Patents by Inventor Liangpeng HAO

Liangpeng HAO has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11945924
    Abstract: The present invention relates to a fluorine-containing resin composition, and a resin vanish, a fluorine-containing dielectric sheet, a laminate, a copper clad laminate and a printed circuit board containing the same. The fluorine-containing resin composition comprises 30 wt. %-70 wt. % of a fluorine-containing polymer, 30 wt. %-70 wt. % of an inorganic filler which includes the following particle size distribution: D10 is greater than 1.5 ?m; and D50 is 10-15 ?m. In the present invention, the selection of an inorganic filler with a specific particle size distribution can ensure that the boards prepared by the fluorine-containing resin composition have excellent dielectric properties and voltage resistance performance, even if the inorganic filler is added in a large amount.
    Type: Grant
    Filed: December 17, 2020
    Date of Patent: April 2, 2024
    Assignee: SHENGYI TECHNOLOGY CO., LTD.
    Inventors: Songgang Chai, Qianfa Liu, Liangpeng Hao, Wei Liang
  • Publication number: 20230202126
    Abstract: Provided are a low dielectric loss non-woven fabric, a preparation method thereof and use thereof. The low dielectric loss non-woven fabric is composed of an inorganic fiber and a binder, and the binder is any one or a combination of at least two of a fluorine-containing resin emulsion, a polyolefin emulsion, a polyphenylene ether resin or a cyanate ester resin. The non-woven fabric of the present application has good dielectric properties and obvious strengthening effect, and can meet various performance requirements for copper clad laminate materials in the field of high-frequency communication.
    Type: Application
    Filed: November 3, 2022
    Publication date: June 29, 2023
    Inventors: Wei LIANG, Songgang CHAI, Qianfa LIU, Liangpeng HAO
  • Publication number: 20230192972
    Abstract: The present invention relates to a fluorine-containing resin composition, and a resin vanish, a fluorine-containing dielectric sheet, a laminate, a copper clad laminate and a printed circuit board containing the same. The fluorine-containing resin composition comprises 30 wt. %-70 wt. % of a fluorine-containing polymer, 30 wt. %-70 wt. % of an inorganic filler which includes the following particle size distribution: D10 is greater than 1.5 ?m; and D50 is 10-15 ?m. In the present invention, the selection of an inorganic filler with a specific particle size distribution can ensure that the boards prepared by the fluorine-containing resin composition have excellent dielectric properties and voltage resistance performance, even if the inorganic filler is added in a large amount.
    Type: Application
    Filed: December 17, 2020
    Publication date: June 22, 2023
    Inventors: Songgang CHAI, Qianfa LIU, Liangpeng HAO, Wei LIANG
  • Patent number: 10208188
    Abstract: A thermosetting resin composition comprising a thermosetting resin, an inorganic filler, and an organomolybdenum compound is disclosed. The thermosetting resin composition may be used for preparing a resin vanish and a prepreg, wherein the prepreg is used for laminates and printed circuit boards.
    Type: Grant
    Filed: October 11, 2013
    Date of Patent: February 19, 2019
    Assignee: SHENGYI TECHNOLOGY CO., LTD.
    Inventors: Cuiming Du, Liangpeng Hao, Songgang Chai
  • Publication number: 20160229990
    Abstract: A thermosetting resin composition comprising a thermosetting resin, an inorganic filler, and an organomolybdenum compound is disclosed. The thermosetting resin composition may be used for preparing a resin vanish and a prepreg, wherein the prepreg is used for laminates and printed circuit boards.
    Type: Application
    Filed: October 11, 2013
    Publication date: August 11, 2016
    Inventors: Cuiming DU, Liangpeng HAO, Songgang CHAI