Patents by Inventor Liang-Yu Hu

Liang-Yu Hu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9434045
    Abstract: A planarization device and a planarization method using the same are provided. The planarization device comprises a platen, a grinding pad, an operation arm, a chuck and a shielding pad. The grinding pad is disposed on the platen. The operation arm has a lower surface. The chuck rotatably is disposed on the operation arm. The shielding pad is detachably disposed on the lower surface of the operation arm.
    Type: Grant
    Filed: May 5, 2014
    Date of Patent: September 6, 2016
    Assignee: MACRONIX INTERNATIONAL CO., LTD.
    Inventors: Yu-Hua Yeh, Liang-Yu Hu, Tang-Tsai Chang, Ming-Tsan Lai
  • Publication number: 20150318179
    Abstract: A planarization device and a planarization method using the same are provided. The planarization device comprises a platen, a grinding pad, an operation arm, a chuck and a shielding pad. The grinding pad is disposed on the platen. The operation arm has a lower surface. The chuck rotatably is disposed on the operation arm. The shielding pad is detachably disposed on the lower surface of the operation arm.
    Type: Application
    Filed: May 5, 2014
    Publication date: November 5, 2015
    Applicant: Macronix International Co., Ltd.
    Inventors: Yu-Hua Yeh, Liang-Yu Hu, Tang-Tsai Chang, Ming-Tsan Lai
  • Patent number: 8602838
    Abstract: A chemical mechanical polishing method is provided. The chemical mechanical polishing method includes steps of providing a plurality of semiconductor elements to be polished, obtaining a respective dimension of the each semiconductor element to be polished, and polishing the each semiconductor element according to the respective dimension thereof.
    Type: Grant
    Filed: August 26, 2010
    Date of Patent: December 10, 2013
    Assignee: Mcronix International Co., Ltd.
    Inventors: Meng-Yi Shen, Liang-Yu Hu, Tsung-Hsuan Ho, Sheng-I Tseng
  • Publication number: 20120052604
    Abstract: A chemical mechanical polishing method is provided. The chemical mechanical polishing method includes steps of providing a plurality of semiconductor elements to be polished, obtaining a respective dimension of the each semiconductor element to be polished, and polishing the each semiconductor element according to the respective dimension thereof.
    Type: Application
    Filed: August 26, 2010
    Publication date: March 1, 2012
    Applicant: MACRONIX INTERNATIONAL CO., LTD.
    Inventors: Meng-Yi Shen, Liang-Yu Hu, Tsung-Hsuan Ho, Sheng-I Tseng