Abstract: An integrated circuit (IC) solder ball mounting apparatus comprises a ball storage unit for storing solder balls, a ball buffer unit configured to receive the solder balls from the ball storage unit in response to one or more pressure-actuated actions, and a gate valve configured to allow the solder balls to transfer to a ball mounting brush configured to place the solder balls onto area array contact structures formed on a wafer containing the integrated circuit.

Abstract: A knob includes a first assembly and a second assembly. The first assembly includes a first sensing element. The second assembly is sleeved at the first assembly and includes a second sensing element. The first sensing element is configured to, when the second assembly rotates around a rotation axis, be fixed relative to the rotation axis. The second sensing element is configured to, when the second assembly rotates around the rotation axis, move around the rotation axis.

Abstract: The present disclosure provides an image processing method, an electronic device, and a computer readable storage medium. The image processing method includes: acquiring first image data corresponding to a first image captured by a first camera lens, and acquiring second image data corresponding to a second image captured by a second camera lens; in a case where first chrominance data of the first image data is superior to second chrominance data of the second image data and first luminance data of the second image data is superior to second luminance data of the first image data, fusing the first image data and the second image data according to the first chrominance data and the first luminance data to obtain fused image data; and displaying the fused image data.

Abstract: Provided are an electromagnetic heating device, a noise suppression method, a heating control system, and a storage medium, which relate to the field of electromagnetic heating technologies. The noise suppression method includes: in response to determining that any two adjacent heating modules of the electromagnetic heating device operate successively, obtaining a start operating frequency of the last-started heating module of the two adjacent heating modules; and adjusting an operating frequency of the first-started heating module of the two adjacent heating modules based on the start operating frequency of the last-started heating module, to allow the two adjacent heating modules to operate synchronously at a same operating frequency when the last-started heating module starts operating.

Abstract: A vehicle-mounted key-generation method is for a vehicle including electronic control units (ECUs) that communicate with each other via a vehicle-mounted network. At least one ECU includes a key generation module and a key transmission module, and each of the other ECUs includes a key receiving module and a key invoking module. The method includes receiving, through at least one ECU, a secure access request sent from an authorized user through a secure access device, and, after confirming to accept the secure access request from the secure access device, waiting for the secure access device to send a key generation request. The method further includes, after receiving the key generation request, generating a key through the key generation module, using the key transmission module to send the key to other ECUs via the vehicle-mounted network, and receiving the key through the key receiving module in other ECUs.

Abstract: A hot-pressing device and process for an ACF bonding structure are provided. The hot-pressing device includes a transfer module and a first mounting plate connected to the transfer module. A negative-pressure adsorption module, at least one positioning module, and a lifting module are arranged on the first mounting plate. Pressing modules with hot-pressing assemblies are arranged at four corners close to the first mounting plate. Cleaning modules corresponding to the pressing modules are arranged in the transfer module below the first mounting plate. The present disclosure can quickly remove glue overflowing on a heat conduction element in the hot-pressing module by the cleaning module to ensure the surface flatness of a second part of the heat conduction element for hot-pressing and satisfactory resistance of an ACF connected to a substrate after hot-pressing.

Abstract: A preparation device and a process for an anisotropic conductive film (ACF) bonding structure are provided. The preparation device includes a negative-pressure adsorption device, a positioning assembly, and a hot-pressing module, where the negative-pressure adsorption device is configured to adsorb a first metal plate; the positioning assembly includes a first positioning module, at least two second positioning modules, and at least one third positioning module; and the hot-pressing module is configured to release a hot-pressing pressure, such that the second metal plate is connected to the first metal plate through an ACF to form a bonding structure. The present disclosure ensures reference positioning of the negative-pressure adsorption device on a mounting plate through the second positioning modules. The present disclosure further ensures that a side of the first metal plate is fully adhered to a side surface of an adsorption plate through the first positioning module.

Abstract: A carrying structure including a carrying main body, two engaging components, two driven linkages, and a driving linkage is provided. The carrying main body is adapted to carry an expansion card. The two engaging components are disposed on opposite ends of the carrying main body, each of the engaging components is adapted to be actuated to an engaging state for being engaged to a server main body, and each of the engaging components is adapted to be actuated to a releasing state for being separated from the server main body. The two driven linkages are respectively connected to the two engaging components. The driving linkage is connected between the two driven linkages and adapted to drive the two engaging components to be simultaneously actuated between the engaging state and the releasing state by the two driven linkages. In addition, a server having the carrying structure is also provided.

Abstract: A preparation device and a process for an anisotropic conductive film (ACF) bonding structure are provided. The preparation device includes a negative-pressure adsorption device, a positioning assembly, and a hot-pressing module, where the negative-pressure adsorption device is configured to adsorb a first metal plate; the positioning assembly includes a first positioning module, at least two second positioning modules, and at least one third positioning module; and the hot-pressing module is configured to release a hot-pressing pressure, such that the second metal plate is connected to the first metal plate through an ACF to form a bonding structure. The present disclosure ensures reference positioning of the negative-pressure adsorption device on a mounting plate through the second positioning modules. The present disclosure further ensures that a side of the first metal plate is fully adhered to a side surface of an adsorption plate through the first positioning module.

Abstract: A hot-pressing device and process for an ACF bonding structure are provided. The hot-pressing device includes a transfer module and a first mounting plate connected to the transfer module. A negative-pressure adsorption module, at least one positioning module, and a lifting module are arranged on the first mounting plate. Pressing modules with hot-pressing assemblies are arranged at four corners close to the first mounting plate. Cleaning modules corresponding to the pressing modules are arranged in the transfer module below the first mounting plate. The present disclosure can quickly remove glue overflowing on a heat conduction element in the hot-pressing module by the cleaning module to ensure the surface flatness of a second part of the heat conduction element for hot-pressing and satisfactory resistance of an ACF connected to a substrate after hot-pressing.

Abstract: A chassis includes a cage. The cage includes a body, a clamping member, and a buckling member. The body includes a first sliding portion, a fastening portion, and an accommodating area. The accommodating area includes a guide rail portion. The guide rail portion and the first sliding portion are disposed on two sides of the accommodating area, respectively. The fastening portion is disposed on one side of the accommodating area away from the guide rail portion. The clamping member is slidably disposed on the first sliding portion. The buckling member is disposed on the clamping member. The buckling member is adapted to be in contact with the fastening portion.

Abstract: An anisotropic conductive film (ACF) structure and a hot-pressing method and a hot-pressing assembly thereof are provided. The ACF structure includes an ACF and a copper/gold foil surface layer as a substrate. The ACF structure is hot-pressed by a hot-pressing method, which includes the following steps: allowing, when the ACF is in a molten state, the copper/gold foil surface layer and a bonded part to be conductive respectively to generate a magnetic field around to enhance the attraction of the copper/gold foil surface layer and the bonded part to conductive particles inside the ACF; and applying, when the ACF is in a curing stage, a closed circuit to ends of the copper/gold foil surface layer and the bonded part to perform real-time detection on the ACF to ensure the effectiveness of the hot pressing.

Abstract: Provided are a panoramic photographing method and device, a camera and a mobile terminal, the method includes: when panoramic photographing is performed, firstly, a ranging device acquires the depth information of the object to be photographed, that is, the distance between the object to be photographed and the photographing device, and then the offset corresponding to the current distance is acquired according to a preset mapping relationship, and the original imaging of the object to be photographed is subsequently shifted in the panoramic image to form a corrected panoramic image.

Abstract: A preparing method for high-purity levetiracetam, comprising: adjusting the pH of an extracted aqueous layer obtained by dissociating (S)-?-ethyl-2-oxo-1-pyrrolidineacetic acid (R)-methylbenzylamine salt to 5-9; removing water; adding an organic solvent to form a solution and then performing an esterification reaction with ethyl chloroformate or methylchlorofonmate; and carrying out an ammonolysis reaction to obtain the levetiracetam. The method simplifies production process, increases yield, reduces or even avoids the use of triethylamine in the esterification process, and reduces the emission of a great amount of three wastes.

Abstract: A knob includes a first assembly and a second assembly. The first assembly includes a first sensing element. The second assembly is sleeved at the first assembly and includes a second sensing element. The first sensing element is configured to, when the second assembly rotates around a rotation axis, be fixed relative to the rotation axis. The second sensing element is configured to, when the second assembly rotates around the rotation axis, move around the rotation axis.

Abstract: A recombinant deamidated gliadin polypeptide antigen, a recombinant antigen-expressing gene, a recombinant expression vector, a preparation method therefor, and an application thereof. The recombinant deamidated gliadin polypeptide antigen comprises a DGP-1 peptide, an interleukin 15 protein, and a DGP-2 peptide. The amino acid sequence of the DGP-1 peptide is as shown in SEQ ID NO. 1, and the amino acid sequence of the DGP-2 peptide is as shown in SEQ ID NO 2. The recombinant deamidated gliadin polypeptide antigen has good sensitivity, high specificity, and low preparation costs in the detection of celiac disease, allows determination of IgG-DGP antibodies in serum, and especially enables diagnosis for potential patients with celiac disease among patients with IgA deficiency and infant population.

Abstract: An anisotropic conductive film (ACF) structure and a hot-pressing method and a hot-pressing assembly thereof are provided. The ACF structure includes an ACF and a copper/gold foil surface layer as a substrate. The ACF structure is hot-pressed by a hot-pressing method, which includes the following steps: allowing, when the ACF is in a molten state, the copper/gold foil surface layer and a bonded part to be conductive respectively to generate a magnetic field around to enhance the attraction of the copper/gold foil surface layer and the bonded part to conductive particles inside the ACF; and applying, when the ACF is in a curing stage, a closed circuit to ends of the copper/gold foil surface layer and the bonded part to perform real-time detection on the ACF to ensure the effectiveness of the hot pressing.

Abstract: A chassis includes a cage. The cage includes a body, a clamping member, and a buckling member. The body includes a first sliding portion, a fastening portion, and an accommodating area. The accommodating area includes a guide rail portion. The guide rail portion and the first sliding portion are disposed on two sides of the accommodating area, respectively. The fastening portion is disposed on one side of the accommodating area away from the guide rail portion. The clamping member is slidably disposed on the first sliding portion. The buckling member is disposed on the clamping member. The buckling member is adapted to be in contact with the fastening portion.

Abstract: Provided are a panoramic photographing method and device, a camera and a mobile terminal, the method includes: when panoramic photographing is performed, firstly, a ranging device acquires the depth information of the object to be photographed, that is the distance between the object to be photographed and the photographing device, and then the offset corresponding to the current distance is acquired according to a preset mapping relationship, and the original imaging of the object to be photographed is subsequently shifted in the panoramic image to form a corrected panoramic image.

Abstract: A carrying structure including a carrying main body, two engaging components, two driven linkages, and a driving linkage is provided. The carrying main body is adapted to carry an expansion card. The two engaging components are disposed on opposite ends of the carrying main body, each of the engaging components is adapted to be actuated to an engaging state for being engaged to a server main body, and each of the engaging components is adapted to be actuated to a releasing state for being separated from the server main body. The two driven linkages are respectively connected to the two engaging components. The driving linkage is connected between the two driven linkages and adapted to drive the two engaging components to be simultaneously actuated between the engaging state and the releasing state by the two driven linkages. In addition, a server having the carrying structure is also provided.