Patents by Inventor Liang-Yuh Chen

Liang-Yuh Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Conductive polishing article for electrochemical mechanical polishing
    Patent number: 7278911
    Abstract: Embodiments of a polishing article for polishing a substrate are provided. In one embodiment, the polishing article includes a ring-shaped upper layer having a polishing surface, and a conductive layer coupled to the upper layer and forming a replaceable assembly therewith.
    Type: Grant
    Filed: August 30, 2005
    Date of Patent: October 9, 2007
    Assignee: Applied Materials, Inc.
    Inventors: Paul D. Butterfield, Liang-Yuh Chen, Yonqi Hu, Antoine P. Manens, Rashid Mavliev, Stan D. Tsai, Feng Q. Liu, Ralph Wadensweiler, Lizhong Sun, Siew S. Neo, Alain Duboust
  • Retaining ring with conductive portion
    Patent number: 7276743
    Abstract: A retaining ring for use with electrochemical mechanical processing is described. The retaining ring has a generally annular body formed with a conductive portion and a non-conductive portion. The non-conductive portion contacts the substrate during polishing. The conductive portion is electrically biased during polishing to reduce the edge effect that tends to occur with conventional electrochemical mechanical processing systems.
    Type: Grant
    Filed: May 11, 2005
    Date of Patent: October 2, 2007
    Assignee: Applied Materials, Inc.
    Inventors: Antoine P. Manens, Suresh Shrauti, Alain Duboust, Yan Wang, Liang-Yuh Chen
  • Method for electrochemically polishing a conductive material on a substrate
    Publication number: 20070187258
    Abstract: Methods are provided for removing conductive materials from a substrate surface. In one aspect, a method includes providing a substrate comprising dielectric feature definitions formed between substrate field regions, a barrier material disposed in the feature definitions and on the substrate field regions, and a conductive material disposed on the barrier material, polishing the substrate to substantially remove a bulk portion of the conductive material with a direct current bias, and polishing the substrate to remove a residual portion of the conductive material with a pulse bias.
    Type: Application
    Filed: February 15, 2006
    Publication date: August 16, 2007
    Inventors: Tianbao Du, Feng Liu, Alain Duboust, Wei-Yung Hsu, Liang-Yuh Chen
  • PROCESS AND COMPOSITION FOR PASSIVATING A SUBSTRATE DURING ELECTROCHEMICAL MECHANICAL POLISHING
    Publication number: 20070144915
    Abstract: Compositions and methods for processing a substrate having a conductive material layer disposed thereon are provided. In one embodiment, a method of electrochemically processing a substrate using a conductive polishing article is provided. The method includes disposing a substrate having a conductive material layer formed thereon in a process apparatus comprising a cathode coupled to the conductive polishing article and an anode, wherein the substrate is in electrical contact with the anode, supplying a polishing composition comprising a cathodic inhibitor and an anodic inhibitor, forming a protective film on the cathode to prevent corrosion of the cathode, and polishing the substrate.
    Type: Application
    Filed: December 20, 2006
    Publication date: June 28, 2007
    Inventors: Yuan Tian, Renhe Jia, Feng Liu, Yongqi Hu, Stan Tsai, Liang-Yuh Chen, Robert Ewald
  • Polishing solution retainer
    Patent number: 7232363
    Abstract: A substrate polishing apparatus and method are described. A base includes at least one movable platen to engage a polishing pad. At least one carrier head assembly presses a substrate against the polishing pad substantially within a polishing area during a polishing operation. A polishing solution dispenser applies a polishing solution to the polishing pad substantially within the polishing area during the polishing operation. A polishing solution retaining mechanism is attached to one of the base or the carrier head assembly. The retaining mechanism engages a top surface of the polishing pad and retains the polishing solution substantially within the polishing area during the polishing operation. Some implementations may reduce polishing solution consumption and allow for increased angular velocity.
    Type: Grant
    Filed: September 16, 2004
    Date of Patent: June 19, 2007
    Assignee: Applied Materials, Inc.
    Inventors: Hanzhong Zhang, Feng Liu, Stan Tsai, Rashid Mavliev, Donald Olgado, Liang-Yuh Chen
  • Method and composition for polishing a substrate
    Patent number: 7232514
    Abstract: Polishing compositions and methods for removing conductive materials from a substrate surface are provided. In one aspect, a composition includes an acid based electrolyte system, one or more chelating agents, one or more corrosion inhibitors, one or more inorganic or organic acid salts, one or more pH adjusting agents to provide a pH between about 2 and about 10, a polishing enhancing material selected from the group of abrasive particles, one or more oxidizers, and combinations thereof, and a solvent. The composition may be used in an conductive material removal process including disposing a substrate having a conductive material layer formed thereon in a process apparatus comprising an electrode, providing the composition between the electrode and substrate, applying a bias between the electrode and the substrate, and removing conductive material from the conductive material layer.
    Type: Grant
    Filed: June 6, 2003
    Date of Patent: June 19, 2007
    Assignee: Applied Materials, Inc.
    Inventors: Feng Q. Liu, Stan D. Tsai, Yongqi Hu, Siew S. Neo, Yan Wang, Alain Duboust, Liang-Yuh Chen
  • Methods and apparatus for processing a substrate
    Publication number: 20070131654
    Abstract: Apparatus and methods adapted to polish an edge of a substrate include a polishing film, a frame adapted to tension and load the polishing film so that at least a portion of the film is supported in a plane, and a substrate rotation driver adapted to rotate a substrate against the plane of the polishing film such that the polishing film is adapted to apply force to the substrate, contour to an edge of the substrate, the edge including at least an outer edge and a first bevel, and polish the outer edge and the first bevel as the substrate is rotated. Numerous other aspects are provided.
    Type: Application
    Filed: December 9, 2005
    Publication date: June 14, 2007
    Applicant: Applied Materials, Inc.
    Inventors: Erik Wasinger, Gary Ettinger, Sen-Hou Ko, Wei-Yung Hsu, Liang-Yuh Chen, Ho Shin, Donald Olgado
  • Methods and apparatus for processing a substrate
    Publication number: 20070131653
    Abstract: Apparatus and methods adapted to polish an edge of a substrate include a polishing film, a frame adapted to tension and load the polishing film so that at least a portion of the film is supported in a plane, and a substrate rotation driver adapted to rotate a substrate against the plane of the polishing film such that the polishing film is adapted to apply force to the substrate, contour to an edge of the substrate, the edge including at least an outer edge and a first bevel, and polish the outer edge and the first bevel as the substrate is rotated. Numerous other aspects are provided.
    Type: Application
    Filed: December 9, 2005
    Publication date: June 14, 2007
    Inventors: Gary Ettinger, Erik Wasinger, Sen-Hou Ko, Wui-Yung Hsu, Liang-Yuh Chen, Ho Shin, Donald Olgado
  • Hydrogen bubble reduction on the cathode using double-cell designs
    Patent number: 7229535
    Abstract: An apparatus and method for planarizing a surface of a substrate using a chamber separated into two parts by a membrane, and two separate electrolytes is provided. The embodiments of the present invention generally provide an electrochemical mechanical polishing system that reduces the number of defects found on the substrate surface after polishing. An exemplary electrochemical apparatus includes a physical barrier that prevents any trapped gas or gas generated during processing from residing in areas that can cause defects on the substrate. The process can be aided by the addition of various chemical components to the electrolyte that tend to reduce the gas generation at the cathode surface during the ECMP anodic dissolution process.
    Type: Grant
    Filed: June 6, 2003
    Date of Patent: June 12, 2007
    Assignee: Applied Materials, Inc.
    Inventors: Yan Wang, Feng Q. Liu, Alain Duboust, Siew S. Neo, Liang-Yuh Chen, Yongqi Hu
  • PAD ASSEMBLY FOR ELECTROCHEMICAL MECHANICAL POLISHING
    Publication number: 20070111638
    Abstract: Embodiments of a pad assembly for processing a substrate are provided. The pad assembly includes a processing layer having a working surface adapted to process a substrate, a lower layer coupled to and disposed below the processing layer, and an electrode having an upper surface disposed above the lower layer and below the working surface of the processing layer. The upper surface of the electrode is at least partially exposed to the working surface by a plurality of apertures to provide an electrolyte pathway between the upper surface of the electrode and the working surface of the pad assembly.
    Type: Application
    Filed: November 21, 2006
    Publication date: May 17, 2007
    Inventors: SHOU-SUNG CHANG, Stan Tsai, Donald Olgado, Liang-Yuh Chen, Alain Duboust, Ralph Wadensweiler
  • CONDUCTIVE PAD WITH ION EXCHANGE MEMBRANE FOR ELECTROCHEMICAL MECHANICAL POLISHING
    Publication number: 20070099552
    Abstract: An article of manufacture and apparatus are provided for processing a substrate surface. In one aspect, an article of manufacture is provided for polishing a substrate including polishing article comprising a body having at least a partially conductive polishing surface. An electrode is disposed below the polishing surface having a dielectric material therebetween. A plurality of apertures may be formed in the polishing surface and the dielectric material to at least partially expose the electrode to the polishing surface. A membrane may be disposed between the electrode and the polishing surface that is permeable to ions and current to promote continuity between the electrode and the polishing surface.
    Type: Application
    Filed: October 31, 2006
    Publication date: May 3, 2007
    Inventors: Liang-Yuh Chen, Yuchun Wang, Yan Wang, Alain Duboust, Daniel Carl, Ralph Wadensweiler, Manoocher Birang, Paul Butterfield, Rashid Mavliev, Stan Tsai, You Wang, Jie Diao, Renhe Jia, Lakshmanan Karuppiah, Robert Ewald
  • Method and apparatus for reduced wear polishing pad conditioning
    Patent number: 7210988
    Abstract: Embodiments of a conditioning head for in-situ conditioning and/or cleaning a processing pad of a CMP, ECMP, or other processing system are provided. In one embodiment, the conditioning head includes a brush disposed in a central cavity. A cleaning fluid is provided through the central cavity of the conditioning head to a processing pad. The brush spins and moves laterally across the surface of the processing pad. The cleaning solution dispensed through the conditioning head dissolves by-products of the processing operation while the brush gently wipes the processing pad. A lip of the conditioning head retains the cleaning fluid and cleaning waste, thereby minimizing contamination of the area outside of the conditioning head. The cleaning waste is removed from the processing pad via passages formed near the outer periphery of the conditioning head.
    Type: Grant
    Filed: August 22, 2005
    Date of Patent: May 1, 2007
    Assignee: Applied Materials, Inc.
    Inventors: Yan Wang, Stan D. Tsai, Yongqi Hu, Feng Q. Liu, Liang-Yuh Chen, Daxin Mao, Huyen Karen Tran, Martin S. Wohlert, Renhe Jia, Yuan A. Tian
  • Conductive polishing article for electrochemical mechanical polishing
    Patent number: 7207878
    Abstract: Embodiments of a polishing article for processing a substrate are provided. In one embodiment, a polishing article for processing a substrate comprises a fabric layer having a conductive layer disposed thereover. The conductive layer has an exposed surface adapted to polish a substrate. The fabric layer may be woven or non-woven. The conductive layer may be comprised of a soft metal and, in one embodiment, the exposed surface may be planar.
    Type: Grant
    Filed: January 8, 2005
    Date of Patent: April 24, 2007
    Assignee: Applied Materials, Inc.
    Inventors: Yongqi Hu, Yan Wang, Alain Duboust, Feng Q. Liu, Antoine P. Manens, Siew S. Neo, Stan D. Tsai, Liang-Yuh Chen, Paul D. Butterfield, Yuan A. Tian, Sen-Hou Ko
  • CONDUCTIVE POLISHING ARTICLE FOR ELECTROCHEMICAL MECHANICAL POLISHING
    Publication number: 20070066201
    Abstract: An article of manufacture and apparatus are provided for planarizing a substrate surface. In one aspect, an article of manufacture is provided for polishing a substrate including polishing article comprising a body having at least a partially conductive surface adapted to polish the substrate. A plurality of perforations may be formed in the polishing article for flow of material therethrough. An electrode is also exposed to the polishing surface by at least a portion of the plurality of perforations. The article of manufacture may also include a polishing surface having a plurality of grooves, wherein a portion of the plurality of grooves intersect with a portion of the plurality of perforations.
    Type: Application
    Filed: November 2, 2006
    Publication date: March 22, 2007
    Inventors: Liang-Yuh Chen, Yuchun Wang, Yan Wang, Alain Duboust, Daniel Carl, Ralph Wadensweiler, Manoocher Birang, Paul Butterfield, Rashid Mavliev, Stan Tsai
  • Perforation and grooving for polishing articles
    Publication number: 20070066200
    Abstract: Methods, articles of manufacture, and apparatus are provided for depositing and planarizing one or more layers of material on a substrate, or combinations thereof, are disclosed. In one embodiment, an article of manufacture is provided for polishing a substrate, comprising a polishing article having a polishing surface, a plurality of perforations formed in at least a portion of the polishing article for flow of material therethrough, and a plurality of grooves disposed in the polishing surface. The article of manufacture may be used in a method for processing a substrate, comprising positioning the substrate in an electrolyte solution containing a polishing article, optionally depositing a material on the substrate by an electrochemical deposition method, and polishing the substrate with the polishing article.
    Type: Application
    Filed: May 5, 2006
    Publication date: March 22, 2007
    Inventors: Shijian Li, Liang-Yuh Chen, Alain Duboust
  • PAD ASSEMBLY FOR ELECTROCHEMICAL MECHANICAL PROCESSING
    Publication number: 20070034506
    Abstract: Embodiments of a processing pad assembly for processing a substrate are provided. The processing pad assembly includes an upper layer having a processing surface and an electrode having a top side coupled to the upper layer and a bottom side opposite the top side. A first set of holes is formed through the upper layer for exposing the electrode to the processing surface. At least one aperture is formed through the upper layer and the electrode.
    Type: Application
    Filed: July 18, 2006
    Publication date: February 15, 2007
    Inventors: Yongqi Hu, Stan Tsai, Yan Wang, Feng Liu, Shou-Sung Chang, Liang-Yuh Chen
  • Method and composition for polishing a substrate
    Patent number: 7160432
    Abstract: Polishing compositions and methods for removing conductive materials from a substrate surface are provided. In one aspect, a method is provided for processing a substrate to remove conductive material disposed over narrow feature definitions formed in a substrate at a higher removal rate than conductive material disposed over wide feature definitions formed in a substrate by an electrochemical mechanical polishing technique. The electrochemical mechanical polishing technique may include a polishing composition comprising an acid based electrolyte system, one or more chelating agents, one or more corrosion inhibitors, one or more inorganic or organic acid salts, one or more pH adjusting agents to provide a pH between about 2 and about 10, and a solvent.
    Type: Grant
    Filed: June 26, 2003
    Date of Patent: January 9, 2007
    Assignee: Applied Materials, Inc.
    Inventors: Feng Q. Liu, Liang-Yuh Chen, Stan D. Tsai, Alain Duboust, Siew S. Neo, Yongqi Hu, Yan Wang, Paul D. Butterfield
  • Full Sequence Metal and Barrier Layer Electrochemical Mechanical Processing
    Publication number: 20060260951
    Abstract: A method and apparatus for electrochemically processing metal and barrier materials is provided. In one embodiment, a method for electrochemically processing a substrate includes the steps of establishing an electrically-conductive path through an electrolyte between an exposed layer of barrier material on the substrate and an electrode, pressing the substrate against a processing pad assembly, providing motion between the substrate and pad assembly in contact therewith and electrochemically removing a portion of the exposed layer during a first electrochemical processing step in a barrier processing station.
    Type: Application
    Filed: June 21, 2006
    Publication date: November 23, 2006
    Inventors: Feng Liu, Liang-Yuh Chen, Stan Tsai, Yongqi Hu
  • Pad assembly for electrochemical mechanical processing
    Patent number: 7137868
    Abstract: Embodiments of a pad assembly for processing a substrate are provided. The pad assembly includes a processing layer having a working surface adapted to process a substrate, a lower layer coupled to and disposed below the processing layer, and an electrode having an upper surface disposed above the lower layer and below the working surface of the processing layer. The upper surface of the electrode is at least partially exposed to the working surface to provide an electrolyte pathway between the upper surface of the electrode and the working surface.
    Type: Grant
    Filed: March 6, 2006
    Date of Patent: November 21, 2006
    Assignee: Applied Materials, Inc.
    Inventors: Shou-Sung Chang, Stan D. Tsai, Donald J. K. Olgado, Liang-Yuh Chen, Alain Duboust, Ralph M. Wadensweiler
  • Conductive polishing article for electrochemical mechanical polishing
    Patent number: 7137879
    Abstract: An article of manufacture and apparatus are provided for planarizing a substrate surface. In one aspect, an article of manufacture is provided for polishing a substrate including polishing article comprising a body having at least a partially conductive surface adapted to polish the substrate and a mounting surface. A plurality of perforations may be formed in the polishing article for flow of material therethrough. In another aspect, a polishing article for polishing a substrate includes a body having a polishing surface and a conductive element disposed therein. The conductive element may have a contact surface that extends beyond a plane defined by the polishing surface. The polishing surface may have one or more pockets formed therein. The conductive element may be disposed in each of the polishing pockets.
    Type: Grant
    Filed: March 30, 2006
    Date of Patent: November 21, 2006
    Assignee: Applied Materials, Inc.
    Inventors: Liang-Yuh Chen, Yuchun Wang, Yan Wang, Alain Duboust, Daniel A. Carl, Ralph Wadensweiler, Manoocher Birang, Paul D. Butterfield, Rashid Mavliev, Stan D. Tsai