Abstract: The present invention relates to a method for realizing the measuring slip of membrane probe, wherein: an elastomer layer is placed between the rigid acting surface of the membrane probe head and the membrane on which the probe is arranged; on the axial plane of the probe, the elastomer layer takes any axial line passing through the probe as a boundary line, and there is a difference between the thickness of one side and thickness of the other side, so that the probe can deflect during the test, resulting in the measuring slip to penetrate or push away the surface oxide of the tested chip and achieve more stable contact.

Abstract: A membrane probe card and its probe head, and the membrane probe card comprises a membrane probe head, and the membrane probe head consists of a support, membrane, a probe and an interconnecting wire; a concave supporting structure is arranged between the acting surface of the support and the membrane; the concave supporting structure comprises a concave structure and a supporting elastic layer, and the concave structure comprises one or more concaves, the concave corresponds to the position of the probe and the concaves are eccentric with the corresponding probes; the convex insert of the supporting elastic layer is embedded in the corresponding concave to generate a thickness difference between the two sides of each probe on the supporting elastic layer.

Abstract: The MEMS probe card of the invention belongs to the technical field of IC manufacturing industry, and specifically relates to the manufacturing of micro-electromechanical systems, testing of semiconductor bare chip and related key technologies; From top to bottom, the probe card comprises a stiffener, a PCB board, an adapter layer, a guide plate and a MEMS probe; the invention not only discloses a MEMS probe card, but also discloses a new manufacturing process of a MEMS probe card, including the structure of MEMS probe card, the etching equipment and method of guide plate-MEMS probe structure template, the probe positioning method of etching the guide plate-MEMS probe structure template, the manufacturing method of the guide plate-MEMS probe structure and the docking device and method of the guide plate-MEMS probe structure and the adapter layer to finally realize the manufacturing of a submicron-sized MEMS probe card.

Abstract: A probe card has a probe, probe and circuit boards, and amplitude-modulating structure. The probe is fixed on the probe board, one end is connected to the circuit board, and the other end is clamped on the amplitude-modulating structure. The probe is equipped with a bent wire to make longitudinal elastic deformation for the probe, and the probe head is equipped with an amplitude-modulating board. The amplitude-modulating board is driven by an eccentric roller, which can achieve upward and downward movement of the amplitude-modulating board, thereby driving the probe to deform, causing the probe head of the probe to move from the detection position to the ready position, or from the ready position to the detection position, so that the number of probes in the detection position can be adjusted to enable to adjust the detection amplitude of a single probe card, making the probe card universal.

Abstract: A probe card for testing power devices under high temperature and high voltage. The probe card includes air inlet system, PCB board, switching layer, guide plate and probe from top to bottom; the bottom of air inlet system includes plurality of lower air outlets and side air outlets, the PCB board includes a first through-hole with same position, shape and quantity as the lower air outlet, the switching layer includes a second through-hole with same position, shape and quantity as the lower air outlet, the guide plate includes a third through-hole with same position, shape and quantity as the lower air outlet. The lower air outlet, the first through-hole, the second through-hole and the third through-hole are coaxially arranged. The high-temperature and high-pressure gas ejected from the lower air outlet is blown between the guide plate and the tested wafer after successively passing through the first, second, and third through-holes.

Abstract: A probe card has a probe, probe and circuit boards, and amplitude-modulating structure. The probe is fixed on the probe board, one end is connected to the circuit board, and the other end is clamped on the amplitude-modulating structure. The probe is equipped with a bent wire to make longitudinal elastic deformation for the probe, and the probe head is equipped with an amplitude-modulating board. The amplitude-modulating board is driven by an eccentric roller, which can achieve upward and downward movement of the amplitude-modulating board, thereby driving the probe to deform, causing the probe head of the probe to move from the detection position to the ready position, or from the ready position to the detection position, so that the number of probes in the detection position can be adjusted to enable to adjust the detection amplitude of a single probe card, making the probe card universal.

Abstract: The MEMS probe card of the invention belongs to the technical field of IC manufacturing industry, and specifically relates to the manufacturing of micro-electromechanical systems, testing of semiconductor bare chip and related key technologies; From top to bottom, the probe card comprises a stiffener, a PCB board, an adapter layer, a guide plate and a MEMS probe; the invention not only discloses a MEMS probe card, but also discloses a new manufacturing process of a MEMS probe card, including the structure of MEMS probe card, the etching equipment and method of guide plate-MEMS probe structure template, the probe positioning method of etching the guide plate-MEMS probe structure template, the manufacturing method of the guide plate-MEMS probe structure and the docking device and method of the guide plate-MEMS probe structure and the adapter layer to finally realize the manufacturing of a submicron-sized MEMS probe card.

Abstract: A probe card for testing power devices under high temperature and high voltage. The probe card includes air inlet system, PCB board, switching layer, guide plate and probe from top to bottom; the bottom of air inlet system includes plurality of lower air outlets and side air outlets, the PCB board includes a first through-hole with same position, shape and quantity as the lower air outlet, the switching layer includes a second through-hole with same position, shape and quantity as the lower air outlet, the guide plate includes a third through-hole with same position, shape and quantity as the lower air outlet. The lower air outlet, the first through-hole, the second through-hole and the third through-hole are coaxially arranged. The high-temperature and high-pressure gas ejected from the lower air outlet is blown between the guide plate and the tested wafer after successively passing through the first, second, and third through-holes.

Abstract: A membrane probe card and its probe head, and the membrane probe card comprises a membrane probe head, and the membrane probe head consists of a support, membrane, a probe and an interconnecting wire; a concave supporting structure is arranged between the acting surface of the support and the membrane; the concave supporting structure comprises a concave structure and a supporting elastic layer, and the concave structure comprises one or more concaves, the concave corresponds to the position of the probe and the concaves are eccentric with the corresponding probes; the convex insert of the supporting elastic layer is embedded in the corresponding concave to generate a thickness difference between the two sides of each probe on the supporting elastic layer.

Abstract: The present invention relates to a method for realizing the measuring slip of membrane probe, wherein: an elastomer layer is placed between the rigid acting surface of the membrane probe head and the membrane on which the probe is arranged; on the axial plane of the probe, the elastomer layer takes any axial line passing through the probe as a boundary line, and there is a difference between the thickness of one side and thickness of the other side, so that the probe can deflect during the test, resulting in the measuring slip to penetrate or push away the surface oxide of the tested chip and achieve more stable contact.