Abstract: A method for cleaning semiconductor substrate without damaging patterned structure on the semiconductor substrate using ultra/mega sonic device comprises applying liquid into a space between a substrate and an ultra/mega sonic device; setting an ultra/mega sonic power supply at frequency f1 and power P1 to drive the ultra/mega sonic device; before bubble cavitation in the liquid damaging patterned structure on the substrate, setting the ultra/mega sonic power supply at zero output; after temperature inside bubble cooling down to a set temperature, setting the ultra/mega sonic power supply at frequency f1 and power P1 again; detecting power on time at power P1 and frequency f1 and power off time separately or detecting amplitude of each waveform output by the ultra/mega sonic power supply; comparing the detected power on time with a preset time ?1, or comparing the detected power off time with a preset time ?2, or comparing detected amplitude of each waveform with a preset value, if the detected power on time

Abstract: A system for controlling damages in cleaning a semiconductor wafer comprising features of patterned structures, the system comprising: a wafer holder for temporary restraining a semiconductor wafer during a cleaning process; an inlet for delivering a cleaning liquid over a surface of the semiconductor wafer; a sonic generator configured to alternately operate at a first frequency and a first power level for a first predetermined period of time and at a second frequency and a second power level for a second predetermined period of time, to impart sonic energy to the cleaning liquid, the first predetermined period of time and the second predetermined period of time consecutively following one another; and a controller programmed to provide the cleaning parameters, wherein at least one of the cleaning parameters is determined such that a percentage of damaged features as a result of the imparting sonic energy is lower than a predetermined threshold.

Abstract: Disclosed is a method for improving the immunogenicity of a protein/peptide antigen, the method comprising conjugating a protein/peptide antigen with a sugar to form a sugar-protein/peptide antigen conjugate, which has improved immunogenicity compared to an unconjugated protein/peptide antigen. In particular, the method involves conjugating a pathogen, such as a viral surface protein antigen or a fragment thereof, with a polysaccharide, in particular a capsular polysaccharide of Streptococcus pneumonia. The conjugate with improved immunogenicity can be used to prevent or treat diseases caused by pathogens, in particular diseases caused by coronaviruses.

Abstract: A method for controlling damages in cleaning a semiconductor wafer comprising features of patterned structures, the method comprising: delivering a cleaning liquid over a surface of a semiconductor wafer during a cleaning process; and imparting sonic energy to the cleaning liquid from a sonic transducer during the cleaning process, wherein power is alternately supplied to the sonic transducer at a first frequency and a first power level for a first predetermined period of time and at a second frequency and a second power level for a second predetermined period of time, the first predetermined period of time and the second predetermined period of time consecutively following one another, wherein at least one of the cleaning parameters is determined such that a percentage of damaged features as a result of the imparting sonic energy is lower than a predetermined threshold.

Abstract: A system for controlling damages in cleaning a semiconductor wafer comprising features of patterned structures, the system comprising: a wafer holder for temporary restraining a semiconductor wafer during a cleaning process; an inlet for delivering a cleaning liquid over a surface of the semiconductor wafer; a sonic generator configured to alternately operate at a first frequency and a first power level for a first predetermined period of time and at a second frequency and a second power level for a second predetermined period of time, to impart sonic energy to the cleaning liquid, the first predetermined period of time and the second predetermined period of time consecutively following one another; and a controller programmed to provide the cleaning parameters, wherein at least one of the cleaning parameters is determined such that a percentage of damaged features as a result of the imparting sonic energy is lower than a predetermined threshold.

Abstract: Provided are multiple types of TGF?R2 in truncated forms and a fusion protein constructed by TGF?R2 and EGFR antibody HPA8; also provided are a nucleic acid (comprising heavy/light chain variable regions) encoding the antibody, a vector, a pharmaceutical composition, and a kit comprising the nucleic acid; further provided is a fusion protein of the prepared truncated TGF?R2 receptor protein and a targeted EGFR and other multiple types of tumor target antibodies.

Abstract: A system for controlling damages in cleaning a semiconductor wafer comprising features of patterned structures, the system comprising: a wafer holder for temporary restraining a semiconductor wafer during a cleaning process; an inlet for delivering a cleaning liquid over a surface of the semiconductor wafer; a sonic generator configured to alternately operate at a first frequency and a first power level for a first predetermined period of time and at a second frequency and a second power level for a second predetermined period of time, to impart sonic energy to the cleaning liquid, the first predetermined period of time and the second predetermined period of time consecutively following one another; and a controller programmed to provide the cleaning parameters, wherein at least one of the cleaning parameters is determined such that a percentage of damaged features as a result of the imparting sonic energy is lower than a predetermined threshold.

Abstract: A method for cleaning semiconductor substrate without damaging patterned structure on the substrate using ultra/mega sonic device comprising applying liquid into a space between a substrate and an ultra/mega sonic device; setting an ultra/mega sonic power supply at frequency f1 and power P1 to drive said ultra/mega sonic device; before bubble cavitation in said liquid damaging patterned structure on the substrate, setting said ultra/mega sonic power supply at frequency f2 and power P2 to drive said ultra/mega sonic device; after temperature inside bubble cooling down to a set temperature, setting said ultra/mega sonic power supply at frequency f1 and power P1 again; repeating above steps till the substrate being cleaned. Normally, if f1=f2, then P2 is equal to zero or much less than P1; if P1=P2, then f2 is higher than f1; if the f1<f2, then, P2 can be either equal or less than P1.

Abstract: The present invention relates to a multivalent HPV immunogenic composition for preventing human papillomavirus (HPV) related diseases or infections and uses thereof. Said multivalent HPV immunogenic composition comprises: HPV virus-like particles assembled from L1 proteins of HPV Types 6, 11, 16, 18, 31, 33, 45, 52, and 58; and one or more HPV virus-like particles assembled from L1 proteins of other pathogenic HPV types. In one embodiment, said one or more other pathogenic HPV types are selected from HPV Types 35, 39, 51, 56 and 59. In one embodiment, at least one of said HPV virus-like particles is a chimeric HPV virus-like particle, and said chimeric HPV virus-like particle comprises one or more chimeric HPV L1 proteins.

Abstract: A method and apparatus for cleaning semiconductor wafer, combining batch cleaning and single wafer cleaning together. The method includes: taking at least two wafers from a cassette in a load port and putting said wafers into a first tank filled with chemical solution; after processing said wafers in the first tank, taking said wafers out of the first tank and keeping said wafers wet; putting said wafers into a second tank filled with liquid; after processing said wafers in the second tank, taking said wafers out of the second tank and keeping said wafers wet; putting one of said wafers on a chuck inside a single wafer cleaning module; rotating the chuck while applying chemical solution on said wafer; applying deionized water on said wafer; drying said wafer; taking said wafer out of the single wafer cleaning module and putting said wafer back to the cassette in the load port.

Abstract: The present invention relates to chimeric papilloma virus L1 proteins and polynucleotides encoding thereof, and also to HPV virus-like particles and the preparation methods thereof. Said chimeric papilloma virus L1 protein comprises an N-terminal fragment derived from L1 protein of the first papilloma virus type, said N-terminal fragment maintains the immunogenicity of the L1 protein of the corresponding type of HPV; and a C-terminal fragment derived from L1 protein of the second papilloma virus type, said L1 protein of the second papilloma virus type has a better expression level and a better solubility compared to the L1 proteins of other HPV types; wherein said chimeric papilloma virus L1 proteins have the immunogenicity of the L1 proteins of the corresponding HPV types. Said chimeric papilloma virus L proteins have better expression amount and solubility for mass production of vaccines.

Abstract: The present disclosure relates to a multiple-variable dosage regimen for the treatment of cancers with high expression of EGFR. Particularly, the present disclosure relates to a multiple-variable dosage regimen for treating cancers with high EGFR expression in a subject in need, comprising: administering a first dose of anti-EGFR antibody or antigen-binding fragment thereof to said subject in a first treatment cycle; and subsequently administering a second dose of anti-EGFR antibody or antigen-binding fragment thereof to said subject during the second treatment cycle. The regimen described in the present disclosure realizes favorable effects to cancer treatment.

Abstract: The present invention belongs to the field of immunotherapy of autoimmune diseases and relates to a humanized monoclonal antibody that binds IL17A. The present invention discloses a nucleic acid sequence encoding said antibody (including heavy/light chain variable regions), a vector containing said nucleic acid sequences, a pharmaceutical composition and a kit. Said monoclonal antibody is capable of specifically binding IL17A protein with high affinity, has a strong ability to block the binding of IL17A, IL17A/F with receptor IL17RA.

Abstract: The present invention belongs to the field of tumor immunotherapy, and relates to a humanized monoclonal antibody that binds to VEGF. The present invention discloses nucleic acid sequences (including heavy/light chain variable regions) encoding said antibodies, and vectors, pharmaceutical compositions and kits containing said nucleic acid sequences. The antibody disclosed in the present invention can specifically bind to VEGF with high affinity and block the binding of VEGF to the receptor VEGFR2. Said antibodies also neutralize the proliferative effect of VEGF165 protein and multiple VEGF subtypes on HUVEC cells and can be used in clinical treatment of tumors, including but not limited to: colorectal cancer.

Abstract: The present invention belongs to the field of tumor immunotherapy, and relates to a humanized anti-VEGF antibody Fab fragment. The present invention discloses nucleic acid sequences (including heavy/light chain variable regions) encoding said antibody fragment, and vectors, pharmaceutical compositions and kits containing said nucleic acid sequences. The anti-VEGF antibody Fab fragments disclosed in the present invention can specifically bind to VEGF with high affinity and block the binding of VEGF to the receptor VEGFR2, and also neutralize the proliferative effect of VEGF on HUVEC cells. Compared to the full-length antibody, antibodies in the form of Fab fragments have stronger penetrability and less toxic in terms of gastrointestinal perforation, hypertension and hemorrhage and do not stimulate the complement cascade reaction, thus reducing the risk of endophthalmitis and autoimmune inflammatory reactions.

Abstract: A method for cleaning semiconductor substrate without damaging patterned structure on the semiconductor substrate using ultra/mega sonic device comprises applying liquid into a space between a substrate and an ultra/mega sonic device; setting an ultra/mega sonic power supply at frequency f1 and power P1 to drive the ultra/mega sonic device; before bubble cavitation in the liquid damaging patterned structure on the substrate, setting the ultra/mega sonic power supply at zero output; after temperature inside bubble cooling down to a set temperature, setting the ultra/mega sonic power supply at frequency f1 and power P1 again; detecting power on time at power P1 and frequency f1 and power off time separately or detecting amplitude of each waveform output by the ultra/mega sonic power supply; comparing the detected power on time with a preset time ?1, or comparing the detected power off time with a preset time ?2, or comparing detected amplitude of each waveform with a preset value, if the detected power on time

Abstract: A method for cleaning a semiconductor substrate without damaging its patterned structure via an ultra/mega sonic device comprises applying liquid into a space between the substrate and the sonic device; setting an ultra/mega sonic device power supply at a frequency f1 and power P1; and at zero output before bubble cavitation occurs; followed by at f1 and P1 again after bubble temperature is lowered; detecting power on time (at P1, f1), power off time or amplitude of each waveform output by the power supply; comparing the detected power on time with a preset time T1, power off time with a preset time ?2, amplitude of each waveform with a preset value, if the detected power on time is longer than ?1, or power off time is shorter than ?2, or amplitude of any waveform is larger than the preset value, shut down the power supply and send out an alarm.

Abstract: The present disclosure provides a recombinant humanized monoclonal antibody against programmed cell death receptor-1 (PD-1) or an antigen-binding fragment thereof, which can be used in tumor or cancer immunotherapy. The disclosure also provides nucleic acid sequences encoding said antibody or antigen-binding fragment thereof, vectors containing said nucleic acid sequences, pharmaceutical compositions and kits.

Abstract: A system for controlling damages in cleaning a semiconductor wafer comprising features of patterned structures, the system comprising: a wafer holder for temporary restraining a semiconductor wafer during a cleaning process; an inlet for delivering a cleaning liquid over a surface of the semiconductor wafer; a sonic generator configured to alternately operate at a first frequency and a first power level for a first predetermined period of time and at a second frequency and a second power level for a second predetermined period of time, to impart sonic energy to the cleaning liquid, the first predetermined period of time and the second predetermined period of time consecutively following one another; and a controller programmed to provide the cleaning parameters, wherein at least one of the cleaning parameters is determined such that a percentage of damaged features as a result of the imparting sonic energy is lower than a predetermined threshold.

Abstract: A system for controlling damages in cleaning a semiconductor wafer comprising features of patterned structures, the system comprising: a wafer holder for temporary restraining a semiconductor wafer during a cleaning process; an inlet for delivering a cleaning liquid over a surface of the semiconductor wafer; a sonic generator configured to alternately operate at a first frequency and a first power level for a first predetermined period of time and at a second frequency and a second power level for a second predetermined period of time, to impart sonic energy to the cleaning liquid, the first predetermined period of time and the second predetermined period of time consecutively following one another; and a controller programmed to provide the cleaning parameters, wherein at least one of the cleaning parameters is determined such that a percentage of damaged features as a result of the imparting sonic energy is lower than a predetermined threshold.