Abstract: An electronic modulating device is provided, which includes a first substrate, an electrode, and an insulating layer. The electrode is disposed on the first substrate, wherein the electrode comprises an opening defining a top edge and a bottom edge of the electrode, and the opening has a central portion. The insulating layer is disposed on the electrode and within the opening. Wherein a thickness of the insulating layer at the bottom edge is greater than a thickness of the insulating layer at the central portion, and the electrode has a first inner side and at least a portion of the first inner side is uneven.

Abstract: An electronic device is provided. The electronic device includes a substrate, a feeding line and an electrode. The feeding line is disposed on the substrate for transmitting a signal. The electrode is disposed on the substrate for receiving the signal. In addition, an end portion of the feeding line is disposed opposite to an end portion of the electrode.

Abstract: An electronic device is provided. The electronic device includes a first electronic device unit. The first electronic device unit includes a first substrate and a second substrate disposed opposite to the first substrate. The first substrate includes a protruding part which protrudes outward a boundary of the second substrate along a protruding direction perpendicular to a normal direction of the first substrate. The protruding part includes a first side surface having a portion that has been grinded and a portion that has been ungrinded, and a surface roughness of the portion that has been grinded is different from a surface roughness of the portion that has been ungrinded.

Abstract: An electronic modulating device is provided, which includes a first substrate, a second substrate disposed opposing to the first substrate, and a modulating material disposed between the first substrate and the second substrate. The electronic modulating device includes a buffer layer disposed on the first substrate, and a first electrode disposed on the buffer layer. The buffer layer includes a first opening defining a first top edge and a first bottom edge of the buffer layer. The first electrode includes a second opening defining a second top edge and a second bottom edge of the first electrode. The electronic modulating device includes an organic insulating layer disposed on the first electrode and within the first opening and the second opening. The thickness of the organic insulating layer at the second bottom edge is greater than the thickness of the organic insulating layer at the first top edge.

Abstract: An electronic device is provided. The electronic device includes a first electronic device unit and a second electronic device unit. The first electronic device unit includes a first substrate and a second substrate disposed opposite to the first substrate, and a portion of the first substrate protrudes outward a boundary of the second substrate in a first protruding direction perpendicular to a normal direction of the first substrate. The second electronic device unit is connected to the first electronic device unit and includes a third substrate and a fourth substrate disposed opposite to the third substrate, and a portion of the fourth substrate protrudes outward a boundary of the third substrate in a second protruding direction perpendicular to a normal direction of the third substrate. In addition, the portion of the first substrate and the portion of the fourth substrate each includes a grinded portion.

Abstract: An electronic device is provided. The electronic device includes a substrate, a feeding line and an electrode. The feeding line is disposed on the substrate for transmitting a signal. The electrode is disposed on the substrate for receiving the signal. In addition, an end portion of the feeding line is disposed opposite to an end portion of the electrode.

Abstract: An electronic device includes a substrate, plurality of electrodes disposed on the substrate, a plurality of metal elements disposed on the substrate, a plurality of first lines disposed on the substrate, and a radio frequency signal processor. One of the plurality of metal elements is overlapped one of the plurality of electrodes. The radio frequency signal processor provides a signal to the one of the plurality of electrodes through one of the plurality of first lines.

Abstract: An electronic device is provided. The electronic device includes a first substrate, a second substrate, a liquid crystal layer, a feeding structure, and a plurality of phase shifter electrodes. The liquid crystal layer is disposed between the first substrate and the second substrate. The feeding structure is disposed on the first substrate to transmit a radio frequency signal. The plurality of phase shifter electrodes are disposed on the first substrate and at least one of the plurality of phase shifter electrodes is for receiving the radio frequency signal. In addition, at least one of the plurality of phase shifter electrodes is electrically connected to a thin film transistor.

Abstract: An electronic device includes a substrate, a plurality of phase shift units, a feeding structure, and a radio frequency signal processor. The phase shift units are disposed on the first substrate. The feeding structure is disposed on the first substrate. The radio frequency signal processor is for altering a radio frequency signal transmitted through at least part of the feeding structure.

Abstract: An electronic device is provided. The electronic device includes a first electronic device unit and a second electronic device unit. The first electronic device unit includes a first substrate and a second substrate disposed opposite to the first substrate, and a portion of the first substrate protrudes outward a boundary of the second substrate in a first protruding direction perpendicular to a normal direction of the first substrate. The second electronic device unit is connected to the first electronic device unit and includes a third substrate and a fourth substrate disposed opposite to the third substrate, and a portion of the fourth substrate protrudes outward a boundary of the third substrate in a second protruding direction perpendicular to a normal direction of the third substrate. In addition, the portion of the first substrate and the portion of the fourth substrate each includes a grinded portion.

Abstract: An electronic device is provided. The electronic device includes a first substrate, a second substrate, a third substrate and a fourth substrate. The first substrate includes a first portion. The second substrate is disposed on the first substrate, and the first portion protrudes outward a boundary of the second substrate. The third substrate is disposed adjacent to the first substrate. The fourth substrate is disposed on the third substrate and includes a second portion protruding outward a boundary of the third substrate. The second portion overlaps the first portion. The first substrate includes a first side surface facing the third substrate. The fourth substrate includes a second side surface facing the second substrate. The first side surface and the second side surface are at least partially grinded.

Abstract: An electronic device having a communication region and a peripheral region surrounding the communication region is provided. The electronic device includes a first substrate and a second substrate. The electronic device also includes a liquid-crystal layer disposed between the first substrate and the second substrate, a sealant enclosing the liquid-crystal layer, and a protruding layer disposed on one of the first substrate and the second substrate. The protruding layer is located in the communication region and the peripheral region.

Abstract: An electronic device is provided. The electronic device includes a first substrate, a second substrate, a third substrate and a fourth substrate. The first substrate includes a first portion. The second substrate is disposed on the first substrate, and the first portion protrudes outward a boundary of the second substrate. The third substrate is disposed adjacent to the first substrate. The fourth substrate is disposed on the third substrate and includes a second portion protruding outward a boundary of the third substrate. The second portion overlaps the first portion. The first substrate includes a first side surface facing the third substrate. The fourth substrate includes a second side surface facing the second substrate. The first side surface and the second side surface are at least partially grinded.

Abstract: An electronic modulating device is provided, which includes a first substrate, a second substrate disposed opposing to the first substrate, and a modulating material disposed between the first substrate and the second substrate. The electronic modulating device includes a buffer layer disposed on the first substrate, and a first electrode disposed on the buffer layer. The buffer layer includes a first opening defining a first top edge and a first bottom edge of the buffer layer. The first electrode includes a second opening defining a second top edge and a second bottom edge of the first electrode. The electronic modulating device includes an organic insulating layer disposed on the first electrode and within the first opening and the second opening. The thickness of the organic insulating layer at the second bottom edge is greater than the thickness of the organic insulating layer at the first top edge.

Abstract: An electronic modulating device is provided, which includes a first substrate, a second substrate disposed opposing to the first substrate, and a modulating material disposed between the first substrate and the second substrate. The electronic modulating device includes a buffer layer disposed on the first substrate, and a first electrode disposed on the buffer layer. The buffer layer includes a first opening defining a first top edge and a first bottom edge of the buffer layer. The first electrode includes a second opening defining a second top edge and a second bottom edge of the first electrode. The electronic modulating device includes an organic insulating layer disposed on the first electrode and within the first opening and the second opening. The thickness of the organic insulating layer at the second bottom edge is greater than the thickness of the organic insulating layer at the first top edge.

Abstract: An electronic device includes a substrate, a plurality of phase shift units, a feeding structure, and a radio frequency signal processor. The phase shift units are disposed on the first substrate. The feeding structure is disposed on the first substrate. The radio frequency signal processor is for altering a radio frequency signal transmitted through at least part of the feeding structure.

Abstract: An electronic device is provided. The electronic device includes a first substrate, a second substrate, a liquid crystal layer, a feeding structure, and a plurality of phase shifter electrodes. The liquid crystal layer is disposed between the first substrate and the second substrate. The feeding structure is disposed on the first substrate to transmit a radio frequency signal. The plurality of phase shifter electrodes are disposed on the first substrate and at least one of the plurality of phase shifter electrodes is for receiving the radio frequency signal. In addition, at least one of the plurality of phase shifter electrodes is electrically connected to a thin film transistor.

Abstract: An electronic device having a communication region and a peripheral region surrounding the communication region is provided. The electronic device includes a first substrate and a second substrate. The electronic device also includes a liquid-crystal layer disposed between the first substrate and the second substrate, a sealant enclosing the liquid-crystal layer, and a protruding layer disposed on one of the first substrate and the second substrate. The protruding layer is located in the communication region and the peripheral region.

Abstract: An electronic modulating device is provided, which includes a first substrate, a second substrate disposed opposing to the first substrate, and a modulating material disposed between the first substrate and the second substrate. The electronic modulating device includes a buffer layer disposed on the first substrate, and a first electrode disposed on the buffer layer. The buffer layer includes a first opening defining a first top edge and a first bottom edge of the buffer layer. The first electrode includes a second opening defining a second top edge and a second bottom edge of the first electrode. The electronic modulating device includes an organic insulating layer disposed on the first electrode and within the first opening and the second opening. The thickness of the organic insulating layer at the second bottom edge is greater than the thickness of the organic insulating layer at the first top edge.

Abstract: Systems and methods for activating select devices are described herein. More particularly, this specification relates to using structure specific service IDs (SSSIDs) when two devices that are part of a common ecosystem are deciding whether to establish a connection according to a Bluetooth protocol. The SSSID can be a unique identifier that can be included in packets that are transmitted in accordance with the standards defining the Bluetooth Low Energy (BLE) protocol. The SSSIDs can be generated and provided to select devices such that only the select devices that are in possession of the SSSID are able to communicate with each other. This advantageously eliminates spurious activation of unintended recipient devices by enabling them to ignore the packet if the SSSID is not recognized, thereby enabling the unintended recipient device to remain in a low power sleepy state.