Patents by Inventor Lianji Jin

Lianji Jin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor device having a porous nickel plating part
    Patent number: 8816481
    Abstract: A semiconductor device which can reduce a heat stress to a solder layer while suppressing an increase of thermal resistance is provided. A semiconductor device includes a semiconductor element, a solder layer which is arranged on at least one surface of the semiconductor element and a lead frame which is arranged on the solder layer so that a porous nickel plating part is sandwiched between the lead frame and the solder layer. Compared with a case that the semiconductor element and the lead frame are jointed by a solder directly, an increased part of a thermal resistance of the solder junction is held down only to a part of the porous nickel plating part and a thermal resistance applied to the solder layer can be reduced.
    Type: Grant
    Filed: October 1, 2012
    Date of Patent: August 26, 2014
    Assignee: Panasonic Corporation
    Inventors: Keiko Ikuta, Lianji Jin, Takayuki Hirose, Toshiyuki Kojima, Norihito Tsukahara, Kohichi Tanda
  • SEMICONDUCTOR DEVICE, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
    Publication number: 20140054757
    Abstract: A semiconductor device which can reduce a heat stress to a solder layer while suppressing an increase of thermal resistance is provided. A semiconductor device includes a semiconductor element, a solder layer which is arranged on at least one surface of the semiconductor element and a lead frame which is arranged on the solder layer so that a porous nickel plating part is sandwiched between the lead frame and the solder layer. Compared with a case that the semiconductor element and the lead frame are jointed by a solder directly, an increased part of a thermal resistance of the solder junction is held down only to a part of the porous nickel plating part and a thermal resistance applied to the solder layer can be reduced.
    Type: Application
    Filed: October 1, 2012
    Publication date: February 27, 2014
    Applicant: Panasonic Corporation
    Inventors: Keiko Ikuta, Lianji Jin, Takayuki Hirose, Toshiyuki Kojima, Norihito Tsukahara, Kohichi Tanda