Abstract: A method of forming spacers on a display substrate is described. First, a mould having a plurality of trenches is provided. Spacer are dropped onto the mould. When the mould is vibrated, the spacers fall into the trenches. Then, a display substrate having viscous substance on a surface thereof is pressed onto the spacers in the trenches of the mould, so that the spacers are bonded to the display substrate due to the viscous substance. Finally, the spacers bonded with the display substrate are removed from the trenches of the mould.

Abstract: A method of fabricating an electronic device includes the following steps: a) providing a substrate; b) forming a first strip on the substrate; c) coating an insulation layer on the first strip and the substrate while completely overlaying the first strip and the substrate with the same; d) forming a second strip on the insulation layer; e) forming conductive polymer on the insulation layer while completely overlaying the second strip with the same; f) etching the conductive polymer via plasma etching for completely removing the conductive polymer on the second strip; and g) forming a semiconductor layer on the second strip and the conductive polymer.

Abstract: The present invention discloses a multi-passivation layer structure for organic thin-film transistors and a method for fabricating the same by spin coating, inject printing, screen printing and micro-contact on organic thin-film transistors. The multi-passivation layer structure for organic thin-film transistors, comprising: a substrate; a gate layer formed on the substrate; an insulator layer formed on the substrate and the gate layer; an electrode layer formed on the insulator layer; a semiconductor layer formed on the insulator layer and the electrode layer; and a passivation layer formed on the semiconductor layer and the electrode layer, thereby forming a multi-passivation layer structure for organic thin-film transistors.

Abstract: An organic semiconductor element having multi protection layers and process of making the same are provided. Firstly, forming a first protection layer on the thin film transistor. Next, forming a second protection layer which is thick enough to serve as the photo spacers on said first protection layer. The multi protection layers are then grown on said organic thin film transistor, so as to enable the second protection layer to have the additional function of the photo spacers by the patterning process. Thus the organic thin film transistor can be prevented from being damaged, and achieving the simplification of the manufacturing process and the reduction of the production cost.

Abstract: A method of fabricating an electronic device includes the following steps: a) providing a substrate; b) forming a first strip on the substrate; c) coating an insulation layer on the first strip and the substrate while completely overlaying the first strip and the substrate with the same; d) forming a second strip on the insulation layer; e) forming conductive polymer on the insulation layer while completely overlaying the second strip with the same; f) etching the conductive polymer via plasma etching for completely removing the conductive polymer on the second strip; and g) forming a semiconductor layer on the second strip and the conductive polymer.

Abstract: The invention related to a process for improving carrier mobility of organic semiconductor, comprising the steps of: forming a gate on a substrate; forming an insulator layer on the substrate and the gate; coating polyimide on the insulator layer to form an interlayer; forming an active layer on the interlayer; and forming a source and a drain.

Abstract: A method for manufacturing an organic thin-film transistor with a plastic substrate, comprising steps of: providing a mold and a plastic substrate, said mold being provided with a relief printing structure; imprinting said plastic substrate by said mold so as to define source/drain electrode regions on said plastic substrate; forming a first electrode layer so as to form source/drain electrodes on said source/drain electrode regions on said plastic substrate; forming a plurality of semiconductor mesas, each of said semiconductor mesas covering a pair of said source/drain electrodes; forming an insulating layer; forming a second electrode layer, being separated from and on said semiconductor mesas by said insulating layer; and forming a passivation layer.

Abstract: A method of high precision printing for manufacturing organic thin film transistor, comprising the following steps of: forming a gate on a substrate; forming an insulator layer on the substrate; forming a conducting wire electrode film on the insulator layer; forming a organic interlayer; forming a organic semiconductor layer on the organic interlayer; forming a polymer layer for channel length on the organic semiconductor layer; forming a organic electrode film; and forming a protective layer. Moreover, a means for forming layers of above mentioned method is a high precision printing selected from the consisting of Inkject Printing, Screen Printing, Blade Coating, Roller Coating, Nanoimprinting, Micro Contact Printing, Flexographic printing, Table coating and Spin Coating, etc.

Abstract: The present invention discloses a multi-passivation layer structure for organic thin-film transistors and a method for fabricating the same by spin coating, inject printing, screen printing and micro-contact on organic thin-film transistors. The multi-passivation layer structure for organic thin-film transistors, comprising: a substrate; a gate layer formed on the substrate; an insulator layer formed on the substrate and the gate layer; an electrode layer formed on the insulator layer; a semiconductor layer formed on the insulator layer and the electrode layer; and a passivation layer formed on the semiconductor layer and the electrode layer, thereby forming a multi-passivation layer structure for organic thin-film transistors.

Abstract: An organic thin-film transistor and a method for manufacturing the same are described. The method forms a gate layer on a substrate, an insulator layer on the substrate, forming a semiconductor layer on the insulator layer, and a strip for defining a channel length on the semiconductor layer. An electrode layer is screen printed on the semiconductor layer, and a passivation layer is coated on the electrode layer. The organic thin-film transistor manufactured by the method of the invention has a substrate, a gate layer formed on the substrate, an insulator layer formed on the substrate, a semiconductor layer formed on the insulator layer, a strip for defining a channel length formed on the semiconductor layer, an electrode layer screen-printed on the semiconductor layer, and a passivation layer coated on the electrode layer. Thereby, an organic thin-film transistor with a top-contact/bottom-gate structure is obtained.

Abstract: A color filter manufacturing method for a plastic substrate uses an extrusion process to form a plastic substrate with multiple grooves. Then, it uses inkjet printing method to jet photo resists into the groove of the plastic substrate after defining the primary colors of red R., green G., and blue B. The method can overcome the problem happened in the conventional CF photolithography process. This, therefore, can simplify the manufacturing process, and can apply to the large-area plastic substrate of a color filter.

Abstract: A method of forming spacers on a display substrate is described. First, a mould having a plurality of trenches is provided. Spacer are dropped onto the mould. When the mould is vibrated, the spacers fall into the trenches. Then, a display substrate having viscous substance on a surface thereof is pressed onto the spacers in the trenches of the mould, so that the spacers are bonded to the display substrate due to the viscous substance. Finally, the spacers bonded with the display substrate are removed from the trenches of the mould.

Abstract: A diffusion reflector having a TiO2 layer and a process for manufacturing the same are proposed. The TiO2 layer is disposed on a diffusion reflector by coating, electroplating or plasma enhanced chemical vapor deposition process. The directional dependency of the reflector on external luminosity is reduced and the resulting appearance of the reflector looks like the appearance of white paper.