Patents by Inventor Liang Ying

Liang Ying has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240133716
    Abstract: A reading device for capacitive sensing element comprises a differential capacitive sensing element, a modulator, a charge-voltage conversion circuit, a phase adjustment circuit, a demodulator and a low-pass filter. The modulator outputs a modulation signal to the common node of the capacitive sensing element and modulates the output signal of the capacitive sensing element. The two input terminals of the charge-to-voltage conversion circuit are connected to two non-common nodes of the capacitive sensing element. The charge-to-voltage converter read the output charge of the capacitive sensing element and convert it into a voltage signal. The modulator generates a demodulation signal through the phase adjustment circuit. The demodulator receives the demodulation signal from the phase adjustment circuit and demodulates the output of the charge-to-voltage conversion circuit. The low-pass filter is connected to the output of the demodulator for filtering the demodulated voltage signal to output the read signal.
    Type: Application
    Filed: January 13, 2023
    Publication date: April 25, 2024
    Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Lu-Pu LIAO, Yu-Sheng LIN, Liang-Ying LIU, Chin-Fu KUO
  • Publication number: 20240116950
    Abstract: Provided are small molecule inhibitors of the KRAS(G12D) mutant oncoprotein having the structural formula: and pharmaceutically acceptable salts and compositions thereof, which are useful for treating cancers and related conditions.
    Type: Application
    Filed: September 8, 2023
    Publication date: April 11, 2024
    Inventors: Weiwen Ying, Chenghao Ying, Kevin P. Foley, Zhiyong Wang, Wei Yin, Liang Ma, Guoqiang Wang, Jinhua Li, Yaya Wang, Yan Dai, Thomas Prince
  • Patent number: 11943918
    Abstract: A memory structure is provided in the present disclosure. The memory structure includes a substrate, a plurality of discrete memory gate structures on the substrate where each of the plurality of memory gate structures includes a floating gate layer and a control gate layer on the floating gate layer, an isolation layer formed between adjacent memory gate structures where a top surface of the isolation layer is lower than a top surface of the control gate layer and higher than a bottom surface of the control gate layer, an opening is formed on an exposed sidewall of the control gate layer, and a bottom of the opening is lower than or coplanar with the top surface of the isolation layer, and a metal silicide layer on an exposed surface of the control gate layer and the top surface of the isolation layer.
    Type: Grant
    Filed: April 17, 2023
    Date of Patent: March 26, 2024
    Assignees: Semiconductor Manufacturing International (Shanghai) Corporation, Semiconductor Manufacturing International (Beijing) Corporation
    Inventors: Liang Han, Hai Ying Wang
  • Publication number: 20240066814
    Abstract: A method of manufacturing a decorated molding article includes: forming an all-in-one coating on a substrate and performing a curing step, thereby forming a composite layer structure with a protective effect, a color effect, and a bonding effect. Compared with the printing layer in the conventional In Mold Label (IML) and InSert molding (INS) that is made by a plurality of anti-impact and bonding processes, the composite layer structure of the embodiment can form a molded film with better physical properties (e.g., higher hardness, better protection effect, etc.) after the blister molding process. Therefore, the molded film of the embodiment can be applied to a laser engraving process to form a variety of light-transmitting decorative molded products. Further, the present disclosure further forms a protective layer locally in the grooves formed after the laser engraving process, so as to protect the texture after the laser engraving process from damage.
    Type: Application
    Filed: February 9, 2023
    Publication date: February 29, 2024
    Applicant: Jin Ya Dian Technology Co.,Ltd.
    Inventors: Che-Ming Yu, Kuo-Liang Ying
  • Publication number: 20240066769
    Abstract: Provided is a decorated molding article includes a workpiece and a molded film attached to an outer surface of the workpiece or an inner surface of the workpiece. Compared with the printing layer in the conventional In Mold Label (IML) and InSert molding (INS) that is made by a plurality of anti-impact and bonding processes, a plurality of stacked decorative layers of the embodiment not only provide various color effects, but also directly combined with injection molding material to form part products and have both a protection effect and an adhesive effect. Further, the present disclosure can effectively simplify the manufacturing steps of the composite layer structure and reduce the manufacturing cost.
    Type: Application
    Filed: June 28, 2023
    Publication date: February 29, 2024
    Applicant: Jin Ya Dian Technology Co.,Ltd.
    Inventors: Che-Ming Yu, Kuo-Liang Ying
  • Patent number: 11840008
    Abstract: A method of fabricating a decorated molding article includes forming an all-in-one coating on a substrate and performing a curing step, thereby forming a composite layer structure with a protective effect, a color effect, and a bonding effect. The composite layer structure may form a molded film with better physical properties (e.g., higher hardness, better protection effect, and the like) after the blister molding process. Therefore, the molded film of the embodiments may be applied to a laser engraving process to form a variety of light-transmitting decorated molding articles.
    Type: Grant
    Filed: October 24, 2021
    Date of Patent: December 12, 2023
    Assignee: Jin Ya Dian Technology Co., Ltd.
    Inventors: Che-Ming Yu, Kuo-Liang Ying
  • Patent number: 11815369
    Abstract: The differential capacitor device includes a differential capacitor sensing component, a calibration capacitor assembly and two output terminals. The differential capacitive sensing element has a common point terminal, a first non-common point terminal and a second non-common point terminal, and the common point terminal is configured to receive an input voltage. The calibration capacitor assembly has a first calibration capacitor and a second calibration capacitor, one terminal of the calibration capacitor assembly is coupled to the first non-common point terminal and the second non-common point terminal, and the other terminal of the calibration capacitor assembly is configured to receive a first calibration voltage and a second calibration voltage. The two output terminals are respectively coupled to the first non-common point terminal and the second non-common point terminal to output a first signal and a second signal.
    Type: Grant
    Filed: July 12, 2022
    Date of Patent: November 14, 2023
    Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Lu-Po Liao, Chin-Fu Kuo, Liang-Ying Liu, Yu-Sheng Lin
  • Publication number: 20230184567
    Abstract: The differential capacitor device includes a differential capacitor sensing component, a calibration capacitor assembly and two output terminals. The differential capacitive sensing element has a common point terminal, a first non-common point terminal and a second non-common point terminal, and the common point terminal is configured to receive an input voltage. The calibration capacitor assembly has a first calibration capacitor and a second calibration capacitor, one terminal of the calibration capacitor assembly is coupled to the first non-common point terminal and the second non-common point terminal, and the other terminal of the calibration capacitor assembly is configured to receive a first calibration voltage and a second calibration voltage. The two output terminals are respectively coupled to the first non-common point terminal and the second non-common point terminal to output a first signal and a second signal.
    Type: Application
    Filed: July 12, 2022
    Publication date: June 15, 2023
    Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Lu-Po LIAO, Chin-Fu KUO, Liang-Ying LIU, Yu-Sheng LIN
  • Publication number: 20220371256
    Abstract: A method of fabricating a decorated molding article includes forming an all-in-one coating on a substrate and performing a curing step, thereby forming a composite layer structure with a protective effect, a color effect, and a bonding effect. The composite layer structure may form a molded film with better physical properties (e.g., higher hardness, better protection effect, and the like) after the blister molding process. Therefore, the molded film of the embodiments may be applied to a laser engraving process to form a variety of light-transmitting decorated molding articles.
    Type: Application
    Filed: October 24, 2021
    Publication date: November 24, 2022
    Applicant: Jin Ya Dian Technology Co.,Ltd.
    Inventor: Kuo-Liang Ying
  • Publication number: 20220371243
    Abstract: A decorated molding article includes a workpiece and a composite layer structure. The composite layer structure is attached to an outer surface of the workpiece through an adhesive layer. The composite layer structure at least includes: a substrate having a first surface and a second surface opposite to each other; an optical effect layer disposed on the first surface of the substrate; and a decorative layer disposed between the first surface of the substrate and the optical effect layer. The decorative layer formed by a printing method has a thickness less than a thickness of the optical effect layer formed by a coating method, and the optical effect layer and the decorative layer each includes a protective material, an ink material, and an adhesive material. In such embodiment, the all-in-one coating material may be formed on the substrate by the coating method or the printing method to form the optical effect layer and the decorative layer with protective, color, and adhesive effects.
    Type: Application
    Filed: June 23, 2021
    Publication date: November 24, 2022
    Applicant: Jin Ya Dian Technology Co.,Ltd.
    Inventor: Kuo-Liang Ying
  • Publication number: 20220365040
    Abstract: A microelectromechanical sensing apparatus with calibration function comprises a microelectromechanical sensor and an IC chip. The microelectromechanical sensor comprises a proof mass, a movable driving electrode and a movable sensing electrode disposed on the proof mass, and a stationary driving electrode and stationary sensing electrode disposed on a substrate, wherein the sensing electrodes output a sensing signal when the proof mass vibrates.
    Type: Application
    Filed: December 1, 2021
    Publication date: November 17, 2022
    Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Chung-Yuan SU, Chin-Fu KUO, Liang-Ying LIU, Chao-Ta HUANG
  • Publication number: 20220347985
    Abstract: Provided is a composite layer structure comprising a first layer and a second layer. The second layer is disposed on the first layer. A material of the second layer is different from a material of the first layer. The composite layer structure is formed by a co-extrusion molding film process, and the composite layer structure has a thickness of between 0.01 mm and 1 mm. Further, the present invention also provides a decorated molding article and a method for fabricating the same.
    Type: Application
    Filed: July 14, 2022
    Publication date: November 3, 2022
    Applicant: KIMI SAWA ENTERPRISE LIMITED
    Inventor: Kuo-Liang Ying
  • Patent number: 11441761
    Abstract: A track adapter has a mounting seat, an electrical supply column, an adjustment conductive portion, and an adjustment knob, and a drive mechanism. As to the track adapter and the driving power supply with the track adapter and the track light, the lamp holder of the track lamp can wrap the whole track, which is neat and beautiful, and solve the problem of difficult phase adjustment of adaptor in the prior art at the same time. The phase adjustment knob is shrunk and put on the top of the adaptor, which solves the adjustment problem and adapts to more occasions, so that the structural design of the track lamp is more flexible.
    Type: Grant
    Filed: June 29, 2021
    Date of Patent: September 13, 2022
    Assignee: Self Electronics Co., Ltd.
    Inventors: Jun Yang, Jianguo Dong, Liang Ying, Biao Wang
  • Publication number: 20220186918
    Abstract: A track adapter has a mounting seat, an electrical supply column, an adjustment conductive portion, and an adjustment knob, and a drive mechanism. As to the track adapter and the driving power supply with the track adapter and the track light, the lamp holder of the track lamp can wrap the whole track, which is neat and beautiful, and solve the problem of difficult phase adjustment of adaptor in the prior art at the same time. The phase adjustment knob is shrunk and put on the top of the adaptor, which solves the adjustment problem and adapts to more occasions, so that the structural design of the track lamp is more flexible.
    Type: Application
    Filed: June 29, 2021
    Publication date: June 16, 2022
    Inventors: Jun Yang, Jianguo Dong, Liang Ying, Biao Wang
  • Publication number: 20200134116
    Abstract: A simulation system includes an application, a chip model and an off-chip model. The application is configured to generate a corresponding instruction set in accordance with an application situation of a simulation circuit, wherein the simulation circuit includes a chip. The chip model receives the instruction set as an input to simulate operation of at least one intellectual property core of the chip via high-level languages in accordance with the at least one intellectual property core of the chip and to generate a power consumption and an I/O logic signal of the chip. The off-chip model constructs one or more orders of RLCG circuit cascading models in accordance with all or part of the off-chip model abstracted by the S parameter. The application program and the RLCG circuit cascading model are integrated for simulating and analyzing power integrity and signal integrity of the simulation system.
    Type: Application
    Filed: December 19, 2018
    Publication date: April 30, 2020
    Inventors: Yeong-Jar CHANG, Jen-Hsiang LEE, Liang-Ying LU
  • Publication number: 20200039191
    Abstract: Provided is a composite layer structure comprising a first layer and a second layer. The second layer is disposed on the first layer. A material of the second layer is different from a material of the first layer. The composite layer structure is formed by a co-extrusion molding film process, and the composite layer structure has a thickness of between 0.01 mm and 1 mm. Further, the present invention also provides a decorated molding article and a method for fabricating the same.
    Type: Application
    Filed: April 29, 2019
    Publication date: February 6, 2020
    Applicant: Jin Ya Dian Technology Co.,Ltd.
    Inventor: Kuo-Liang Ying
  • Patent number: 9996641
    Abstract: A thermal simulation device for an integrated circuit according to the disclosure comprises a thermal analysis unit and a mesh size analysis unit. The thermal analysis unit performs a thermal analysis of the integrated circuit to obtain temperatures of the center point and boundary of each function block. The mesh size analysis unit determines the cell number in the mesh of each function block. The thermal analysis unit computes a temperature of the center point and boundary of each cell in every function block according to the temperatures of the boundary of each function block.
    Type: Grant
    Filed: January 8, 2016
    Date of Patent: June 12, 2018
    Assignee: NATIONAL CHENG KUNG UNIVERSITY
    Inventors: Lih-Yih Chiou, Liang-Ying Lu
  • Publication number: 20180003359
    Abstract: A three dimensional (3D) glass structure for decorating a workpiece includes a 3D glass layer, a light emitting layer, and a decorating layer. The 3D glass layer has a front surface and a back surface opposite to each other. The light emitting layer is disposed on the back surface of the 3D glass layer. The decorating layer is disposed between the 3D glass layer and the light emitting layer.
    Type: Application
    Filed: August 25, 2016
    Publication date: January 4, 2018
    Applicant: Jin Ya Dian Technology Co.,Ltd.
    Inventors: Kuo-Liang Ying, Ya-Yu Lai
  • Publication number: 20170305118
    Abstract: A film for decorating a workpiece, a decorated molding article and a method for fabricating the decorated molding article are provided. The film includes a wood veneer layer, an extension layer, an adhesive layer, and a base layer. The wood veneer layer has a first surface and a second surface opposite to each other. The extension layer is disposed on the first surface of the wood veneer layer. The adhesive layer is disposed on the second surface of the wood veneer layer. The base layer is disposed between the wood veneer layer and the adhesive layer. The adhesive layer is disposed between the base layer and the workpiece.
    Type: Application
    Filed: July 22, 2016
    Publication date: October 26, 2017
    Applicant: Jin Ya Dian Technology Co.,Ltd.
    Inventors: Kuo-Liang Ying, Ya-Yu Lai
  • Patent number: D892895
    Type: Grant
    Filed: July 10, 2018
    Date of Patent: August 11, 2020
    Assignee: HANGZHOU HIKVISION DIGITAL TECHNOLOGY CO., LTD.
    Inventors: Fengmin Zhang, Peng Xu, Liang Ying, Zhan Ye