Patents by Inventor Liang-Yu Yao

Liang-Yu Yao has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Microelectroforming mold using a preformed metal as the substrate and the fabrication method of the same
    Patent number: 6881369
    Abstract: The invention discloses a microelectroforming mold using a preformed metal as the substrate and its fabrication method. Using a preformed metal as the substrate can avoid deformation of the microelectroforming mold due to residual stress in the electroforming metal. The fabrication method disclosed herein includes the steps of: forming a layer of bonding material on a surface of the preformed metal substrate after machining; forming a high aspect ratio photoresist microstructure on surfaces of the metal substrate and the bonding material; putting an electroforming material into the gaps of the photoresist microstructure to form an electroforming metal microstructure; and using a thermal process to bond the metal substrate and the metal micro structure by the bonding material and simultaneously bum off the photoresist microstructure to form a micro-electroforming mold.
    Type: Grant
    Filed: April 18, 2002
    Date of Patent: April 19, 2005
    Assignee: Industrial Technology Research Institute
    Inventors: Yuh-Wen Lee, Liang-Yu Yao, Chao-Chiun Liang, Jeng-En Juang, Ching-Yi Wu
  • Microelectroforming mold using a preformed metal as the substrate and the fabrication method of the same
    Publication number: 20030199163
    Abstract: The invention discloses a microelectroforming mold using a preformed metal as the substrate and its fabrication method. Using a preformed metal as the substrate can avoid deformation of the microelectroforming mold due to residual stress in the electroforming metal. The fabrication method disclosed herein includes the steps of: forming a layer of bonding material on a surface of the preformed metal substrate after machining; forming a high aspect ratio photoresist microstructure on surfaces of the metal substrate and the bonding material; putting an electroforming material into the gaps of the photoresist microstructure to form an electroforming metal microstructure; and using a thermal process to bond the metal substrate and the metal micro structure by the bonding material and simultaneously bum off the photoresist microstructure to form a micro-electroforming mold.
    Type: Application
    Filed: April 18, 2002
    Publication date: October 23, 2003
    Inventors: Yuh-Wen Lee, Liang-Yu Yao, Chao-Chiun Liang, Jeng-En Juang, Ching-Yi Wu