Abstract: A simulation system includes an application, a chip model and an off-chip model. The application is configured to generate a corresponding instruction set in accordance with an application situation of a simulation circuit, wherein the simulation circuit includes a chip. The chip model receives the instruction set as an input to simulate operation of at least one intellectual property core of the chip via high-level languages in accordance with the at least one intellectual property core of the chip and to generate a power consumption and an I/O logic signal of the chip. The off-chip model constructs one or more orders of RLCG circuit cascading models in accordance with all or part of the off-chip model abstracted by the S parameter. The application program and the RLCG circuit cascading model are integrated for simulating and analyzing power integrity and signal integrity of the simulation system.

Abstract: A thermal simulation device for an integrated circuit according to the disclosure comprises a thermal analysis unit and a mesh size analysis unit. The thermal analysis unit performs a thermal analysis of the integrated circuit to obtain temperatures of the center point and boundary of each function block. The mesh size analysis unit determines the cell number in the mesh of each function block. The thermal analysis unit computes a temperature of the center point and boundary of each cell in every function block according to the temperatures of the boundary of each function block.

Abstract: A thermal simulation device for an integrated circuit according to the disclosure comprises a thermal analysis unit and a mesh size analysis unit. The thermal analysis unit performs a thermal analysis of the integrated circuit to obtain temperatures of the center point and boundary of each function block. The mesh size analysis unit determines the cell number in the mesh of each function block. The thermal analysis unit computes a temperature of the center point and boundary of each cell in every function block according to the temperatures of the boundary of each function block.