Patents by Inventor Liangwei FU

Liangwei FU has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • High performance thermoelectric device and method of manufacturing the same at ultra-high speed
    Patent number: 11101420
    Abstract: Disclosed are a high performance thermoelectric device and a method of manufacturing the same at ultra-high speed. The high performance thermoelectric device includes segmented structures which may provide an optimal match between the thermoelectric materials and the environmental temperature difference; blocking layers and stress-buffering layers which can reduce interface element migration and longitudinal contact thermal expansion stress and increase bonding strength; phonon scattering layers and negative thermal expansion buffering layers inserted and fixing the thermoelectric leg, thereby increasing internal thermal resistance and improving transverse thermo-match for the high performance thermoelectric device; an inner package and an outer package, thus avoiding sublimation and oxidation of the thermoelectric materials and providing the thermoelectric device with enhanced impact resistance from outside.
    Type: Grant
    Filed: October 18, 2019
    Date of Patent: August 24, 2021
    Assignee: SOUTH UNIVERSITY OF SCIENCE AND TECHNOLOGY OF CHINA
    Inventors: Jiaqing He, Yi Zhou, Liangwei Fu, Yuexing Chen, Dan Feng
  • HIGH PERFORMANCE THERMOELECTRIC DEVICE AND METHOD OF MANUFACTURING THE SAME AT ULTRA-HIGH SPEED
    Publication number: 20200152849
    Abstract: Disclosed are a high performance thermoelectric device and a method of manufacturing the same at ultra-high speed. The high performance thermoelectric device includes segmented structures which may provide an optimal match between the thermoelectric materials and the environmental temperature difference; blocking layers and stress-buffering layers which can reduce interface element migration and longitudinal contact thermal expansion stress and increase bonding strength; phonon scattering layers and negative thermal expansion buffering layers inserted and fixing the thermoelectric leg, thereby increasing internal thermal resistance and improving transverse thermo-match for the high performance thermoelectric device; an inner package and an outer package, thus avoiding sublimation and oxidation of the thermoelectric materials and providing the thermoelectric device with enhanced impact resistance from outside.
    Type: Application
    Filed: October 18, 2019
    Publication date: May 14, 2020
    Inventors: Jiaqing HE, Yi ZHOU, Liangwei FU, Yuexing CHEN, Dan FENG