Abstract: The present disclosure relates to an optical glass, an optical element, and an optical device. The optical glass includes the following components in molar percentage: 25% to 40% of SiO2, 1% to 8% of B2O3, 1% to 8% of La2O3, 1% to 6% of BaO, 5% to 25% of CaO, 5% to 15% of Nb2O5, 8% to 20% of TiO2, and 1.5% to 15% of Li2O.

Abstract: A glass composition, wherein components thereof are represented by weight percentage, including: 50-70% of SiO2; 3-20% of B2O3; 11-25% of Al2O3; 1-15% of CaO; 0-10% of MgO. Through rational component design, the glass composition features excellent chemical stability, high UV light transmittance and transition temperature, so as to meet the requirements for carrier and packaging in semiconductor manufacturing process and to be applicable for semiconductor manufacturing field.

Abstract: The present invention provides a glass material that has a suitable thermal expansion coefficient to meet the application in the field of semiconductor manufacturing. A glass material, wherein components thereof are represented by weight percentage, comprising: 43-63% of SiO2; 0-15% of B2O3; 2-15% of Al2O3; 11-30% of BaO; 3-18% of CaO. Through rational component design, the glass material of the present invention has a suitable thermal expansion coefficient and is applicable to the field of semiconductor manufacturing.

Abstract: An environment-friendly glass material, including components like SiO2, ZnO, alkali metal oxide and S, but does not contain Cd, wherein when the thickness of the environment-friendly glass material is 3 mm, the cutoff wavelength is above 550 nm, the transmittance at 800-850 nm is above 75%, the transmittance at 850-900 nm is above 80%, the transmittance at 900-1000 nm is above 83%, and the transmittance at 1000-2000 nm is above 85%. Through rational component design, the glass material of the present invention realizes environmental protection, UV and visible light cutoff, and high near-infrared transmittance at the same time.

Abstract: A glass material, includes the following components by weight percentage: 50-70% of SiO2; 3-15% of B2O3; 0.5-10% of TiO2; 1-12% of ZnO; 0.5-10% of Al2O3; 5-22% of Na2O+K2O, wherein B2O3/SiO2 is 0.06-0.26, and (TiO2+ZnO)/Al2O3 is 0.5-8.0. Through rational component design, the glass material features high light transmittance and excellent chemical stability, so as to be able to be applied in the field of photosensitive device packaging.

Abstract: A glass composition with high Young's modulus and specific modulus, wherein the glass composition includes the following components by weight percentage: 30-46% of SiO2, 0-6% of B2O3, 10-30% of Al2O3, 4-20% of CaO, 2-15% of MgO, and 13-32% of Y2O3. The glass composition uses common chemical raw materials. By reasonably arranging the contents of each component, the glass is good in heat resistance, chemical stability and press-molding devitrification resistance performance, low in high-temperature viscosity, convenient in bubble elimination, with specific modulus above 34 and Young's modulus above 100 GPa, and is suitable for hard disk substrate manufacturing, semiconductor sealing and other fields.

Abstract: A glass with high thermal expansion coefficient and excellent thermal shock resistance, wherein the glass includes the following components by mole percentage: 55-80% of SiO2; 0-10% of B2O3; 0-10% of Al2O3; 2-20% of ZnO; 0-15% of MgO; and no more than 30% of Li2O+Na2O+K2O. Through the reasonable proportioning of components, the glass has high thermal expansion coefficient and excellent thermal shock resistance at the same time. The glass is suitable for chemical strengthening, and the glass product obtained after chemical strengthening has large surface stress and large depth of stress layer.

Abstract: A glass composition with high Young's modulus and specific modulus, wherein the glass composition includes the following components by weight percentage: 30-46% of SiO2, 0-6% of B2O3, 10-30% of Al2O3, 4-20% of CaO, 2-15% of MgO, and 13-32% of Y2O3. The glass composition uses common chemical raw materials. By reasonably arranging the contents of each component, the glass is good in heat resistance, chemical stability and press-molding devitrification resistance performance, low in high-temperature viscosity, convenient in bubble elimination, with specific modulus above 34 and Young's modulus above 100 GPa, and is suitable for hard disk substrate manufacturing, semiconductor sealing and other fields.