Patents by Inventor Lianhui CAI

Lianhui CAI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Phosphorus-containing silane compound, method of making the same, resin composition and article made therefrom
    Patent number: 11649340
    Abstract: A phosphorus-containing silane compound has a structure of SiR1(R2)n(R3)3-n, wherein R1 is a phenyl group, R2 is a vinyl group, R3 each independently is a structure of Formula (I) or Formula (II), and n is 1 or 2. Moreover, a method of making the phosphorus-containing silane compound, a resin composition including the phosphorus-containing silane compound and a resin additive and an article made from the resin composition are described. The article includes a prepreg, a resin film, a laminate or a printed circuit board, wherein one or more properties including Z-axis ratio of thermal expansion, copper foil peeling strength, inner resin flow, branch-like pattern, dielectric constant, dissipation factor and flame retardancy may be improved.
    Type: Grant
    Filed: December 1, 2021
    Date of Patent: May 16, 2023
    Assignee: ELITE ELECTRONIC MATERIAL (ZHONGSHAN) CO., LTD.
    Inventors: Zhilong Hu, Changyuan Li, Hongxia Peng, Lianhui Cai, Jianzhao Li
  • PHOSPHORUS-CONTAINING SILANE COMPOUND, METHOD OF MAKING THE SAME, RESIN COMPOSITION AND ARTICLE MADE THEREFROM
    Publication number: 20230126282
    Abstract: A phosphorus-containing silane compound has a structure of SiR1(R2)n(R3)3-n, wherein R1 is a phenyl group, R2 is a vinyl group, R3 each independently is a structure of Formula (I) or Formula (II), and n is 1 or 2. Moreover, a method of making the phosphorus-containing silane compound, a resin composition including the phosphorus-containing silane compound and a resin additive and an article made from the resin composition are described. The article includes a prepreg, a resin film, a laminate or a printed circuit board, wherein one or more properties including Z-axis ratio of thermal expansion, copper foil peeling strength, inner resin flow, branch-like pattern, dielectric constant, dissipation factor and flame retardancy may be improved.
    Type: Application
    Filed: December 1, 2021
    Publication date: April 27, 2023
    Inventors: Zhilong HU, Changyuan LI, Hongxia PENG, Lianhui CAI, Jianzhao LI
  • Low dielectric composite material and laminate and printed circuit board thereof
    Patent number: 9872382
    Abstract: The present invention belongs to the technical field of resin composite materials, in particular relates to a low dielectric composite material and a laminate and printed circuit board prepared therefrom. The composite material is obtained by adhering a low dielectric resin composition with phosphorus-containing flame retardant onto a substrate; the composition comprises the following components: (A) phosphorus-containing flame retardant; (B) vinyl compound. The phosphorus-containing flame retardant has a structure as shown in formula (I).
    Type: Grant
    Filed: July 7, 2015
    Date of Patent: January 16, 2018
    Assignee: Elite Electronic Material (Zhong Shan) Co., Ltd.
    Inventors: Changyuan Li, Chen-Yu Hsieh, Hao Chen, Lianhui Cai, Xiangnan Li
  • Low dielectric resin composition with phosphorus-containing flame retardant and preparation method and application thereof
    Patent number: 9867287
    Abstract: The invention belongs to the technical field of low dielectric resin compositions, and discloses a low dielectric resin composition with phosphorus-containing flame retardant and a prepreg, resin film, laminate and printed circuit board prepared therefrom. The composition comprises the following components: (A) phosphorus-containing flame retardant; (B) vinyl compound. The phosphorus-containing flame retardant has a structure as shown in formula (I).
    Type: Grant
    Filed: July 7, 2015
    Date of Patent: January 9, 2018
    Assignee: Elite Electronic Material (Zhong Shan) Co., Ltd.
    Inventors: Changyuan Li, Chen-Yu Hsieh, Hao Chen, Lianhui Cai, Xiangnan Li
  • LOW DIALECTRIC COMPOSITE MATERIAL AND LAMINATE AND PRINTED CIRCUIT BOARD THEREOF
    Publication number: 20160021739
    Abstract: The present invention belongs to the technical field of resin composite materials, in particular relates to a low dielectric composite material and a laminate and printed circuit board prepared therefrom. The composite material is obtained by adhering a low dielectric resin composition with phosphorus-containing flame retardant onto a substrate; the composition comprises the following components: (A) phosphorus-containing flame retardant; (B) vinyl compound. The phosphorus-containing flame retardant has a structure as shown in formula (I).
    Type: Application
    Filed: July 7, 2015
    Publication date: January 21, 2016
    Applicant: ELITE ELECTRONIC MATERIAL (ZHONG SHAN) CO., LTD.
    Inventors: Changyuan LI, Chen-Yu HSIEH, Hao CHEN, Lianhui CAI, Xiangnan LI
  • LOW DIELECTRIC RESIN COMPOSITION WITH PHOSPHORUS-CONTAINING FLAME RETARDANT AND PREPARATION METHOD AND APPLICATION THEREOF
    Publication number: 20160021740
    Abstract: The invention belongs to the technical field of low dielectric resin compositions, and discloses a low dielectric resin composition with phosphorus-containing flame retardant and a prepreg, resin film, laminate and printed circuit board prepared therefrom. The composition comprises the following components: (A) phosphorus-containing flame retardant; (B) vinyl compound. The phosphorus-containing flame retardant has a structure as shown in formula (I).
    Type: Application
    Filed: July 7, 2015
    Publication date: January 21, 2016
    Applicant: Elite Electronic Material (Zhong Shan) Co., Ltd.
    Inventors: Changyuan LI, Chen-Yu HSIEH, Hao CHEN, Lianhui CAI, Xiangnan LI