Abstract: An embedded terminals remote online development system is divided into three parts: an embedded terminal, a cloud forwarding platform and an IDE. Under remote online development, the cloud forwarding platform establishes a communication connection with the IDE through the Internet and establishes a connection with a communication module of the embedded terminal through a communication base station, so that the communication between the IDE and the embedded terminal is completed. To be compatible with a local development mode, it is also possible to establish a connection between the IDE and the embedded terminal in a wired manner such as serial communication, to realize local online development.

Abstract: The invention discloses a remote software debugging method for embedded terminals, making it possible to reduce additional hardware dependencies and storage space occupation based on a CoreSight debugging framework and a dynamic command system. Series communication is used as a lead study to reduce the pre-exploration difficulty of complex communication modules and facilitate subsequent extraction of the commonalities of the communication modules. An FPB unit in CoreSight debugging framework provides a basis for setting and responding to breakpoints, debugging information for the breakpoints can be extracted and output by means of debug monitoring exceptions, and dynamic commands are used as carriers of overall functions to fulfill rich debugging functions such as starting and exiting of a debugging mode, setting and cancelling of breakpoints and control over program running state.

Abstract: An embodiment of the present invention provides a picture processing method in an embedded system. The picture processing method includes: performing a bit setting operation on an input/output register corresponding to a communication GPIO port of a camera module in the embedded system, so as to improve a picture collection speed of the camera module; compressing a collected picture using a preset picture compression algorithm and transmitting the compressed picture to a picture preprocessing unit in the embedded system; and filtering out, by the picture preprocessing unit, a picture background using a preset filtering algorithm to obtain picture features of a target object in the picture. With the picture processing method, requirements for an occupied memory resource are balanced while a picture collection speed and a picture data processing speed are increased.

Abstract: An embodiment of the present invention provides a picture processing method in an embedded system. The picture processing method includes: performing a bit setting operation on an input/output register corresponding to a communication GPIO port of a camera module in the embedded system, so as to improve a picture collection speed of the camera module; compressing a collected picture using a preset picture compression algorithm and transmitting the compressed picture to a picture preprocessing unit in the embedded system; and filtering out, by the picture preprocessing unit, a picture background using a preset filtering algorithm to obtain picture features of a target object in the picture. With the picture processing method, requirements for an occupied memory resource are balanced while a picture collection speed and a picture data processing speed are increased.

Abstract: A multi-chip compatible compiling method includes: extracting common characteristic information of Makefiles; configuring variable attribute information of the Makefiles; obtaining a universal Makefile template for multiple chips according to the common characteristic information and the variable attribute information of the Makefiles; traversing a project to be compiled in the universal Makefile template by a compilation module, recording path information of a dependency file of the project to be compiled, replacing a variable value in the universal Makefile template, and determining automation configuration information of the universal Makefile template; invoking an incremental compilation mechanism of a Make tool according to the automation configuration information of the universal Makefile template to obtain a target Makefile of the project to be compiled; and processing the target Makefile by rule information and pseudo-target tag information in the Makefiles to obtain an executable file generated by co

Abstract: A multi-chip compatible compiling method includes: extracting common characteristic information of Makefiles; configuring variable attribute information of the Makefiles; obtaining a universal Makefile template for multiple chips according to the common characteristic information and the variable attribute information of the Makefiles (S130); traversing a project to be compiled in the universal Makefile template by a compilation module, recording path information of a dependency file of the project to be compiled, replacing a first variable value in the universal Makefile template, and determining automation configuration information of the universal Makefile template (S140); invoking an incremental compilation mechanism of a Make tool according to the automation configuration information of the universal Makefile template to obtain a target Makefile of the project to be compiled (S150); and processing the target Makefile by rule information and pseudo-target tag information in the Makefiles to obtain an exec

Abstract: An STL model slicing method includes: reading and loading an STL model; obtaining a first slice plane; according to a first set thickness, making the first slice plane be horizontally tangential to an STL model to obtain a first profile curve, which is a profile curve of a tangent plane of the STL model and the first slice plane; determining whether the profile curve contains a physical portion of the STL model; if the profile curve contains the physical portion of the STL model, filling the physical portion with white to obtain a white portion; determining a non-physical portion in the profile curve according to the physical portion; filling the non-physical portion with black to form a mask of the tangent plane; and projecting the mask onto a liquid photosensitive resin by means of a first 3D printer, and then curing the white portion to be a first cured profile.