: February 2, 2010
    Assignee: Hon Hai Precision Industry Co., Ltd.
    Inventors: Liang-Yao Chang, Shou-Kuo Hsu
  • Publication number: 20080115964
    Abstract: An exemplary printed circuit board includes a power plane, and a ground plane. The power plane includes two power modules, and an insulating medium for insulating the two power modules from each other. The ground plane is insulated from the power plane, a plurality of slots is defined in the ground plane and located close to facing edges of the two power modules, and the slots are arranged in rows along the facing edges of the two power modules.
    Type: Application
    Filed: July 30, 2007
    Publication date: May 22, 2008
    Applicant: HON HAI PRECISION INDUSTRY CO., LTD.
    Inventors: LIANG-YAO CHANG, SHOU-KUO HSU
  • Publication number: 20080099231
    Abstract: An exemplary printed circuit board includes a power plane, and a ground plane. The power plane includes two power modules, and a strip made of insulating medium disposed between the two power modules for insulating the two power modules from each other. The ground plane is insulated from the power plane, a plurality of vias electrically connects the power plane and the ground plane, and is close to the strip. Each via is insulated from the power module by an annular insulating medium. Each power module and the vias forms an equivalent coupling capacitance, and SSN can be conducted to the ground plane via the equivalent coupling capacitance, therefore, the SSN in the PCB is suppressed.
    Type: Application
    Filed: July 30, 2007
    Publication date: May 1, 2008
    Applicant: HON HAI PRECISION INDUSTRY CO., LTD.
    Inventors: LIANG-YAO CHANG, SHOU-KUO HSU
  • Publication number: 20080053687
    Abstract: A printed circuit board includes a power plane, a ground plane insulated from the power plane, and at least one via. The power plane includes two power modules, an insulating medium for insulating the two power modules, and a signal transmission line positioned between the two power modules and insulated from the two power modules by the insulating medium. The at least one via connects the signal transmission line with the ground plane for conducting simultaneous switching noise (SSN) transmitted to the power modules to the ground plane.
    Type: Application
    Filed: June 11, 2007
    Publication date: March 6, 2008
    Applicant: HON HAI PRECISION INDUSTRY CO., LTD.
    Inventors: LIANG-YAO CHANG, SHOU-KUO HSU